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Patent # Description
2019/0139954 Threshold Voltage Tuning For Fin-Based Integrated Circuit Device
Methods for tuning threshold voltages of fin-like field effect transistor devices are disclosed herein. An exemplary method includes forming a first opening in...
2019/0139953 ELECTRONIC DEVICE
In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an...
2019/0139952 CHIP PACKAGING METHOD
A chip packaging method includes followings steps. A plurality of first chips are disposed on a carrier, wherein each of the first chips has a first active...
2019/0139951 IMAGE MODULE PACKAGE
There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper...
2019/0139950 OPTICAL MODULATORS
An optoelectronic device. The optoelectronic device operable to provide a PAM-N modulated output, the device comprising: M optical modulators, M being an...
2019/0139949 SEMICONDUCTOR STRUCTURE AND ASSOCIATED MANUFACTURING METHOD
A semiconductor structure is disclosed. The semiconductor structure includes: a first light-emitting diode (LED) layer including a first LED of a first color...
2019/0139948 LED LIGHTING APPARATUS
A LED lighting apparatus includes a driver, a substrate, LED chips, a first fluorescent layer and a second fluorescent layer. The driver converts an external...
2019/0139947 ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND METHOD OF FABRICATION
An encapsulation cover for an electronic package includes a cover body having a frontal wall provided with at least one optical element allowing light to pass...
2019/0139945 METHOD AND APPARATUS FOR LIGHT DIFFUSION
A display apparatus includes a substrate and a plurality of LEDs. Each LED is attached to the substrate via conductive pads on a side of the LED. A diffuser...
2019/0139944 LAMP FOR VEHICLE AND VEHICLE
A lamp for a vehicle includes an array module comprising a plurality of micro Light Emitting Diodes (LEDs). The plurality of micro LEDs include a plurality of...
2019/0139943 WHITE LIGHT EMITTING DEVICES HAVING HIGH LUMINOUS EFFICIENCY AND IMPROVED COLOR RENDERING THAT INCLUDE...
A lighting apparatus a first group of at least one first solid state emitter, each first solid state emitter including a first light emitting diode ("LED")...
2019/0139942 PIXEL UNIT STRUCTURE AND MANUFACTURING METHOD THEREOF
A pixel unit structure, as well as a manufacturing method thereof, is provided. The pixel unit structure includes a display medium module and an active...
2019/0139941 PIXEL UNIT, PIXEL ARRAY, MULTIMEDIA DEVICE AND MANUFACTURING METHOD THEREOF
A pixel unit, a pixel array, a multimedia device, and a manufacturing method thereof, are provided. The pixel unit includes a display medium module and an...
2019/0139940 SEMICONDUCTOR PACKAGES
A planar dual die package includes a package substrate and first and second semiconductor dice disposed side by side on a first surface of the package...
2019/0139939 SEMICONDUCTOR PACKAGE
A semiconductor package may include a first redistribution layer (RDL); a first semiconductor chip on a top surface of the first RDL, the first semiconductor...
2019/0139938 LARGE CHANNEL INTERCONNECTS WITH THROUGH SILICON VIAS (TSVS) AND METHOD FOR CONSTRUCTING THE SAME
An electrical device that includes at least two active wafers having at least one through silicon via, and at least one unitary electrical communication and...
2019/0139937 INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING AN INTEGRATED FAN-OUT PACKAGE
In accordance with some embodiments of the present disclosure, an integrated fan-out (INFO) package includes a substrate, a molding compound, a buffer layer, a...
2019/0139936 MICROELECTRONIC DEVICE STACKS HAVING INTERIOR WINDOW WIREBONDING
A microelectronic package may be fabricated having a microelectronic die stack attached to a microelectronic substrate, wherein a first microelectronic die...
2019/0139935 THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Provided is a 3DIC structure includes a wafer, a die and a dielectric layer. The die is over and bonded to the wafer. The dielectric layer is over the wafer...
2019/0139934 SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS OF SEMICONDUCTOR DIES
A semiconductor device assembly includes a substrate having a plurality of external connections, a first shingled stack of semiconductor dies disposed directly...
2019/0139933 3D Chip-on-Wafer-on-Substrate Structure with Via Last Process
Disclosed herein is a package comprising a first redistribution layer (RDL) disposed on a first side of a first semiconductor substrate and a second RDL...
2019/0139932 METHOD OF MASS TRANSFERRING ELECTRONIC DEVICE
A method of mass transferring electronic devices includes following steps. A wafer is provided. The wafer includes a substrate and a plurality of electronic...
2019/0139931 SENSOR, METHOD AND SENSOR ARRANGEMENT
A sensor including a system-in-package module, wherein electrical contacts can be contact-connected by way of a mating connector. An associated method and an...
2019/0139930 CONDUCTIVE PASTE AND DIE BONDING METHOD
Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having...
2019/0139929 DETECTION OF FOREIGN PARTICLES DURING WIRE BONDING
A method of bonding wires onto surfaces, an apparatus and a computer program product are disclosed. The method of bonding wires onto surfaces, comprises the...
2019/0139928 DIE BONDING RESIN LAYER FORMING APPARATUS
A die bonding resin layer forming apparatus includes a liquid resin applying part including a chuck table that holds a wafer in such a manner that the back...
2019/0139927 ANISOTROPIC CONDUCTIVE FILM
An anisotropic conductive film which can be used as a standard product as long as no problems arise in anisotropic conductive connections, even in a case where...
2019/0139926 HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
Discussed generally herein are devices that include high density interconnects between dice and techniques for making and using those devices. In one or more...
2019/0139925 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A package structure includes an insulating encapsulation, at least one first chip, a redistribution layer and a bonding layer. The at least one first chip is...
2019/0139924 PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
A package structure including at least one semiconductor die, an insulating encapsulant, an insulating layer, conductive pillars, a dummy pillar, a first seed...
2019/0139923 STACKED RADIO FREQUENCY DEVICES
Various implementations enable management of parasitic capacitance and voltage handling of stacked integrated electronic devices. Some implementations include...
2019/0139922 Multi-Chip Package and Method of Formation
A method comprises applying a metal-paste printing process to a surface-mount device to form a metal pillar, placing a first semiconductor die adjacent to the...
2019/0139921 SEMICONDUCTOR DEVICE
A semiconductor device includes a substrate, a contact pad arranged in the substrate, a bump arranged on the contact pad to be electrically connected with the...
2019/0139920 FAN-OUT SEMICONDUCTOR PACKAGE
A fan-out semiconductor package includes: a first structure including a first semiconductor chip, a first encapsulant encapsulating at least portions of the...
2019/0139919 CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE
A method of manufacturing a bond pad structure may include depositing an aluminum-copper (Al--Cu) layer over a dielectric layer; and depositing an ...
2019/0139918 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A semiconductor device manufacturing method includes: preparing a semiconductor substrate including an electrode; forming a wire connected to the electrode;...
2019/0139917 MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
A micro-connection structure is provided. The micro-connection structure includes an under bump metallurgy (UBM) pad, a bump and an insulating ring. The UBM...
2019/0139916 PACKAGE STRUCTURES
A package structure includes at least one semiconductor chip, an insulating encapsulation, and a redistribution circuit structure. The semiconductor chip has...
2019/0139915 WIRELESS MODULE WITH ANTENNA PACKAGE AND CAP PACKAGE
Wireless modules having a semiconductor package attached to an antenna package and cap package are disclosed. The semiconductor package may have one or more...
2019/0139914 MICROWAVE IC WAVEGUIDE DEVICE MODULE
A microwave IC waveguide device module includes: a substrate having a throughhole; a microwave IC provided on or above the first face of the substrate; a...
2019/0139913 ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
An electronic package and a method for fabricating the same are provided. The method includes disposing an antenna substrate on a package structure through a...
2019/0139912 ANTENNA MODULE
An antenna module includes a fan-out semiconductor package including an IC, an encapsulant encapsulating at least a portion of the IC, a core member having a...
2019/0139911 Embedded Resistor-Capacitor Film for Fan Out Wafer Level Packaging
A panel type fan-out wafer level package with embedded film type capacitors and resistors is described. The package comprises a silicon die at a bottom of the...
2019/0139910 ZERO CAPACITANCE ELECTROSTATIC DISCHARGE DEVICES
In some examples, an electrostatic discharge (ESD) device includes a substrate layer, a transition layer positioned on the substrate layer, a plurality of...
2019/0139909 Physical Unclonable Functions in Integrated Circuit Chip Packaging for Security
In the invention described, magnetic field characteristics of randomly placed magnetized particles are exploited by using the magnetic field fluctuations...
2019/0139908 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes stacking a first substrate comprising a first surface having a semiconductor element and an opposing...
2019/0139907 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution...
2019/0139906 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
An object of the present invention is to obtain a semiconductor device having highly reliable bonding portions. The semiconductor device according to the...
2019/0139905 FLEXIBLE CIRCUIT BOARD, METHOD FOR MOUNTING THE SAME, AND DISPLAY DEVICE
A flexible circuit board, a display device and a method for mounting a flexible circuit board are disclosed. The flexible circuit board includes: a bendable...
2019/0139904 DIELECTRIC CRACK STOP FOR ADVANCED INTERCONNECTS
An interconnect level is provided on a surface of a substrate that has improved crack stop capability. The interconnect level includes at least one wiring...
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