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Patent # Description
2019/0139802 FRONT OPENING UNIFIED POD LOADING AND AIR FILLING SYSTEM
A front opening unified pod (FOUP) loading and air filling system comprises a FOUP loading device and an air filling device. The FOUP loading device is...
2019/0139801 WAFER CARRYING FORK, SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM, AND WAFER TRANSPORTING METHOD
A wafer carrying fork includes a fork body, a plurality of wafer suction holes, a plurality of gas purging elements, a plurality of gas purging pipes, a...
2019/0139800 3D IC BUMP HEIGHT METROLOGY APC
The present disclosure, in some embodiments, relates to a substrate metrology system. The substrate metrology system includes a substrate warpage measurement...
2019/0139799 METHOD OF LASER SCRIBING OF SEMICONDUCTOR WORKPIECE USING DIVIDED LASER BEAMS
This invention provides an effective and rapid method of laser processing for separating semiconductor devices formed on hard and solid substrates (6) with a...
2019/0139798 ENHANCEMENT OF YIELD OF FUNCTIONAL MICROELECTRONIC DEVICES
Described herein are techniques related to a semiconductor fabrication process that facilitates the enhancement of systemic conformities of patterns of the...
2019/0139797 METHODS AND DEVICES FOR PROCESS EDITING, ACQUISITION, PROCESS DATA PROTECTION FOR SOLAR CELL PRODUCTION APPARATUS
The present disclosure relates to methods and devices of process editing, acquisition and process data protection for solar cell production apparatus. The...
2019/0139796 MONITORING APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING THE SAME
An apparatus for manufacturing a semiconductor device is provided. The apparatus for manufacturing a semiconductor device may include a mass flow controller...
2019/0139795 TRANSFER SYSTEM FOR FLIPPING AND MULTIPLE CHECKING OF ELECTRONIC DEVICES
The present invention includes a transfer system for flipping and checking electronic devices. A first rotary device has a plurality of transfer heads...
2019/0139794 VACUUM PICK-UP HEAD FOR SEMICONDUCTOR CHIPS
To manufacture a device by picking and placing semiconductor devices from a carrier substrate to a target substrate using suction force, a subset of pick-up...
2019/0139793 ANNEALING SYSTEM AND METHOD
A system for annealing substrates is provided. The system includes a first boiler having an input coupled to a water source; a second boiler having an input...
2019/0139792 WAFER CONTAINER AND METHOD FOR HOLDING WAFER
Provided is a wafer container including a frame and at least a pair of the stents. The frame has opposite sidewalls. The at least a pair of the stents is...
2019/0139791 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM
A substrate processing apparatus includes a liquid film forming unit 16A configured to form a liquid film of a liquid for anti-drying on a substrate; a drying...
2019/0139790 DISPENSING ARM HEAD HAVING POINT OF DISPENSE RECIRCULATION MODE
A dispense arm device for controllably discharging a fluid onto a substrate includes a dispense head coupled to and contained within an arm portion of the...
2019/0139789 APPARATUS FOR IMPRINT LITHOGRAPHY COMPRISING A LOGIC ELEMENT CONFIGURED TO GENERATE A FLUID DROPLET PATTERN AND...
An apparatus for imprint lithography can include a logic element configured to generate a fluid droplet pattern of fluid droplets of a formable material to be...
2019/0139788 APPARATUS AND METHODS FOR PACKAGING SEMICONDUCTOR DIES
Aspects of the disclosure generally relate to methods of immobilizing die on a substrate. In one method one or more immobilization features are formed in a...
2019/0139787 INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
An integrated fan-out (InFO) package includes at least one die, a plurality of conductive structures, an encapsulant, an enhancement layer, and a...
2019/0139786 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
In one or more embodiments, a semiconductor package device includes a substrate, a trace, a structure, a barrier element and an underfill. The substrate has a...
2019/0139785 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device including a substrate, an insulating layer on the substrate and including a trench, at least one via structure penetrating the substrate...
2019/0139784 PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
A package structure including a semiconductor die, a redistribution layer and a plurality of conductive elements is provided. At least one joint of the joints...
2019/0139783 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
A semiconductor device having high reliability is provided. A first conductor is formed, a first insulator is formed over the first conductor, a second insulator...
2019/0139782 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
According to an embodiment, a nonvolatile semiconductor memory device comprises a plurality of conductive layers that are stacked in plurality in a first...
2019/0139781 PLASMA ETCHING METHOD
Etching stop which is caused by a metal released from a metal-containing mask can be avoided. A plasma etching method includes a protective film forming...
2019/0139780 ETCHING METHOD
An etching method is provided. A processing target object includes a first region made of silicon oxide and a second region made of silicon nitride. The second...
2019/0139779 Method of Conformal Etching Selective To Other Materials
Plasma processing methods that provide for conformal etching of silicon nitride while also providing selectivity to another layer are described. In one...
2019/0139778 INTEGRATING ATOMIC SCALE PROCESSES: ALD (ATOMIC LAYER DEPOSITION) AND ALE (ATOMIC LAYER ETCH)
Methods are provided for integrating atomic layer etch and atomic layer deposition by performing both processes in the same chamber or reactor. Methods involve...
2019/0139777 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A method includes forming a mandrel structure over a semiconductor substrate. A first spacer and a second spacer are formed alongside the mandrel structure. A...
2019/0139776 ASYMMETRICAL PLUG TECHNIQUE FOR GAN DEVICES
A method of forming one or more contact regions in a high-voltage field effect transistor (HFET) includes providing a semiconductor material, including a first...
2019/0139775 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device includes first and second FETs including first and second channel regions, respectively. The first and second FETs include first and...
2019/0139774 TRANSPARENT HALO FOR REDUCED PARTICLE GENERATION
Embodiments herein include a halo having varied conductance. In some embodiments, a halo surrounding a semiconductor workpiece may include a first side...
2019/0139773 METHOD OF THERMAL PROCESSING STRUCTURES FORMED ON A SUBSTRATE
The present invention generally describes one ore more methods that are used to perform an annealing process on desired regions of a substrate. In one...
2019/0139772 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A photoresist is applied to a front surface of a semiconductor wafer rotating at a predetermined rotational speed and a photoresist film having a predetermined...
2019/0139771 METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE
To manufacture an integrated circuit device, a diffusion buffer layer and a carbon-containing layer are sequentially formed on a plurality of fin-type active...
2019/0139770 Systems and Methods for a Tunable Electromagnetic Field Apparatus to Improve Doping Uniformity
A method includes receiving a semiconductor wafer into a chamber; generating a plasma within the chamber to accelerate particles toward the semiconductor...
2019/0139769 PRESSURIZING DEVICE AND PRESSURIZING METHOD
A pressurizing device includes: a mounting base; an upper mold which pressurizes the target object mounted on the mounting base from above; a heating lower...
2019/0139768 DIAMOND SEMICONDUCTOR SYSTEM AND METHOD
Disclosed herein is a new and improved system and method for fabricating diamond semiconductors. The method may include the steps of selecting a diamond...
2019/0139767 METHOD FOR PREPARING A SEMICONDUCTOR STRUCTURE
A method for preparing a semiconductor structure includes the following steps: providing a substrate including a first region and a second region defined...
2019/0139766 SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING THE SAME
The present disclosure provides a method for preparing a semiconductor structure including the following steps: Providing a substrate including a first region...
2019/0139765 TONE INVERSION INTEGRATION FOR PHASE CHANGE MEMORY
Embodiments of the invention are directed to methods and resulting structures for forming a storage element using phase change memory (PCM). In a non-limiting...
2019/0139764 FORMING A FIN CUT IN A HARDMASK
A method of fabricating a hard mask structure is provided. According to the method, a hard mask layer is disposed over a substrate. The hard mask layer...
2019/0139763 Method for Producing a Plurality of Semiconductor Chips Having a Mask Layer with Openings and Semiconductor...
A semiconductor chip is disclosed. In an embodiment a semiconductor chip includes a multiply-connected mask layer comprising openings, the openings completely...
2019/0139762 EPITAXIAL GROWTH OF DEFECT-FREE, WAFER-SCALE SINGLE-LAYER GRAPHENE ON THIN FILMS OF COBALT
A method for depositing a layer of graphene directly on the surface of a substrate, such as a semiconductor substrate is provided. Due to the strong adhesion...
2019/0139760 DIRAC SEMIMETAL STRUCTURE
Dirac semimetals, methods for modulating charge carrying density and/or band gap in a Dirac semimetal, devices including a Dirac semimetal layer, and methods...
2019/0139759 Integrated Circuits with Doped Gate Dielectrics
Examples of an integrated circuit with a gate structure and a method for forming the integrated circuit are provided herein. In some examples, a workpiece is...
2019/0139758 TRANSPARENT HALO ASSEMBLY FOR REDUCED PARTICLE GENERATION
Embodiments herein include a transparent halo assembly for reducing an amount of sputtered material to minimize particle defects impacting a workpiece. In some...
2019/0139757 METHODS OF FORMING SILICON OXIDE LAYER AND SEMICONDUCTOR STRUCTURE
Methods of forming a silicon oxide layer and a semiconductor structure are disclosed. The method of forming the silicon oxide layer includes the following...
2019/0139756 Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device, and Storage Medium
A substrate processing apparatus for processing a substrate to manufacture a semiconductor device, includes: a mounting table on which a substrate is mounted;...
2019/0139755 METHODS OF FORMING STAIRCASE-SHAPED CONNECTION STRUCTURES OF THREE-DIMENSIONAL SEMICONDUCTOR DEVICES
Provided is a staircase-shaped connection structure of a three-dimensional semiconductor device. The device includes an electrode structure on a substrate, the...
2019/0139754 STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH RESISTIVE ELEMENTS
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a first resistive element and a second...
2019/0139753 ULTRAVIOLET LAMP SYSTEMS AND METHODS OF OPERATING AND CONFIGURING THE SAME
An ultraviolet lamp system is provided. The ultraviolet lamp system includes: (a) a bulb; (b) at least one magnetron configured to emit microwave energy...
2019/0139752 APPARATUS FOR DETECTING CONSTITUENTS IN A SAMPLE AND METHOD OF USING THE SAME
An apparatus for detecting constituents in a sample includes first and second drift tubes defining first and second drift regions, and a controllable electric...
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