Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2019/0057918 CHIP STRUCTURE INCLUDING HEATING ELEMENT
A chip structure is provided. The chip structure includes: a first lower chip structure; and an upper chip structure on the first lower chip structure and...
2019/0057917 ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME
An electronic package and a method of fabricating the same are provided. The method includes disposing an electronic component on a first side of an...
2019/0057916 Semiconductor Device and Method of Manufacture
A device includes a substrate with a die over the substrate. A molding compound surrounds the die and includes a structural interface formed along a peripheral...
2019/0057915 HYBRID MICROELECTRONIC SUBSTRATES
Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a...
2019/0057914 POWER MODULE AND POWER CONVERSION APPARATUS
According to the present invention, a power module includes an insulating substrate, a semiconductor device provided on the insulating substrate, an internal...
2019/0057913 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Provided is a semiconductor device having a pad on a semiconductor chip, a first passivation film formed over the semiconductor chip and having an opening...
2019/0057912 Interposer Test Structures and Methods
An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and...
2019/0057911 METHOD FOR FABRICATING ELECTRONIC PACKAGE
An electronic package is provided, which includes: a first circuit structure; a plurality of first electronic elements disposed on a surface of the first...
2019/0057910 METROLOGY SYSTEMS FOR SUBSTRATE STRESS AND DEFORMATION MEASUREMENT
Embodiments of the disclosure provide a metrology system. In one example, a metrology system includes a laser source adapted to transmit a light beam, a lens...
2019/0057909 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
A semiconductor structure includes a substrate and a CMOS structure. The CMOS structure includes a PMOS structure and a NMOS structure. The PMOS structure...
2019/0057908 METHOD OF FABRICATING A FINFET DEVICE
In an embodiment, a method for fabricating a FinFET device includes providing a semiconductor substrate, etching the semiconductor substrate to form dummy fins...
2019/0057907 SEMICONDUCTOR DEVICE INCLUDING CONTACT STRUCTURE
A semiconductor device including a contact structure is provided. The semiconductor device includes an isolation region defining a lower active region. First...
2019/0057906 SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF
A semiconductor arrangement and method of forming the same are described. A semiconductor arrangement includes a third metal connect in contact with a first...
2019/0057905 METHOD FOR MANUFACTURING DUAL FINFET DEVICE
In a method for manufacturing a semiconductor device, a substrate is provided. A hard mask and a mask layer are formed on a first region and a second region of...
2019/0057904 POLY GATE EXTENSION DESIGN METHODOLOGY TO IMPROVE CMOS PERFORMANCE IN DUAL STRESS LINER PROCESS FLOW
An integrated circuit and method with dual stress liners and with NMOS transistors with gate overhang of active that is longer than the minimum design rule and...
2019/0057903 3D SEMICONDUCTOR DEVICE AND SYSTEM
A 3D semiconductor device, the device including: a first layer including a first single crystal transistor; a second layer including second transistors; a...
2019/0057902 DICING METHOD AND LASER PROCESSING APPARATUS
According to one embodiment, a dicing method is provided. The dicing method includes detecting a first distance between a first portion of a substrate and a...
2019/0057901 METHOD AND APPARATUS FOR PROCESSING SEMICONDUCTOR DEVICE STRUCTURES
A method of processing a device wafer comprising applying a sacrificial material to a surface of a carrier wafer, adhering a surface of the device wafer to an...
2019/0057900 THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
Implementations of a method of forming a semiconductor package may include forming a plurality of notches into a first side of a wafer, the first side of the...
2019/0057898 THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
Disclosed is a three-dimensional semiconductor device including a horizontal semiconductor layer including a plurality of well regions having a first...
2019/0057897 SEMICONDUCTOR ON INSULATOR STRUCTURE COMPRISING A PLASMA OXIDE LAYER AND METHOD OF MANUFACTURE THEREOF
A method is provided for preparing a semiconductor-on-insulator structure comprising a silicon oxynitride layer having a gradient oxygen concentration.
2019/0057896 METHOD FOR MAKING A SEMICONDUCTOR DEVICE INCLUDING NON-MONOCRYSTALLINE STRINGER ADJACENT A SUPERLATTICE-STI...
A method for making a semiconductor device may include forming first and second spaced apart shallow trench isolation (STI) regions in a semiconductor...
2019/0057895 MANUFACTURING METHOD OF INTERCONNECT STRUCTURE
A manufacturing method of an interconnect structure including the following steps is provided. A dielectric layer is formed on a silicon layer, wherein an...
2019/0057894 SUBSTRATE PROCESSING APPARATUS AND METHOD FOR REMOVING SUBSTRATE FROM TABLE OF SUBSTRATE PROCESSING APPARATUS
To detach a substrate from a table without damaging the substrate. According to Embodiment 1, provided is a substrate processing apparatus including a table to...
2019/0057893 Material Handling Robot
An apparatus including a controller; a robot drive; a robot arm connected to the robot drive, where the robot arm has links including an upper arm, a first...
2019/0057892 WAFER PROCESSING METHOD
A wafer processing method includes: a protective member placing step of placing a protective member on the face side of a wafer; a shield tunnel forming step...
2019/0057891 Placing Ultra-Small or Ultra-Thin Discrete Components
A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete...
2019/0057890 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus according to an embodiment includes a cassette placing section, a processing unit, a transfer area, and an image capturing...
2019/0057889 PROCESSING TOOL HAVING A MONITORING DEVICE
Embodiments include systems, devices, and methods for monitoring etch or deposition rates, or controlling an operation of a wafer fabrication process. In an...
2019/0057888 BI-METAL FOIL FOR A BEAM INTENSITY/POSITION MONITOR, METHOD FOR DETERMINING MASS ABSORPTION COEFFICIENTS
The invention provides a beam intensity/positioning monitor substrate comprising a first metal foil in physical contact with a second metal foil. Also provided...
2019/0057887 APPARATUS AND METHOD FOR REAL-TIME SENSING OF PROPERTIES IN INDUSTRIAL MANUFACTURING EQUIPMENT
An apparatus and method for real-time sensing of properties in industrial manufacturing equipment are described. The sensing system includes first plural...
2019/0057886 Temperature measuring method and system for thin film solar cell process device
A temperature measuring method and system for a thin film solar cell process device are provided. The method includes: sending a temperature measuring...
2019/0057885 HIGH PRESSURE AND HIGH TEMPERATURE ANNEAL CHAMBER
Embodiments of the disclosure relate to an apparatus and method for annealing one or more semiconductor substrates. In one embodiment, a processing chamber is...
2019/0057884 CLEANING LIQUID SUPPLY UNIT, SUBSTRATE TREATING APPARATUS INCLUDING THE SAME, AND SUBSTRATE TREATING METHOD
Disclosed are relate to an apparatus for supplying a cleaning liquid to a substrate. The cleaning liquid supply unit includes a mixing container having a...
2019/0057883 WAFER CLEANING APPARATUS AND CLEANING METHOD USING THE SAME
The present invention provides a wafer cleaning apparatus including: a cleaning tank; and a cleaning unit installed to be capable of moving upward or downward...
2019/0057882 TWO-FLUID NOZZLE AND SUBSTRATE PROCESSING APPARATUS AND METHOD USING THE SAME
A nozzle includes a nozzle body having a hollow portion, and a mixing chamber and a discharge guide sequentially connected to the hollow portion, and an...
2019/0057881 IMPRINT APPARATUS, IMPRINTING METHOD, AND METHOD OF MANUFACTURING ARTICLE
An imprint apparatus that molds an imprint material on a substrate with a mold, the imprint apparatus including a applying device that includes a discharge...
2019/0057880 INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND PLANE
Many aspects of an IC package are disclosed. The IC package includes a substrate, an integrated circuit die, a vertical capacitor and a conductive layer. The...
2019/0057879 HIGH PRESSURE AND HIGH TEMPERATURE ANNEAL CHAMBER
Embodiments of the disclosure relate to an apparatus and method for annealing semiconductor substrates. In one embodiment, a batch processing chamber is...
2019/0057878 GAS COMPOSITION FOR DRY ETCHING AND DRY ETCHING METHOD
A silicon oxide film or a silicon nitride film is selectively etched by using an etching gas composition including a hydrofluorocarbon that has an unsaturated...
2019/0057877 METHOD OF CHEMICAL MECHANICAL POLISHING A SEMICONDUCTOR SUBSTRATE
A process for chemical mechanical polishing a substrate containing titanium nitride and titanium is provided comprising: providing a polishing composition,...
2019/0057876 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
A semiconductor device and fabrication method thereof are provided. The fabrication method include: providing a to-be-etched material layer; forming a...
2019/0057875 METHODS OF MEASURING ELECTRICAL CHARACTERISTICS DURING PLASMA ETCHING
Wafers processed by methods of plasma etching are disclosed. In one embodiment, a wafer is prepared by a process including positioning the wafer within a...
2019/0057874 MULTI-FACED MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
Implementations of a method of forming a semiconductor package may include forming electrical contacts on a first side of a wafer, applying a photoresist layer...
2019/0057873 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME, AND POWER CONVERTER
A semiconductor device that includes a semiconductor layer disposed on a semiconductor substrate, a first semiconductor region provided in an upper layer...
2019/0057872 METHOD OF FORMING A PATTERN
A method of forming a pattern includes forming a lower layer on a substrate, forming a mask pattern on the lower layer, the mask pattern extending in a first...
2019/0057871 METHOD OF FORMING FINE LINE PATTERNS OF SEMICONDUCTOR DEVICES
A method of forming fine line patterns of semiconductor devices includes: forming a plurality of lower linear core structures on at least one lower hard mask...
2019/0057869 LASER ANNEALING APPARATUS AND LASER ANNEALING METHOD FOR SUBSTRATE
A laser annealing apparatus including a carrying platform with a fixing surface, a laser source and a driving device. The laser source is configured to emit a...
2019/0057868 Managed Substrate Effects for Stabilized SOI FETs
Modified silicon-on-insulator (SOI) substrates having a trap rich layer, and methods for making such modifications. The modified regions eliminate or manage...
2019/0057867 Method and device for incorporating single diffusion break into nanochannel structures of fet devices
A method of forming a semiconductor device includes providing a starting structure including a substrate having thereon a plurality of gate regions alternately...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.