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Patent # Description
2019/0044072 CONDENSED-CYCLIC COMPOUND AND ORGANIC LIGHT-EMITTING DEVICE INCLUDING THE SAME
A condensed cyclic compound and an organic light-emitting device, the compound being represented by Formula 1: ##STR00001##
2019/0044071 CARBAZOLES WITH TWO DIBENZOFURAN OR DIBENZOTHIOPHENE SUBSTITUENTS
The present invention relates to carbazoles having two dibenzofuran or dibenzothiophene substituents, and to electronic devices, especially organic...
2019/0044070 VAPOR DEPOSITION MASK MANUFACTURING METHOD, VAPOR DEPOSITION MASK, AND ORGANIC SEMICONDUCTOR ELEMENT...
A method for manufacturing a vapor deposition mask including a resin layer, and a magnetic metal layer formed on the resin layer, the method including the...
2019/0044069 METHOD FOR PRODUCING RESIN FILM HAVING FINE PATTERN, METHOD FOR PRODUCING ORGANIC EL DISPLAY DEVICE, BASE FILM...
A method for producing a resin film by using a resin material and accurately forming a fine pattern as a vapor deposition mask or an optical element, a method...
2019/0044068 MASK PLATE
The present invention provides a mask plate, which comprises an alignment region for obtaining a default reflectance under a certain intensity illumination for...
2019/0044067 FORMULATION OF AN ORGANIC FUNCTIONAL MATERIAL
The present invention relates to formulations containing at least one organic functional material and at least a first organic solvent, wherein said first...
2019/0044066 WAFER-SCALE INTEGRATION OF VACANCY CENTERS FOR SPIN QUBITS
Embodiments of the present disclosure propose two methods for integrating vacancy centers (VCs) on semiconductor substrates for forming VC-based spin qubit...
2019/0044065 RESISTIVE RANDOM-ACCESS MEMORY (RRAM) CELL WITH RECESSED BOTTOM ELECTRODE SIDEWALLS
Various embodiments of the present application are directed towards an integrated circuit comprising a resistive random-access memory (RRAM) cell with recessed...
2019/0044064 RESISTIVE RANDOM ACCRESS MEMORY CONTAINING A CONFORMAL TITANIUM ALUMINUM CARBIDE FILM AND METHOD OF MAKING
A plurality of embodiments for ReRAM devices and method of making are described. According to one embodiment, the ReRAM device includes a first electrode film...
2019/0044063 NON-VOLATILE MEMORY STRUCTURES AND DEVICES
A memory cell can include a chalcogenide material having a narrowed end. A conductive material can be positioned at the narrowed end of the chalcogenide...
2019/0044062 TIP-CONTACT CONTROLLED THREE DIMENSIONAL (3D) VERTICAL SELF SELECT MEMORY
A variable resistance memory cell with a wide difference ("window") between threshold voltages is provided. The window between threshold voltages is increased...
2019/0044061 MEMORY CELLS HAVING INCREASED STRUCTURAL STABILITY
A memory cell can include a top lamina layer, a bottom lamina layer, and a phase change material (PCM) layer between the top lamina layer and the bottom lamina...
2019/0044060 PHASE CHANGE MEMORY STRUCTURES AND DEVICES
A phase change memory (PCM) cell can include a PCM layer. A first electrode and a second electrode disposed on opposite sides of the PCM layer. The first...
2019/0044059 STORAGE ELEMENT AND MEMORY
A storage element includes a storage layer, a fixed magnetization layer, a spin barrier layer, and a spin absorption layer. The storage layer stores...
2019/0044058 TUNNEL MAGNETIC RESISTANCE ELEMENT AND METHOD FOR MANUFACTURING SAME
A tunnel magnetic resistance element includes the following, a fixed magnetic layer with a fixed direction of magnetization, a free magnetic layer in which the...
2019/0044057 HALL ELEMENT MODULE
The present invention provides a Hall element module for achieving miniaturization. A Hall element module includes a Hall element having an element surface and...
2019/0044056 MAGNETIC TUNNEL JUNCTION STRUCTURE WITH PERPENDICULAR MAGNETIC ANISOTROPY AND MAGNETIC ELEMENT INCLUDING THE SAME
Disclosed herein are a magnetic tunnel junction (MTJ) structure with perpendicular magnetic anisotropy (PMA) and a magnetic element including the same. The MTJ...
2019/0044055 ELECTROMECHANICAL TRANSDUCER, LIQUID DISCHARGE HEAD, LIQUID DISCHARGE APPARATUS, AND METHOD FOR MANUFACTURING...
An electromechanical transducer includes an electromechanical transducer film of laminated layers including a perovskite-type complex oxide represented by a...
2019/0044054 PIEZOELECTRIC MATERIAL, PIEZOELECTRIC ELEMENT, VIBRATION WAVE MOTOR, OPTICAL APPARATUS, AND ELECTRONIC APPARATUS
A piezoelectric material which is low in load on the environment, and also satisfies both the requirements of a high piezoelectric constant and a high...
2019/0044053 MULTILAYER PIEZOELECTRIC ELEMENT, PIEZOELECTRIC VIBRATION APPARATUS, AND ELECTRONIC DEVICE
A multilayer piezoelectric element includes a ceramic body formed by a piezoelectric ceramic, and having first and second end face facing a longitudinal...
2019/0044052 MECHANISMS FOR PRE-STRETCHING ELECTRO-ACTIVE POLYMERS BY A PRE-DETERMINED AMOUNT AND METHODS OF USE THEREOF
In some embodiments, the present invention is directed to an exemplary inventive method having steps of: providing at least one housing having a pre-determined...
2019/0044051 VERTICAL FLUX BIAS LINES COUPLED TO VERTICAL SQUID LOOPS IN SUPERCONDUCTING QUBITS
Embodiments of the present disclosure relate to quantum circuit assemblies implementing superconducting qubits, e.g., transmons, in which SQUID loops and...
2019/0044050 FIN STRAIN IN QUANTUM DOT DEVICES
Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include:...
2019/0044049 GATE ARRANGEMENTS IN QUANTUM DOT DEVICES
Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include:...
2019/0044048 SIDEWALL METAL SPACERS FOR FORMING METAL GATES IN QUANTUM DEVICES
Disclosed herein are fabrication techniques for providing metal gates in quantum devices, as well as related quantum devices. For example, in some embodiments,...
2019/0044047 PACKAGE SUBSTRATES WITH TOP SUPERCONDUCTOR LAYERS FOR QUBIT DEVICES
An exemplary superconducting qubit device package includes a qubit die housing a superconducting qubit device that includes at least one resonator, and a...
2019/0044046 QUANTUM CIRCUIT ASSEMBLIES WITH VERTICALLY-STACKED PARALLEL-PLATE CAPACITORS
Various embodiments of the present disclosure present quantum circuit assemblies implementing vertically-stacked parallel-plate capacitors. Such capacitors...
2019/0044045 DONOR- OR ACCEPTOR-BASED SPIN QUBITS WITH ISOTOPICALLY PURIFIED MATERIALS
Embodiments of the present disclosure describe use of isotopically purified materials in donor- or acceptor-based spin qubit devices and assemblies. An...
2019/0044044 REDUCING CROSSTALK FROM FLUX BIAS LINES IN QUBIT DEVICES
Embodiments of the present disclosure describe two approaches to providing flux bias line structures for superconducting qubit devices. The first approach,...
2019/0044043 THERMOELECTRIC CONVERSION ELEMENT AND METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION ELEMENT
A thermoelectric conversion element includes a laminated body including a plurality of first thermoelectric conversion parts, a plurality of second ...
2019/0044042 THERMOELECTRIC CONVERSION MODULE AND THERMOELECTRIC CONVERSION DEVICE
A thermoelectric conversion module in which a plurality of P-type thermoelectric conversion elements and N-type thermoelectric conversion elements, which are...
2019/0044040 HIGH DENSITY PIXELATED-LED CHIPS AND CHIP ARRAY DEVICES
Pixelated-LED chips and related methods are disclosed. A pixelated-LED chip includes an active layer with independently electrically accessible active layer...
2019/0044039 LIGHT EMITTING DEVICE PACKAGE
A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive...
2019/0044038 METHOD OF MANUFACTURING A LIGHT EMITTING DEVICE
A Light Emitting Device (LED) that has increased reliability and efficiency. Specifically, the LED may be formed using Atomic Layer Deposition to improve the...
2019/0044037 CERAMIC PLATE, PRODUCING METHOD THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE
A ceramic plate having a flat plate shape includes a cut-out portion that is cut out inwardly from a peripheral end surface. An end surface defining the...
2019/0044036 LED PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip...
2019/0044035 WAVELENGTH CONVERSION MEMBER, METHOD FOR PRODUCING SAME, AND LIGHT-EMITTING DEVICE
Provided is a wavelength conversion member that is less likely to cause deformation or breakage due to thermal expansion and has an excellent light extraction...
2019/0044034 STABLE QUANTUM DOT EXTRUSION FILM
A quantum dot film includes at least one extruded polymer layer, the at least one extruded polymer layer including a plurality of stabilized quantum dots. The...
2019/0044033 Component Having Boundary Element
A component having a boundary element is disclosed. In an embodiment a component comprises a semiconductor chip, a housing and a reflective layer, wherein the...
2019/0044032 LIGHT-EMITTING SEMICONDUCTOR CHIP AND OPTOELECTRONIC COMPONENT
A light-emitting semiconductor chip comprises: a radiation-transmissive substrate, an epitaxially grown semiconductor layer sequence on a main surface of the...
2019/0044031 OPTOELECTRONIC SEMICONDUCTOR CHIP
An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a semiconductor body of semiconductor...
2019/0044030 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE
Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first...
2019/0044029 MUTILAYER STRUCTURE CONTAINING A CRYSTAL MATCHING LAYER FOR INCREASED SEMICONDUCTOR DEVICE PERFORMANCE
A multilayer structure comprising a crystal matching layer deposited on a substrate. The crystal matching layer is capable of being used as an ohmic contact,...
2019/0044028 METHODS AND DEVICES FOR LIGHT EXTRACTION FROM A GROUP III-NITRIDE VOLUMETRIC LED USING SURFACE AND SIDEWALL...
A method of fabricating LEDs from a wafer comprising a substrate and epitaxial layers and having a substrate side and a epitaxial side, said method comprising:...
2019/0044027 VERTICAL TYPE LIGHT EMITTING DIODE
Disclosed herein is a vertical type light emitting diode having a mesa including a groove. The light emitting diode includes: a support substrate; a first...
2019/0044026 Light-Emitting Diode
A light-emitting diode includes an epitaxial-laminated layer, including an n-type ohmic contact layer; a first n-type transition layer; a second n-type...
2019/0044025 MANUFACTURING METHOD OF QUANTUM DOT, LIGHT-EMITTING MATERIAL, LIGHT-EMITTING DEVICE, AND DISPLAY APPARATUS
A manufacturing method of a quantum dot, a light-emitting material, a light-emitting device, and a display apparatus are provided. The manufacturing method of...
2019/0044024 LIGHT EMITTING DIODE DEVICE AND METHOD FOR THE SAME
A light emitting device includes: a substrate; a first electrode and a second electrode provided at a distance from each other on the substrate and extending...
2019/0044023 METHODS FOR MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and...
2019/0044022 LIGHT EMITTING ELEMENT
This invention discloses a light emitting element to solve the problem of lattice mismatch and inequality of electron holes and electrons of the conventional...
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