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Patent # Description
2019/0122943 FILM FOR PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, DISPLAY DEVICE, AND METHODS OF FABRICATING THE FILM, THE...
A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip...
2019/0122942 Detecting the Cleanness of Wafer after Post-CMP Cleaning
A method includes performing Chemical Mechanical Polish (CMP) on a wafer, placing the wafer on a chuck, performing a post-CMP cleaning on the wafer, and...
2019/0122941 METHOD FOR EVALUATING QUALITY OF OXIDE SEMICONDUCTOR THIN FILM, METHOD FOR MANAGING QUALITY OF OXIDE...
A quality evaluation method for an oxide semiconductor thin film includes: selecting a peak value having a largest calculated value and a time constant for the...
2019/0122940 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A device includes a semiconductor fin, a first source/drain feature, a second source/drain feature, and a dielectric plug. The first source/drain feature...
2019/0122939 FinFET Devices with Unique Shape and the Fabrication Thereof
A semiconductor device includes a PMOS FinFET and an NMOS FinFET. The PMOS FinFET includes a substrate, a silicon germanium layer disposed over the substrate,...
2019/0122938 STATIC RANDOM-ACCESS MEMORY (SRAM) DEVICES
A static random-access memory (SRAM) device includes a base substrate including a PU transistor region and a PD transistor region adjacent to the PU transistor...
2019/0122937 NANOSHEET TRANSISTORS WITH DIFFERENT GATE DIELECTRICS AND WORKFUNCTION METALS
Semiconductor devices and methods for making the same include patterning a stack of layers that includes channel layers, first sacrificial layers between the...
2019/0122936 Self-Aligned Nanowire Formation Using Double Patterning
A method includes forming a pattern-reservation layer over a semiconductor substrate. The semiconductor substrate has a major surface. A first self-aligned...
2019/0122935 VERTICAL FIELD EFFECT TRANSISTOR HAVING U-SHAPED TOP SPACER
A method is presented for forming a semiconductor structure. The method includes forming a plurality of fins over a source/drain region, forming a first spacer...
2019/0122934 Method and Structure for FinFET Isolation
A method of forming a semiconductor device includes receiving a substrate having a fin extending from the substrate, first and second dummy gate stacks over...
2019/0122933 SEMICONDUCTOR MANUFACTURING METHOD
A method for manufacturing a semiconductor device includes forming first and second fins over a substrate, forming first and second dummy gate structures over...
2019/0122932 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
A semiconductor structure and a method for fabricating the semiconductor structure are provided. The method includes providing a base substrate. The base...
2019/0122931 INDUCTOR STRUCTURE FOR INTEGRATED CIRCUIT
The present disclosure, in some embodiments, relates to an integrated circuit having an inductor with one or more turns arranged along vertical planes that...
2019/0122930 Semiconductor Device and Method
A semiconductor device and method of manufacture are provided. In an embodiment a first semiconductor device and a second semiconductor device are formed...
2019/0122929 METHODS OF PACKAGING SEMICONDUCTOR DEVICES AND STRUCTURES THEREOF
Methods of packaging semiconductor devices and structures thereof are disclosed. In one embodiment, a method of packaging a semiconductor device includes...
2019/0122928 WAFER PROCESSING METHOD
A wafer processing method is a method of dividing a wafer in which a functional layer is laminated to a top surface of a substrate and a plurality of devices...
2019/0122927 Profile of Through Via Protrusion in 3DIC Interconnect
An interconnect structure for an integrated circuit, such as a three dimensional integrated circuit (3DIC), and a method of forming the same is provided. An...
2019/0122926 Self-Aligned Shielded Trench MOSFETs and Related Fabrication Methods
Structures and fabrication methods for increasing the density of trench transistor devices and the like. During fabrication of a trench transistor device, a...
2019/0122925 CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING CONDUCTIVE STRUCTURE
A conductive structure includes a substrate including a first dielectric layer formed thereon, at least a first opening formed in the first dielectric layer, a...
2019/0122924 METHOD AND APPARATUS FOR DEPOSITING COBALT IN A FEATURE
Methods and apparatus for depositing a cobalt layer in a feature, such as, a word line formed in a substrate, are provided herein. In some embodiments, method...
2019/0122923 SELECTIVE COBALT REMOVAL FOR BOTTOM UP GAPFILL
Exemplary methods for removing cobalt material may include flowing a chlorine-containing precursor into a processing region of a semiconductor processing...
2019/0122922 SELF-FORMING BARRIER PROCESS
A method is provided, including the following operations: performing a deposition process on a substrate, the deposition process configured to deposit a...
2019/0122921 SEMICONDUCTOR DEVICE INCLUDING A LEVELING DIELECTRIC FILL MATERIAL
The present disclosure relates to semiconductor devices and manufacturing techniques in which topography-related contact failures may be reduced by providing a...
2019/0122920 CONTACT HOLE STRUCTURE AND METHOD OF FABRICATING THE SAME
A method of fabricating a contact hole structure includes providing a substrate with an epitaxial layer embedded therein. Next, an interlayer dielectric is...
2019/0122919 SEMICONDUCTOR DEVICE INCLUDING A PASSIVATION SPACER AND METHOD OF FABRICATING THE SAME
A method of fabricating a semiconductor device includes providing a substrate, and forming an interlayered insulating layer on the substrate. The method...
2019/0122918 IMAGING DEVICE, METHOD OF MANUFACTURING IMAGING DEVICE, AND ELECTRONIC DEVICE
The present technology relates to an imaging device capable of preventing a decrease of sensitivity of the imaging device in a case where a capacitance element...
2019/0122917 SUPPLEMENTARY TOOL FOR CHIP TRANSFER DEVICE WITH REMOVAL TOOL AND TURNING TOOL
A device for transferring chips from a wafer to a placement head of an automatic placement machine. The device includes a removal tool rotatable about a first...
2019/0122916 VERTICAL SEMICONDUCTOR DIODE MANUFACTURED WITH AN ENGINEERED SUBSTRATE
A semiconductor diode includes an engineered substrate including a substantially single crystal layer, a buffer layer coupled to the substantially single...
2019/0122915 STACKING APPARATUS AND STACKING METHOD
A stacking apparatus that stacks a first substrate and a second substrate includes: a plurality of holding members that hold the first substrate, wherein the...
2019/0122913 MULTI-STEP IMAGE ALIGNMENT METHOD FOR LARGE OFFSET DIE-DIE INSPECTION
A die-die inspection image can be aligned using a method or system configured to receive a reference image and a test image, determine a global offset and...
2019/0122912 LASER MARKING FOCUS FEEDBACK SYSTEM
A method of focusing includes irradiating an object by directing radiation output by a radiating source through an objective lens, measuring a first intensity...
2019/0122911 OPTIMIZATING SEMICONDUCTOR BINNING BY FEED-FORWARD PROCESS ADJUSTMENT
One or more processors determine a predicted sorting bin of a semiconductor device, based on measurement and test data performed on the semiconductor device...
2019/0122910 Vehicle
A vehicle includes one or more travel portions each configured to travel along a rail track, a travel controller configured to perform an image recognition to...
2019/0122909 Method and Apparatus for Use in Wafer Processing
A method and apparatus for use in a wafer processing are disclosed. In an embodiment a includes providing the wafer on a receptacle, wherein the receptacle...
2019/0122908 METHOD AND DEVICE FOR SEVERING A MICROCHIP FROM A WAFER AND ARRANGING THE MICROCHIP ON A SUBSTRATE
Method and device for severing a microchip from a wafer and arranging the microchip on a substrate, wherein the microchip is contact-bonded to the free end of...
2019/0122907 LASER PROCESSING APPARATUS
A laser beam applying unit of a laser processing apparatus includes a laser oscillator adapted to emit a laser beam, a condenser adapted to focus the laser...
2019/0122906 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM
A substrate processing apparatus, a substrate processing method and a recording medium capable of shortening an etching processing time are provided. The...
2019/0122905 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM
A substrate processing apparatus includes a processing unit and a control unit. The processing unit is configured to perform an etching processing by immersing...
2019/0122904 PLANARIZING PROCESSING METHOD AND PLANARIZING PROCESSING DEVICE
A method for planarizing a workpiece includes bringing a surface of the workpiece and a surface of a pad having a catalyst layer at least on the surface...
2019/0122903 Plasma Treatment Apparatus and Method of Fabricating Semiconductor Device Using the Same
Provided are a plasma treatment apparatus and a method of fabricating semiconductor device using the same. The plasma treatment apparatus includes a chamber...
2019/0122902 ATOMIC LAYER ETCHING PROCESSES
Processing methods may be performed to remove unwanted materials from a substrate. The methods may include forming a remote plasma of an inert precursor in a...
2019/0122901 Release Film as Isolation Film in Package
A method includes forming a release film over a carrier, attaching a device over the release film through a die-attach film, encapsulating the device in an...
2019/0122900 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE AND LEAD FRAME
The method of the present invention improves quality and reliability of resin mold-type semiconductor devices. The method includes the steps of placing a lead...
2019/0122899 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of...
2019/0122898 Method for fabricating package structure
A package structure is provided, which includes: a frame having a cavity penetrating therethrough; a semiconductor chip received in the cavity of the frame,...
2019/0122897 Low Profile Electronic System Method and Apparatus
A method is provided. The method includes one or more of forming a cutout in a substrate, positioning a die comprising one or more bond pads in a coplanar...
2019/0122896 SEMICONDUCTOR TREATMENT COMPOSITION
A semiconductor treatment composition includes potassium, sodium, and a compound A represented by the formula (1), and has a potassium content M.sub.K (ppm)...
2019/0122895 Method of Fabricating Semiconductor Device with Reduced Trench Distortions
A method includes forming a material layer over a substrate, forming a first hard mask (HM) layer over the material layer, forming a first trench, along a...
2019/0122894 Method of Manufacturing Semiconductor Device
There is provided a method of manufacturing a semiconductor device by processing a substrate, which includes: embedding a polymer having a urea bond in a...
2019/0122893 DRY ETCHING APPARATUS
The present invention relates to a dry etching apparatus which can be applied regardless of materials. The dry etching apparatus may include: an anode unit; a...
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