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Patent # Description
2019/0123095 SOURCE SENSITIVE OPTIC WITH RECONFIGURABLE CHIP-ON-BOARD LIGHT EMITTING DIODE ARRAY
Described herein is source sensitive optic that uses reconfigurable chip-on-board (CoB) light emitting diode (LED) arrays as light sources. In an...
2019/0123094 Display Panel With Board Mounted Power Supply
A modular display panel includes a first printed circuit board (PCB) having a first side and a second side. A plurality of LEDs are connected to the first side...
2019/0123093 SOLID-STATE IMAGING DEVICE, DRIVE METHOD THEREOF AND ELECTRONIC APPARATUS
A solid-state imaging device includes: plural photodiodes formed in different depths in a unit pixel area of a substrate; and plural vertical transistors...
2019/0123092 Vertically Integrated Image Sensor Chips and Methods for Forming the Same
A method includes bonding a Backside Illumination (BSI) image sensor chip to a device chip, forming a first via in the BSI image sensor chip to connect to a...
2019/0123091 METHOD APPLIED TO BJT PIXEL OF IMAGE SENSOR APPARATUS AND IMAGE SENSOR APPARATUS
A method applied to a BJT pixel of an image sensor apparatus includes: obtaining at least one of a surface quality signal of a first image sensed by the BJT...
2019/0123090 IMAGING APPARATUS AND ELECTRONIC DEVICE
Achieving an imaging apparatus capable of performing both photographing of visible light and photographing of invisible light with a normal solid-state imaging...
2019/0123089 PIXEL CELL AND ITS METHOD FOR APPLYING VOLTAGE GENERATED IN A PHOTOSENSOR TO A GATE CAPACITANCE AND ALTERNATELY...
A pixel cell, and a method of use thereof, the pixel cell including: an output, a photosensor configured to generate a first measuring current in a first...
2019/0123088 STACKED CMOS IMAGE SENSOR
A stacked complementary metal oxide semiconductor (CMOS) image sensor includes: a first semiconductor chip in which a plurality of pixels are in an upper area...
2019/0123087 SOLID-STATE IMAGING DEVICES HAVING FLAT MICROLENSES
A solid-state imaging device having flat microlenses is provided. The solid-state imaging device includes a semiconductor substrate having a plurality of...
2019/0123086 OPTICAL FILTER ARRAY
A device may include a filter array disposed on a substrate. The filter array may include a first mirror disposed on the substrate. The filter array may...
2019/0123085 PIXEL STRUCTURE OF IMAGE SENSOR AND METHOD OF FORMING SAME
A photo diode includes a pixel unit, a photo conversion layer, and a dielectric layer. The pixel unit includes a pair of pixels. The photo conversion layer is...
2019/0123084 IMAGE SENSORS WITH COLOR FILTER VARIATIONS
Color filters may affect imaging performance attributes such as low light sensitivity, color accuracy, and modulation transfer function (MTF). In an image...
2019/0123083 STRUCTURES AND METHODS OF CREATING CLEAR PIXELS
An image sensor may include an array of pixels having a color filter layer. The color filter layer may include colored elements and clear elements. The clear...
2019/0123082 FAN-OUT SENSOR PACKAGE AND OPTICAL-TYPE FINGERPRINT SENSOR MODULE INCLUDING THE SAME
A fan-out sensor package includes: a first connection member having a through-hole and including a first wiring layer; a sensor chip disposed in the...
2019/0123081 IMAGE SENSOR PACKAGING METHOD, IMAGE SENSOR PACKAGE AND LENS MODULE
An image sensor packaging method, an image sensor package and a lens module are disclosed. In the image sensor packaging method, plural image sensor dies are...
2019/0123080 SENSOR CIRCUITS FOR X-RAY IMAGERS
An active pixel sensor includes thin-film transistors (TFTs) fabricated on a glass substrate, the TFTs include a gate electrode patterned on the glass...
2019/0123079 SOLID-STATE IMAGING ELEMENT, SENSOR APPARATUS, AND ELECTRONIC DEVICE
The present disclosure relates to a solid-state imaging element, a sensor apparatus, and an electronic device capable of achieving better characteristics. A...
2019/0123078 SOLID-STATE IMAGING DEVICE
A solid-state imaging device has a pixel sharing unit, and the pixel sharing unit includes a plurality of pixel units each including a plurality of...
2019/0123077 SOLID-STATE IMAGING DEVICE, PRODUCTION METHOD OF THE SAME, AND IMAGING APPARATUS
A solid-state imaging device in which a pixel circuit formed on the first surface side of a semiconductor substrate is shared by a plurality of light reception...
2019/0123076 Pixel Sensing Module and Image Capturing Device
The present application provides a pixel sensing module comprising a pixel light-sensing unit, receiving light at a light receiving side and outputting a pixel...
2019/0123075 COLOR PIXEL AND RANGE PIXEL COMBINATION UNIT
The present disclosure is directed to an image sensor including a pixel array of both range pixels and color pixels. Each range pixel (or range pixel area) may...
2019/0123074 Semiconductor Device and Preparation Method thereof
The application disclosed a semiconductor image sensor and a preparation method thereof. The semiconductor image sensor includes: a semiconductor substrate, a...
2019/0123073 METHOD FOR MANUFACTURING ARRAY SUBSTRATE, ARRAY SUBSTRATE AND FINGERPRINT RECOGNITION DEVICE
A method for manufacturing an array substrate, an array substrate, and a fingerprint recognition device. The method includes: forming a plurality of...
2019/0123072 DISPLAY PANEL AND PIXEL CIRCUIT THEREOF
A display panel and a pixel circuit thereof are provided. The pixel circuit includes a first transistor, a second transistor, a capacitor, a storage capacitor...
2019/0123071 Display Panel and Display Device Including Display Panel
A display panel includes signal wires arranged in an active area, connection wires arranged in a non-display area adjacent to the active area electrically...
2019/0123070 CMOS Transistor and Method for Fabricating the Same, Display Panel and Display Device
The present disclosure provides a CMOS transistor and a method for fabricating the same, a display panel and a display device. The method includes: forming a...
2019/0123069 ARRAY SUBSTRATE, PREPARATION METHOD THEREOF AND DISPLAY PANEL
The present disclosure relates to array substrate, preparation method thereof and display panel. An array substrate comprises: a first thin film transistor and...
2019/0123068 SYSTEM OF FORMING DEBONDING LAYER, METHOD OF FORMING DEBONDING LAYER, SYSTEM OF MANUFACTURING DISPLAY DEVICE...
A system of forming a debonding layer includes a &bonding layer forming device configured to form a coating layer by coating a graphene oxide layer on a...
2019/0123067 ARRAY SUBSTRATE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing an array substrate assembly and an array substrate assembly manufactured by the method are disclosed. The method includes:...
2019/0123066 ARRAY SUBSTRATE, GATE DRIVING CIRCUIT AND DISPLAY PANEL
An array substrate, a gate driving circuit and a display panel are provided. The array substrate includes a first display area, a second display area and an...
2019/0123065 TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF
A transistor array panel is manufactured by a method that reduces or obviates the need for highly selective etching agents or complex processes requiring...
2019/0123064 TRANSISTOR DISPLAY PANEL
A transistor display panel including a substrate, a gate line disposed on the substrate and extending in a first direction, a gate electrode protruding from...
2019/0123063 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
A semiconductor integrated circuit device including standard cells including fin transistors includes, at a cell row end, a cell-row-terminating cell that does...
2019/0123062 INTEGRATED CIRCUIT AND CELL STRUCTURE IN THE INTEGRATED CIRCUIT
An integrated circuit includes a substrate and a plurality of standard cells. The standard cells are formed on the substrate, wherein each standard cell...
2019/0123061 THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
A three-dimensional memory device and a manufacturing method thereof are provided. The three-dimensional memory device includes a plurality of bottom control...
2019/0123060 Transistor, Semiconductor Device, Memory Device and Fabrication the Same
A transistor includes a substrate having a plurality of source/drain regions and a channel region between the source/drain regions, a gate, and a gate...
2019/0123059 INTEGRATED CIRCUITS WITH MEMORY CELLS AND METHOD FOR PRODUCING THE SAME
Integrated circuits and methods of producing the same are provided. In an exemplary embodiment, an integrated circuit includes a substrate and a fin extending...
2019/0123058 MEMORY DEVICE INCLUDING PASS TRANSISTORS IN MEMORY TIERS
Some embodiments include apparatuses and methods of using such apparatuses. One of the apparatuses includes a semiconductor material, a pillar extending...
2019/0123057 NOVEL NON-VOLATILE MEMORY AND METHOD FOR MANUFACTURING THE SAME
The present invention relates to a novel non-volatile memory and a method for manufacturing the same, wherein the novel non-volatile memory includes a...
2019/0123056 VERTICAL FIELD EFFECT TRANSISTOR INCLUDING INTEGRATED ANTIFUSE
A vertical field effect transistor (FET) includes a vertical semiconductor channel having a first end that contacts an upper surface of a substrate and an...
2019/0123055 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
A semiconductor memory device includes a substrate, a stacked body and a columnar part. The stacked body is provided above the substrate, and the columnar part...
2019/0123054 THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
A method for forming a 3D memory device is disclosed. The method includes: forming an alternating dielectric stack including multiple first dielectric layers...
2019/0123053 METHOD FOR PRODUCING A PILLAR-SHAPED SEMICONDUCTOR MEMORY DEVICE
A method for producing a pillar-shaped semiconductor device includes, forming a first semiconductor pillar, a second semiconductor pillar, and a third...
2019/0123052 STATIC RANDOM ACCESS MEMORY CELL AND STATIC MEMORY CIRCUIT
A 6T SRAM cell includes a substrate having thereon a first pull-up (PU-1) transistor, a first pull-down (PD-1) transistor, a second pull-up (PU-2) transistor,...
2019/0123051 INTEGRATED CIRCUIT DEVICES AND METHODS OF FABRICATING THE SAME
An integrated circuit device includes: a conductive line structure including a conductive line and an insulating capping pattern; and an insulating spacer...
2019/0123050 Method and Structure for FinFET Device
The present disclosure describes a fin-like field-effect transistor (FinFET). The device includes one or more fin structures over a substrate, each with...
2019/0123049 Method and Structure for FinFET Devices
A semiconductor device includes a substrate, an isolation structure over the substrate, and a first semiconductor layer over the substrate. At least a portion...
2019/0123048 Semiconductor Device and Method
A representative method for manufacturing fin field-effect transistors (FinFETs) includes steps of forming a plurality of fin structures over a substrate, and...
2019/0123047 Multi-Fin Device and Method of Making Same
A multiple-fin device includes a substrate and a plurality of fins formed on the substrate. Source and drain regions are formed in the respective fins. A...
2019/0123046 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes a first active structure on a substrate including a first epitaxial pattern, a second epitaxial pattern and a first channel...
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