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Patent # Description
US-7,994,657 Modular system for unattended energy generation and storage
An apparatus and method for supplying energy to a load includes an energy recharge unit, an energy storage unit, an energy converter connected to the energy...
US-7,994,656 Power supply system and method
A power supply system includes a power supply, a daughterboard, and a motherboard. Output currents of power connectors of the motherboard and impedances of...
US-7,994,655 Mechanical, anatomical heart-pumping assist
A method of providing mechanical assistance to the onset of heart-pumping activity includes selecting anatomical structure adjacent the heart which may be...
US-7,994,654 Wireless-controlled power-saving apparatus
A wireless-controlled power-saving apparatus is disclosed. The apparatus particularly includes a power-saving control strip and a wireless power-detection...
US-7,994,653 Pluggable power management module for a power distribution panel
One aspect provides a pluggable power management module, comprising a module housing having input and output pluggable connectors extending therefrom configured...
US-7,994,652 Wind turbine with flow surfaces
The present invention relates to a method of increasing the output of a wind turbine, wherein one or more flow surfaces are placed at a wind turbine. At lower...
US-7,994,651 Apparatus for converting the energy of waves on a body of water
An apparatus converting the energy of waves on an open body of water includes a submerged articulated frame or frames formed of rods arranged largely in a...
US-7,994,650 Rotor blade and wind energy installation
A rotor blade for a wind energy installation, in which the rotor blade (22) is formed in a plurality of parts, preferably in two parts, with respect to the...
US-7,994,649 Pelagic sustainable energy system
The present invention provides a sustainable energy system for pelagic deployment that may comprise a frame, at least one wind turbine generator coupled to the...
US-7,994,648 Mechanical continuous supply of electrical current from the motion of suspension components
One embodiment attached to a vehicle suspension strut or vehicle suspension shock-spring assembly or a vehicle shock absorber includes a set of cylinders...
US-7,994,647 Method of reducing memory card edge roughness by edge coating
A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the...
US-7,994,646 Semiconductor device
A semiconductor device is disclosed. One aspect provides a semiconductor device that includes a semiconductor chip including a first face and a second face...
US-7,994,645 Integrated circuit package system with wire-in-film isolation barrier
An integrated circuit package in package system includes: providing a substrate having a first wire-bonded die with an active side mounted above; connecting the...
US-7,994,644 Package stacking through rotation
A packaged microelectronic element includes a package element that further includes a dielectric element having a bottom face and a top face, first and second...
US-7,994,643 Stack package, a method of manufacturing the stack package, and a digital device having the stack package
A chip stack package may include a substrate, semiconductor chips, a molding member and a controller. The substrate may have a wiring pattern. The semiconductor...
US-7,994,642 Semiconductor device which includes contact plug and embedded interconnection connected to contact plug
A semiconductor memory device includes: a first dielectric formed on top of a semiconductor substrate; a contact plug embedded in the first dielectric; a second...
US-7,994,641 Semiconductor device and method of fabricating the same
A semiconductor device according to one embodiment includes: a substrate having an element region where a semiconductor element is formed; a via hole formed in...
US-7,994,640 Nanoparticle cap layer
Functionalized nanoparticles are deposited on metal lines inlaid in dielectric to form a metal cap layer that reduces electromigration in the metal line. The...
US-7,994,639 Microelectronic structure including dual damascene structure and high contrast alignment mark
A microelectronic structure, and in particular a semiconductor structure, includes a substrate and a dielectric layer located over the substrate. In addition at...
US-7,994,638 Semiconductor chip and semiconductor device
In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming...
US-7,994,637 High-frequency semiconductor device
An example of a high-frequency semiconductor device includes two unit semiconductor devices. Each of the two unit semiconductor devices has a ground substrate,...
US-7,994,636 Flip chip interconnection structure
A flip chip interconnection structure is formed by mechanically interlocking joining surfaces of a first and second element. The first element, which may be a...
US-7,994,635 Power semiconductor module
To suppress warpage of a ceramic substrate, and to prevent a reduction in radiation efficiency. A power semiconductor module includes a module casing fitted...
US-7,994,634 Semiconductor element and semiconductor element fabrication method
A semiconductor element is provided that includes a semiconductor substrate, a circuit element disposed on the substrate, and a through-hole formed in the...
US-7,994,633 Substrate for electrical device
Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator, a conductive element(s) and a conductive material(s),...
US-7,994,632 Interdigitated conductive lead frame or laminate lead frame for GaN die
A GaN die having a plurality of parallel alternating and closely spaced source and drain strips is contacted by parallel coplanar comb-shaped fingers of source...
US-7,994,631 Substrate for an integrated circuit package and a method of forming a substrate
A substrate for an integrated circuit package is disclosed. The substrate comprises a core comprising a first dielectric layer having a first thickness;...
US-7,994,630 Power transistor package with integrated bus bar
According to one embodiment, a power transistor package includes an electrically conductive flange configured to be connected to a source of a power transistor...
US-7,994,629 Leadless integrated circuit packaging system and method of manufacture thereof
A method of manufacture of a leadless integrated circuit packaging system includes: providing a substrate; patterning a die attach pad on the substrate; forming...
US-7,994,628 Package structure of photoelectronic device and fabricating method thereof
A package structure for photoelectronic devices comprises a silicon substrate, a first insulating layer, a reflective layer, a second insulating layer, a first...
US-7,994,627 Pad redistribution chip for compactness, method of manufacturing the same, and stacked package using the same
A substrate includes a substrate; a number of pad redistribution chips stacked on the substrate and on one another after being rotated 90.degree. in a...
US-7,994,626 Multi-layer semiconductor package with vertical connectors and method of manufacture thereof
A semiconductor package comprises a base substrate with a semiconductor die mounted on a top side of the base substrate and an interposer substrate mounted on...
US-7,994,625 Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate...
US-7,994,624 Integrated circuit package system with adhesive segment spacer
An integrated circuit package system includes attaching an adhesive segment spacer to an interposer assembly; mounting an integrated circuit over a carrier;...
US-7,994,623 Semiconductor device with offset stacked integrated circuits
A semiconductor device where multiple chips of identical design can be stacked, and the spacer and interposer eliminated, to improve three-dimensional coupling...
US-7,994,622 Microelectronic packages having cavities for receiving microelectric elements
Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts,...
US-7,994,621 Stacked semiconductor package
A stacked semiconductor package provides an enhanced data storage capacity along with an improved data processing speed. The stacked semiconductor package...
US-7,994,620 Stacked semiconductor device
A stacked semiconductor device includes a first semiconductor element bonded on a circuit base. The first semiconductor element is electrically connected to a...
US-7,994,619 Bridge stack integrated circuit package system
An integrated circuit package system is provided including mounting a first device on a carrier, mounting a second device over the first device and the carrier...
US-7,994,618 Sensor module and method for manufacturing same
A sensor module has a carrier substrate having a bottom side and a top side, a sensor chip arranged on the top side of the carrier substrate and having a...
US-7,994,617 Semiconductor device
An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the...
US-7,994,616 Multilayered lead frame for a semiconductor light-emitting device
A lead frame (100) for a semiconductor device is formed by applying nickel plating (102), palladium plating (103), and gold flash plating (104) substantially...
US-7,994,615 Direct contact leadless package for high current devices
Some exemplary embodiments of a direct contact leadless package and related structure and method, especially suitable for packaging high current semiconductor...
US-7,994,614 Semiconductor wafer, semiconductor device, and method of manufacturing semiconductor device
Provided is a semiconductor wafer with a scribe line region and a plurality of element forming regions partitioned by the scribe line region, the semiconductor...
US-7,994,613 Semiconductor device and method for manufacturing the same
A semiconductor device may include a chip including a chip including a silicon substrate having a semiconductor device area, a pad area and a scribe lane...
US-7,994,612 FinFETs single-sided implant formation
A method patterns pairs of semiconducting fins on an insulator layer and then patterns a linear gate conductor structure over and perpendicular to the fins....
US-7,994,611 Bipolar transistor fabricated in a biCMOS process
According to one exemplary embodiment, a bipolar transistor includes a base having a top surface. The bipolar transistor further includes a base oxide layer...
US-7,994,610 Integrated capacitor with tartan cross section
A capacitor in an IC has a first layer of conductive strips extending along a first direction (Z-direction). A first plurality of conductive strips in the first...
US-7,994,609 Shielding for integrated capacitors
A capacitor in an integrated circuit ("IC") includes a core capacitor portion having first conductive elements electrically connected to and forming a part of a...
US-7,994,608 Magnetically alignable integrated circuit device
An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an...
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