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Patent # Description
US-7,999,406 Wind turbine plant high wind derating control
A method for operating a wind turbine plant including providing a plurality of wind turbines each having a turbine rotor including at least one blade mounted to...
US-7,999,405 Electric power generation system controlled to reduce perception of operational changes
An electric power system includes an engine, a generator driven by the engine, an electrical energy storage device, power control circuitry coupling the...
US-7,999,404 Phase change on demand integrated pressure pump and power plant
Activation of a propellant in a constant volume container causes a phase change material to rapidly expand so that the pressure in the container increases....
US-7,999,403 System and method for locomotive engine cranking
In a method of operating a starting system coupled to a crankshaft of a vehicle engine, during engine starting, torque supplied by the starting system to the...
US-7,999,402 Electromechanical generator for converting mechanical vibrational energy into electrical energy
An electromechanical generator comprising a resonator comprising a vibratable mass, a biasing device connected to the vibratable mass, a power transduction...
US-7,999,401 Semiconductor device and method of manufacturing same
Semiconductor device has a semiconductor chip embedded in an insulating layer. A semiconductor device comprises a semiconductor chip formed to have external...
US-7,999,400 Semiconductor device with recessed registration marks partially covered and partially uncovered
A semiconductor device and a method for manufacturing such semiconductor device are provided. Specifically, in the semiconductor manufacture, a recessed...
US-7,999,399 Overlay vernier key and method for fabricating the same
An overlay vernier key includes a semiconductor substrate on which a cell region and a scribe lane region are defined, and a plurality of vernier patterns which...
US-7,999,398 Solid state device
A solid state device has a solid state component, a power receiving/supplying portion that mounts the solid state component thereon for receiving/supplying...
US-7,999,397 Microelectronic packages and methods therefor
A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate...
US-7,999,396 Adhesive tape and semiconductor package using the same
Provided is an adhesive tape which adheres two members to each other and decreases problems that may occur due to contraction and expansion of the adhered...
US-7,999,395 Pillar structure on bump pad
Substrates including conductive pads for coupling the substrates to a microelectronic device and/or package are described herein. Embodiments of the present...
US-7,999,394 Void reduction in indium thermal interface material
Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an...
US-7,999,393 Semiconductor device and manufacturing method thereof
A semiconductor device includes a plurality of first interconnection layers which are provided in an insulating layer and formed in a pattern having a width and...
US-7,999,392 Multilayer wiring structure, semiconductor device, pattern transfer mask and method for manufacturing...
A multilayer interconnection structure according to this invention is applied to a case where a plurality of interconnections are formed at a fine pitch and a...
US-7,999,391 Multilayered wiring structure, and method for manufacturing multilayered wiring
Provided is a wiring of the Damascene structure for preventing the TDDB withstand voltage degradation and for keeping the planarity to prevent the degradation...
US-7,999,390 Semiconductor integrated circuit
A semiconductor integrated circuit according to an example of the present invention includes a first interconnect extending in a first direction, a second...
US-7,999,389 Via hole structure with a conductive layer formed therein
A via hole structure and a manufacturing method thereof are provided. The via hole structure is disposed on a substrate. The substrate has a through hole, which...
US-7,999,388 Preventing breakage of long metal signal conductors on semiconductor substrates
An apparatus includes a volume of insulator disposed over a top surface of a semiconductor substrate, a tube of soft dielectric, and a metal conductor. The...
US-7,999,387 Semiconductor element connected to printed circuit board
A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to...
US-7,999,386 Semiconductor device including a guard ring surrounding an inductor
A semiconductor device contains a semiconductor substrate, an insulating film formed on the semiconductor substrate, an inductor formed over the semiconductor...
US-7,999,385 Semiconductor device
An exemplary embodiment of the present invention is a semiconductor device having a regular layout region and an irregular layout region formed on one chip,...
US-7,999,384 Top layers of metal for high performance IC's
A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer....
US-7,999,383 High speed, high density, low power die interconnect system
A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include...
US-7,999,382 Semiconductor device and fabrication method for the same
A semiconductor device includes a first interlayer insulating film formed on a semiconductor substrate; a second interlayer insulating film formed on the first...
US-7,999,381 High performance sub-system design and assembly
A multiple integrated circuit chip structure provides interchip communication between integrated circuit chips of the structure with no ESD protection circuits...
US-7,999,380 Process for manufacturing substrate with bumps and substrate structure
A process for manufacturing a substrate with bumps is provided. First, a metallic substrate having a body and a plurality of conductive elements is provided....
US-7,999,379 Microelectronic assemblies having compliancy
A microelectronic assembly includes a microelectronic element, such as a semiconductor wafer or semiconductor chip, having a first surface and contacts...
US-7,999,378 Semiconductor devices including semiconductor dice in laterally offset stacked arrangement
A semiconductor device assembly includes two or more dice stacked in laterally offset arrangement relative to one another. With such an arrangement, when a...
US-7,999,377 Method and structure for optimizing yield of 3-D chip manufacture
The process begins with separate device wafers having complimentary chips. Thin metal capture pads, having a preferred thickness of about 10 microns so that...
US-7,999,376 Semiconductor device and its manufacturing method
An object of the present invention is to provide a semiconductor device by packaging a plurality of semiconductor chips three-dimensionally in a smaller...
US-7,999,375 Electronic device with integrated micromechanical contacts and cooling system
An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of...
US-7,999,374 Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same
A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and...
US-7,999,373 Arrangement having at least one electronic component
The invention relates to an arrangement comprising at least one electronic component and a cooling body associated therewith. A support physically interposed...
US-7,999,372 Organic light emitting display device and method of fabricating the same
Provided is an organic light emitting display device. An organic light emitting display device according to one embodiment of the present invention comprises a...
US-7,999,371 Heat spreader package and method
A heat spreader package includes a substrate having a first surface, first traces on the first surface of the substrate, and an electronic component having an...
US-7,999,370 Semiconductor chip capable of increased number of pads in limited region and semiconductor package using the same
A semiconductor package includes a semiconductor chip including a body unit having one or more circuit units. A first bonding pad is disposed in a first face of...
US-7,999,369 Power electronic package having two substrates with multiple semiconductor chips and electronic components
A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and...
US-7,999,368 Semiconductor package having ink-jet type dam and method of manufacturing the same
A semiconductor package includes a substrate which includes a chip mounting unit disposed on a first surface thereof and a pad forming unit disposed on an outer...
US-7,999,367 Stacked memory device
A semiconductor memory device includes a stacked plurality of interposer chips, each interposer chip seating a smaller corresponding memory chip, wherein a...
US-7,999,366 Micro-component packaging process and set of micro-components resulting from this process
A process for packaging a plurality of micro-components made on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process...
US-7,999,365 Package for monolithic compound semiconductor (CSC) devices for DC to DC converters
A multichip module defining a dc to dc converter employs a monolithic chip containing at least two III-nitride switches (a monolithic CSC chip) mounted on a...
US-7,999,364 Method and flip chip structure for power devices
A lead frame structure for supporting a semiconductor die is disclosed that includes at least two electrical leads each having a plurality of finger shaped...
US-7,999,363 Structure and method for self protection of power device
A resetable over-current self-protecting semiconductor power device comprises a vertical power semiconductor chip and an over-current protection layer composed...
US-7,999,362 Method and apparatus for making semiconductor devices including a foil
A method for manufacturing a semiconductor device including covering a portion of at least one semiconductor device with a foil, including covering at least one...
US-7,999,361 Shielding structure for transmission lines
A shielding structure comprises first and second comb-like structures defined in a first metallization layer on an integrated circuit, each comb-like structure...
US-7,999,360 Underlayer for high performance magnetic tunneling junction MRAM
An MRAM structure is disclosed in which the bottom electrode has an amorphous TaN capping layer to consistently provide smooth and dense growth for AFM, pinned,...
US-7,999,359 Semiconductor package with electromagnetic shield
A semiconductor package with an electromagnetic shield is disclosed. The semiconductor package includes two substrates (102, 202; 103, 203) and an ...
US-7,999,358 Shielding device
One aspect of the invention relates to a shielding device for shielding from electromagnetic radiation, including a shielding base element, a shielding cover...
US-7,999,357 Electrostatic discharge circuit using forward biased circular-arc shaped steering diodes
The present invention advantageously provides a circular-arc shaped structure for forward biased steering diodes used in an ESD circuit, which circular arc...
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