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Patent # Description
2019/0080960 Interconnection Structure and Manufacturing Method Thereof
An interconnection structure includes a first dielectric layer, a conductive element, a second dielectric layer, a bottom via, a dielectric spacer, and a top...
2019/0080959 METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
The present invention provides a method for fabricating a semiconductor structure. A multilayer structure on is formed a substrate, the multilayer structure...
2019/0080958 VIA FORMATION USING DIRECTED SELF-ASSEMBLY OF A BLOCK COPOLYMER
A method of forming an interconnect element includes forming a trench in a dielectric material. The trench has a width equal to twice a natural pitch of a...
2019/0080957 SEMICONDUCTOR ON INSULATOR STRUCTURE COMPRISING A BURIED HIGH RESISTIVITY LAYER
A cost effective process flow for manufacturing semiconductor on insulator structures is parallel is provided. Each of the multiple semiconductor-on-insulator...
2019/0080956 Arrays of Cross-Point Memory Structures, and Methods of Forming Arrays of Cross-Point Memory Structures
Some embodiments include a memory array having a first set of lines extending along a first direction, and a second set of lines over the first set of lines...
2019/0080955 Lift Pin Assembly, Substrate Support Apparatus and Substrate Processing Apparatus Having the Same
A lift pin assembly includes a lift pin having a first longitudinal axis substantially parallel with a first direction, a pin connection block combined with a...
2019/0080954 APPARATUS FOR MANUFACTURING SEMICONDUCTOR
A semiconductor manufacturing apparatus including a transport head that includes a vacuum chuck, the vacuum chuck being configured to vacuum-hold ...
2019/0080953 MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A manufacturing apparatus includes a first supporting section to support a first tape section. The first tape section has a first surface facing away from the...
2019/0080952 ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support...
2019/0080951 SUBSTRATE SUPPORT FOR REDUCED DAMAGE SUBSTRATE BACKSIDE
Embodiments of substrate supports and process chambers equipped with the same are provided. In some embodiments, a substrate support includes: a support body...
2019/0080950 SEMICONDUCTOR MANUFACTURING APPARATUS AND WAFER HOLDING METHOD
A semiconductor manufacturing apparatus includes an electrostatic chuck stage for configured to hold a wafer and supplying gas from a gas supply source to the...
2019/0080949 SOFT CHUCKING AND DECHUCKING FOR ELECTROSTATIC CHUCKING SUBSTRATE SUPPORTS
Methods for chucking and de-chucking a substrate from an electrostatic chucking (ESC) substrate support to reduce scratches of the non-active surface of a...
2019/0080948 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING PLASMA ETCHING APPARATUS
The inventive concept provides a method of manufacturing a semiconductor device using a plasma etching apparatus including an alignment chamber and a process...
2019/0080947 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
According to an embodiment, a substrate treatment apparatus includes a support unit, a silane coupler supplier, an organic functional group remover, and a...
2019/0080946 SUBSTRATE-STORING CONTAINER
An insulating wafer-storing container for storing substrates inside the container is provided in which at least one exterior surface of the container is formed...
2019/0080945 SUBSTRATE CARRIER AND SUBSTRATE CARRIER STACK
A substrate carrier stack includes substrate carriers of only one type which are stacked or stackable on each other and carry a respective plate-shaped...
2019/0080944 SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME
Disclosed are a substrate inspection apparatus and a substrate processing system. The substrate inspection apparatus includes a sensor module and a jig...
2019/0080943 MEASUREMENT DEVICE AND SEMICONDUCTOR MANUFACTURING SYSTEM INCLUDING THE SAME
A measurement device includes an emitter configured to emit an electromagnetic signal to an object to be measured. A first detector is disposed to measure a...
2019/0080942 CHIP PACKAGING APPARATUS AND METHOD THEREOF
Disclosed is a chip packaging apparatus. The chip packaging apparatus comprises: at least one chip supplying device; at least one chip processing device...
2019/0080941 COOLING UNIT, HEAT INSULATING STRUCTURE, AND SUBSTRATE PROCESSING APPARATUS
There is provided a cooling unit, comprising: an intake pipe provided for each of a plurality of zones and configured to supply a gas for cooling a reaction...
2019/0080940 SEMICONDUCTOR MANUFACTURING APPARATUS
A semiconductor manufacturing apparatus according to an embodiment irradiates a semiconductor substrate with laser to form modified regions along an intended...
2019/0080939 APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide,...
2019/0080938 SUBSTRATE LIQUID PROCESSING APPARATUS AND RECORDING MEDIUM
A substrate liquid processing apparatus A1 includes a processing liquid storage unit 38 configured to store a processing liquid therein; a processing liquid...
2019/0080937 SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING METHOD AND RECORDING MEDIUM
A substrate liquid processing apparatus A1 includes a processing tub 41 accommodating a processing liquid 43 and a substrate 8; a gas nozzle 70 discharging a...
2019/0080936 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM
There is provided a technique that includes: processing a substrate in a process vessel by supplying a processing gas to the substrate and exhausting the...
2019/0080935 PLASMA PROCESSING DEVICE
A plasma processing device includes a stage, a cluster generation machine, and a plasma generation machine. The stage is disposed in a processing chamber. The...
2019/0080934 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
There is provided a substrate processing apparatus including a rotary holding part configured to hold and rotate a substrate with a film formed on an upper...
2019/0080932 LIFT-OFF EMBEDDED MICRO AND NANOSTRUCTURES
A method includes encapsulating structures disposed on or over a surface of a substrate in an encapsulant. The method also includes separating the encapsulant...
2019/0080931 RESIN-SEALED VEHICLE-MOUNTED CONTROL DEVICE
An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted...
2019/0080930 LEAD-FRAME STRUCTURE, LEAD-FRAME, SURFACE MOUNT ELECTRONIC DEVICE AND METHODS OF PRODUCING SAME
A method of producing a lead-frame structure having two faces and exposing a treated silver surface on at least one of the two faces, the treated silver...
2019/0080929 WORKPIECE PROCESSING METHOD
In a method of an embodiment, a tungsten film is formed on a workpiece. The workpiece includes an underlying film and a mask provided on the underlying film....
2019/0080928 DRY ETCHING METHOD
A dry etching method, including: etching a silicon-containing thin film with a first gas by a first preset thickness; etching the silicon-containing thin film...
2019/0080927 POLISHING METHOD, AND POLISHING COMPOSITION AND METHOD FOR PRODUCING THE SAME
A polishing method according to the present invention, includes polishing a polishing object containing a silicon material by using a polishing composition...
2019/0080926 Methods of Surface Restoration for Nitride Etching
Provided is a method of modifying a surface of a substrate for improved etch selectivity of nitride etching. In an embodiment, the method includes providing a...
2019/0080925 SELECTIVE OXIDE ETCHING METHOD FOR SELF-ALIGNED MULTIPLE PATTERNING
A method of etching is described. The method includes forming a first chemical mixture by plasma-excitation of a first process gas containing an inert gas and...
2019/0080924 SELECTIVE NITRIDE ETCHING METHOD FOR SELF-ALIGNED MULTIPLE PATTERNING
A method of etching is described. The method includes forming a first chemical mixture by plasma-excitation of a first process gas containing an inert gas and...
2019/0080923 PLASMA ETCHING METHOD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
A plasma etching method includes performing a plasma etching using a gas containing C.sub.2F.sub.4. An emission intensity of CF.sub.2 is equal to or more than...
2019/0080922 Planarization Process and Apparatus
Methods and apparatus for planarization of a substrate. Material is dispensed onto the substrate that varies depending upon the substrate topography variation....
2019/0080921 Hybrid Double Patterning Method for Semiconductor Manufacture
A method of fabricating an integrated circuit (IC) with first and second different lithography techniques includes providing a layout of the IC having IC...
2019/0080920 METHOD FOR PREPARING A SEMICONDUCTOR PATTERN HAVING SEMICONDUCTOR STRUCTURE OF DIFFERENT LENGTHS
A method includes forming a plurality of first core features and one frame feature encircling the first core features. The first core features extend along a...
2019/0080919 SELECTIVE FILM FORMATION FOR RAISED AND RECESSED FEATURES USING DEPOSITION AND ETCHING PROCESSES
Embodiments of the invention provide a processing method for selective film formation for raised and recessed features using deposition and etching processes....
2019/0080918 A METHOD FOR SELECTIVE ETCHING OF NANOSTRUCTURES
The present invention relates to a method for selective etching of a nanostructure (10). The method comprising: providing the nanostructure (10) having a main...
2019/0080917 ETCHING METHOD
A method of selectively etching a first region R1 made of silicon oxide with respect to a second region R2 made of silicon nitride by performing a plasma...
2019/0080916 BOTTOM AND SIDE PLASMA TUNING HAVING CLOSED LOOP CONTROL
An apparatus for plasma processing a substrate is provided. The apparatus comprises a processing chamber, a substrate support disposed in the processing...
2019/0080915 METAL AND METAL-DERIVED FILMS
Embodiments described herein relate to methods and materials for fabricating semiconductor device structures. In one example, a metal film stack includes a...
2019/0080914 FEATURE FILL WITH MULTI-STAGE NUCLEATION INHIBITION
Described herein are methods of filling features with tungsten, and related systems and apparatus, involving inhibition of tungsten nucleation. In some...
2019/0080913 Method and Apparatus for Forming Silicon Oxide Film, and Storage Medium
There is provided a method of forming a silicon oxide film on a target surface on which a silicon oxide film and a silicon nitride film are exposed. The method...
2019/0080912 METHOD FOR PRODUCING WIRING STRUCTURE
Provided is a method for producing a wiring structural body provided with a wiring pattern, the method including a first step of forming an insulating layer on...
2019/0080911 WIRING STRUCTURE AND METHOD FOR PRODUCING WIRING STRUCTURE
Provided is a wiring structural body provided with a wiring pattern including a through-wiring pattern, the wiring structural body including: a silicon...
2019/0080910 LATTICE MATCHED EPITAXIAL OXIDE LAYER FOR A SUPER STEEP RETROGRADE WELL
Aspects of the present disclosure include a structure and method of making a semiconductor device. The method includes: providing a substrate, implanting a...
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