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Patent # Description
US-7,969,002 Integrated circuit packages incorporating an inductor and methods
Integrated circuit packages incorporating an inductor and methods for their fabrication. The lead frame used in packaging the integrated circuit includes a...
US-7,969,001 Method and system for intra-chip waveguide communication
Methods and systems for intra-chip waveguide communication are disclosed and may include configuring one or more waveguides in an integrated circuit and...
US-7,969,000 Semiconductor device
A semiconductor device having a plurality of chips is reduced in size. In HSOP (semiconductor device) for driving a three-phase motor, a first semiconductor...
US-7,968,999 Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive
A method of grounding a heat spreader/stiffener to a flip chip package comprising the steps of attaching an adhesive film to a substrate and attaching a...
US-7,968,998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
A semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and a plurality of leads which are segregated...
US-7,968,997 Semiconductor device
A semiconductor device includes a wring board having a first surface with external connection terminals and a second surface with internal connection terminals....
US-7,968,996 Integrated circuit package system with supported stacked die
An integrated circuit package system provides a leadframe having a short lead finger, a long lead finger, and a support bar. A first die is placed in the...
US-7,968,995 Integrated circuit packaging system with package-on-package and method of manufacture thereof
A method of manufacture an integrated circuit packaging system includes: providing a base substrate; mounting a first base integrated circuit over the base...
US-7,968,994 Memory modules and systems including the same
Provided is a memory module. The memory module may include a mounting substrate including a plurality of first substrate pads disposed on a top surface of the...
US-7,968,993 Stacked semiconductor device and semiconductor memory device
A stacked semiconductor device includes a first semiconductor element mounted on a wiring board and a second semiconductor element stacked on the first...
US-7,968,992 Multi-chip package structure and method of fabricating the same
A method of fabricating a multi-chip package structure is provided. In the method, a number of cavities are formed on a predetermined cutting line of a first...
US-7,968,991 Stacked package module and board having exposed ends
A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein...
US-7,968,990 Semiconductor device and method of fabricating the same
A method of fabricating a semiconductor device includes: mounting a semiconductor chip on a substrate; forming an upper connection terminal on a side of the...
US-7,968,989 Multi-package slot array
A multi-package module that includes a multi-layer interconnect structure, a housing structure attached to the multi-layer interconnect structure, and a...
US-7,968,988 Power semiconductor module having a thermally conductive base plate on which at least four substrates are...
The power semiconductor module (1) has a heat-conducting base plate (11) on which at least three substrates (2, 3, 4, 5, 6, 7) are placed, each substrate...
US-7,968,987 Carbon dioxide gettering for a chip module assembly
A chip module assembly includes a CO.sub.2 getter exposed through a gas-permeable membrane to a chip cavity of a chip module. One or more chips is/are enclosed...
US-7,968,986 Lid structure for microdevice and method of manufacture
A system and a method are described for forming features at the bottom of a cavity in a substrate. Embodiments of the systems and methods provide an infrared...
US-7,968,984 Universal pad arrangement for surface mounted semiconductor devices
An apparatus for coupling a plurality of surface mounted semiconductor device packages to a circuit board is provided. Each package including a semiconductor...
US-7,968,983 Semiconductor device
Provided is a semiconductor device in which a plurality of chips are packaged without increasing the thickness of the package. A plurality of semiconductor...
US-7,968,982 Thermal enhanced upper and dual heat sink exposed molded leadless package
A semiconductor package includes a semiconductor device 30 and a molded upper heat sink 10. The heat sink has an interior surface 16 that faces the...
US-7,968,981 Inline integrated circuit system
An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an...
US-7,968,980 Support member for mounting a semiconductor device, conductive materials, and its manufacturing method
A semiconductor device comprises a support member having a pair of first conductive materials and a pair of second conductive materials on an insulating...
US-7,968,979 Integrated circuit package system with conformal shielding and method of manufacture thereof
An integrated circuit package system includes: providing a substrate with an integrated circuit mounted thereover; mounting a structure, having ground pads,...
US-7,968,978 Microwave integrated circuit package and method for forming such package
A method for packaging a semiconductor device. The method includes: providing a dielectric layer over the semiconductor device; determining patterns and...
US-7,968,977 Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a...
US-7,968,976 Guard ring extension to prevent reliability failures
An embodiment of the present invention is a technique to prevent reliability failures in semiconductor devices. A trench is patterned in a polyimide layer over...
US-7,968,975 Metal wiring structure for integration with through substrate vias
An array of through substrate vias (TSVs) is formed through a semiconductor substrate and a contact-via-level dielectric layer thereupon. A metal-wire-level...
US-7,968,974 Scribe seal connection
A feedthrough in an IC scribe seal is disclosed. The feedthrough is structured to maintain isolation of components in the IC from mechanical damage and chemical...
US-7,968,973 Semiconductor for macro and micro frequency tuning, and antenna and frequency tuning circuit having the...
A semiconductor element for macro and micro frequency tuning, and an antenna and a frequency tuning circuit having the semiconductor element, are provided. The...
US-7,968,972 High-frequency bipolar transistor and method for the production thereof
A high-frequency bipolar transistor includes an emitter contact adjoining an emitter connection region, a base contact adjoining a base connection region, and a...
US-7,968,971 Thin-body bipolar device
A thin-body bipolar device includes: a semiconductor substrate, a semiconductor fin constructed over the semiconductor substrate, a first region of the...
US-7,968,970 Semiconductor device, method for manufacturing semiconductor device, and power amplifier element
A semiconductor device is presented, which includes a semiconductor substrate with a high concentration impurity of a first type conductivity and an epitaxial...
US-7,968,969 Electrical components for microelectronic devices
Electrical components for microelectronic devices and methods for forming electrical components. One particular embodiment of such a method comprises depositing...
US-7,968,968 Inductor utilizing pad metal layer
An inductor utilizing a pad metal layer. The inductor comprises a metal spiral, a metal bridge, and a metal interconnect. The metal bridge is formed with the...
US-7,968,967 One-time-programmable anti-fuse formed using damascene process
A semiconductor structure includes a semiconductor substrate, a power source, and a stacked structure over the semiconductor substrate and coupled to the power...
US-7,968,966 Semiconductor device with fuse and a method of manufacturing the same
In order to improve the reliability of a semiconductor device having a fuse formed by a Damascene technique, a barrier insulating film and an inter-layer...
US-7,968,965 Semiconductor device and method for fabricating the same
Embodiments relate to a semiconductor device and a method for fabricating the same. According to embodiments, a semiconductor device may include a first device,...
US-7,968,964 High density photodiodes
The present invention is a front-side contact, back-side illuminated (FSC-BSL) photodiode arrays and front-side illuminated, back-side contact (FSL-BSC)...
US-7,968,963 Photodiode array and image pickup device using the same
A photodiode array with reduced optical crosstalk and an image pickup device using it are provided. The photodiode array 10 according to the present invention...
US-7,968,962 Semiconductor fabrication method and system
A semiconductor device is disclosed. In one embodiment, a device includes a substrate having one or more vias and a carrier coupled to the substrate to form a...
US-7,968,961 Solid-state image pickup device and method for manufacturing the same
A solid-state image pickup device which includes a solid-state image pickup chip, a transparent plate disposed to face a light-receiving surface of the...
US-7,968,960 Methods of forming strained semiconductor channels
In various method embodiments, a device region in a semiconductor substrate and isolation regions adjacent to the device region are defined. The device region...
US-7,968,959 Methods and systems of thick semiconductor drift detector fabrication
Gray-tone lithography technology is used in combination with a reactive plasma etching operation in the fabrication method and system of a thick semiconductor...
US-7,968,958 Semiconductor device and manufacturing method of the same
A semiconductor device includes: a sensor element having a plate shape with a surface and including a sensor structure disposed in a surface portion of the...
US-7,968,957 Transistor gate electrode having conductor material layer
Various embodiments of the invention relate to a PMOS device having a transistor channel of silicon germanium material on a substrate, a gate dielectric having...
US-7,968,956 Semiconductor device
A semiconductor device includes a semiconductor substrate, a p-channel MIS transistor formed on the substrate, the p-channel transistor having a first gate...
US-7,968,955 Gate in semiconductor device and method of fabricating the same
A gate of a semiconductor device includes a substrate, and a polysilicon layer over the substrate, wherein the polysilicon layer is doped with first conductive...
US-7,968,954 Intermediate semiconductor device having nitrogen concentration profile
A method for reducing the effective thickness of a gate oxide using nitrogen implantation and anneal subsequent to dopant implantation and activation is...
US-7,968,953 Semiconductor device including schottky barrier diode and method of manufacturing the same
A semiconductor device includes a substrate, a plurality of first columns having a first conductivity type, a plurality of second columns having a second...
US-7,968,952 Stressed barrier plug slot contact structure for transistor performance enhancement
A method for forming a slot contact structure for transistor performance enhancement. A contact opening is formed to expose a contact region, and a slot contact...
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