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Patent # Description
2019/0131244 OHMIC METAL STRUCTURE FOR GaN DEVICE
An ohmic metal for GaN device comprises a diffusion barrier seed metal layer and a plurality of metal layers. The diffusion barrier seed metal layer is formed...
2019/0131243 INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
An integrated fan-out package including a die attach film, an integrated circuit component, an insulating encapsulation, and a redistribution circuit structure...
2019/0131242 FAN-OUT SEMICONDUCTOR PACKAGE
A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a...
2019/0131241 PACKAGE WITH FAN-OUT STRUCTURES
Structures and formation methods of chip packages are provided. The method includes disposing a semiconductor die over a carrier substrate. The method also...
2019/0131240 Forming Interlayer Dielectric Material by Spin-On Metal Oxide Deposition
A plurality of high-k metal gate (HKMG) structures is formed over a substrate. The (HKMG) structures are separated by a plurality of gaps. The HKMG structures...
2019/0131239 SEMICONDUCTOR DEVICE HAVING A MULTILAYER WIRING STRUCTURE
A semiconductor device having a plurality of first wirings (X-direction) which include a first power supply line and a second power supply line, a plurality of...
2019/0131238 ANTI-FUSE STRUCTURE
An anti-fuse structure includes an active area, a gate electrode over the active area, and a dielectric layer between the active area and the gate electrode....
2019/0131237 ANTI-FUSE STRUCTURE
An anti-fuse structure includes an active area, a gate electrode over the active area, and a dielectric layer between the active area and the gate electrode....
2019/0131236 SEMICONDUCTOR DEVICE WITH BARRIER LAYER
A semiconductor device includes an interconnect substrate, an interconnect trace disposed on an upper surface of the interconnect substrate, a semiconductor...
2019/0131235 STACKED VIA STRUCTURE AND METHOD OF FABRICATING THE SAME
A stacked via structure including a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer and a second...
2019/0131234 Power Semiconductor Module with Partially Coated Power Terminals and Method of Manufacturing Thereof
A power semiconductor module includes one or more power semiconductor dies attached to a first main face of a substrate, a plastic housing attached to the...
2019/0131233 SEMICONDUCTOR PACKAGE ASSEMBLY
A semiconductor package assembly includes a redistribution layer (RDL) structure, which RDL structure includes a conductive trace. A redistribution layer (RDL)...
2019/0131232 FAN-OUT SEMICONDUCTOR PACKAGE
A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a first recess portion and...
2019/0131231 SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
At least some embodiments of the present disclosure relate to a substrate for packaging a semiconductor device. The substrate includes a first dielectric layer...
2019/0131230 Monolithic 3D Integration Inter-Tier Vias Insertion Scheme and Associated Layout Structure
A 3D-IC includes a first tier device and a second tier device. The first tier device and the second tier device are vertically stacked together. The first tier...
2019/0131229 ALTERNATIVE SURFACES FOR CONDUCTIVE PAD LAYERS OF SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
Alternative surfaces for conductive pad layers of silicon bridges for semiconductor packages, and the resulting silicon bridges and semiconductor packages, are...
2019/0131228 SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME, AND METHODS OF MANUFACTURING THE...
A semiconductor device and a method of manufacturing the same, the device including a through-hole electrode structure extending through a substrate; a...
2019/0131227 DEVICE, METHOD AND SYSTEM FOR PROVIDING RECESSED INTERCONNECT STRUCTURES OF A SUBSTRATE
Techniques and mechanisms to facilitate connectivity between circuit components via a substrate. In an embodiment, a microelectronic device includes a...
2019/0131226 FAN-OUT SEMICONDUCTOR PACKAGE
A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a...
2019/0131224 FAN-OUT SEMICONDUCTOR PACKAGE
A semiconductor package includes a supporting member that has a cavity and includes a wiring structure connecting first and second surfaces opposing each...
2019/0131223 SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
Semiconductor package s and methods of forming the same are disclosed. The semiconductor package includes a chip, a redistribution circuit structure and a UBM...
2019/0131222 METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL IN MOLDING COMPOUND
Some embodiments relate to a semiconductor package. The package includes a substrate having an upper surface and a lower surface. A first chip is disposed over...
2019/0131221 SEMICONDUCTOR PACKAGE
A semiconductor package includes a semiconductor chip; a connection member having a first surface on which the semiconductor chip is disposed and a second...
2019/0131220 SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SAME, AND SEMICONDUCTOR PROCESS FOR...
A substrate structure includes a dielectric layer, a first circuit layer, a second circuit layer and at least one conductive pillar. The dielectric layer has a...
2019/0131219 HEAT SINK ATTACHED TO AN ELECTRONIC COMPONENT IN A PACKAGED DEVICE
A method for forming a packaged electronic device includes providing a substrate comprising a lead and a pad. The method includes attaching a thermally...
2019/0131218 Connection member with bulk body and electrically and thermally conductive coating
A connection member for connecting an electronic chip, wherein the connection member comprises a bulk body, and a coating at least partially coating the bulk...
2019/0131217 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device may include: a first and a second semiconductor elements; and a first and a second insulated substrates each including an insulator...
2019/0131216 Integrated Circuit (IC) Die Attached Between An Offset Lead Frame Die-Attach Pad And A Discrete Die-Attach Pad
An integrated circuit (IC) package, e.g., a power MOSFET package, may include a lead frame including (a) a main lead frame structure including a plurality of...
2019/0131215 Symmetric Input Circuitry for IC in Two-Pin Package
An integrated circuit device is disclosed, which integrated circuit device comprises at least a first external contact, a second external contact, and an input...
2019/0131214 SEMICONDUCTOR DEVICE
A semiconductor device includes an active layer, a source electrode, a drain electrode, a gate electrode, a first insulating layer, a first source pad, and a...
2019/0131213 SEMICONDUCTOR DEVICE MODULE
The present invention relates to a semiconductor device module which includes: a semiconductor device including a top electrode and a bottom electrode; a...
2019/0131212 FAN-OUT SEMICONDUCTOR PACKAGE MODULE
A fan-out semiconductor package module includes: a structure including a wiring member including wiring patterns, one or more first passive components disposed...
2019/0131211 COOLED ELECTRONICS PACKAGE WITH STACKED POWER ELECTRONICS COMPONENTS
An electronics package includes an electrically conducting support layer; at least one electrically conducting outer layer; at least two power electronics...
2019/0131210 SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME AND ELECTRIC POWER CONVERSION DEVICE
A semiconductor module includes: a semiconductor device having an upper surface electrode; a conductor plate joined to the upper surface electrode via a...
2019/0131209 SUBSTRATE WITH EMBEDDED ACTIVE THERMOELECTRIC COOLER
The present disclosure relates to a substrate that includes a substrate body and a thermoelectric cooler embedded in the substrate body. The thermoelectric...
2019/0131208 Multi-Layer Carrier System, Method for Producing a Multi-Layer Carrier System and Use of a Multi-Layer Carrier...
A multi-layer carrier system and a method for producing a multi-layer carrier system are disclosed. In an embodiment a multi-layer carrier system includes at...
2019/0131207 A HEAT SINK, A FILLER FOR A HEAT SINK AND METHODS THEREOF
A formulation for a heat sink, a filler composition for a heat sink, and methods of making thereof are provided, the filler composition comprising a first...
2019/0131206 Thermal Transfer/Management And EMI Shielding/Mitigation Solutions For Electronic Devices
Disclosed are exemplary embodiments of thermal transfer/management and electromagnetic interference (EMI) shielding/mitigation solutions, systems, and/or...
2019/0131205 IGBT MODULE ASSEMBLY
The disclosure relates to the field of electronic elements, and discloses an Insulated Gate Bipolar Transistor (IGBT) module assembly which comprises a cooling...
2019/0131204 MEMORY MODULE COOLER WITH VAPOR CHAMBER DEVICE CONNECTED TO HEAT PIPES
An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may...
2019/0131203 SEMICONDUCTOR PACKAGES INCLUDING A HEAT INSULATION WALL
A semiconductor package includes a first semiconductor chip and a second semiconductor chip which are disposed side-by-side on a surface of a package...
2019/0131202 INTERMEDIATE CONNECTOR, SEMICONDUCTOR DEVICE INCLUDING INTERMEDIATE CONNECTOR, AND METHOD OF MANUFACTURING...
An intermediate connector includes a power source bus bar as an elongated thin plate to be connected to each power source pad of a semiconductor integrated...
2019/0131201 NANO FLAKE DEFECT PASSIVATION METHOD AND ELECTRONIC DEVICE MANUFACTURED USING THE SAME
Provided is method of manufacturing a conductive film. The method includes forming a conductive film including a plurality of flakes on a substrate, wherein...
2019/0131200 REDISTRIBUTION CIRCUIT STRUCTURES AND METHODS OF FORMING THE SAME
Semiconductor packages and methods of forming the same are disclosed. The semiconductor package includes a plurality of chips, a first molding compound, a...
2019/0131199 SEMICONDUCTOR DEVICE
A semiconductor device may include a semiconductor element including a signal pad, an encapsulant encapsulating the semiconductor element and a lead including...
2019/0131198 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A semiconductor device includes: a wire including a first conductive member disposed at a semiconductor substrate and a second conductive member disposed at a...
2019/0131197 QUAD FLAT NO-LEAD PACKAGE
An electronic circuit can include a semiconductor chip having a thickness smaller than 160 .mu.m and a package with flush contacts having the chip encapsulated...
2019/0131196 Integrated Circuit with Dielectric Waveguide Connector Using Photonic Bandgap Structure
An encapsulated integrated circuit package is provided that includes an integrated circuit (IC) die. A radio frequency (RF) circuit on the IC die is operable...
2019/0131195 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor package device comprises a substrate, an electronic component and a protection layer. The substrate has a first surface and a second surface...
2019/0131194 INTERPOSER, METHOD OF MANUFACTURING INTERPOSER, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
An interposer includes a substrate having a mounting area and a test area, first conductive plugs separate from each other, the first conductive plugs being...
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