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Patent # Description
US-7,998,803 Pixel structure and method for manufacturing the same
A method for manufacturing a pixel structure is provided. First, a first mask process is performed to form a patterned first metal layer on a substrate, wherein...
US-7,998,802 Method of manufacturing semiconductor device with offset sidewall structure
A method of manufacturing a semiconductor device with NMOS and PMOS transistors is provided. The semiconductor device can lessen a short channel effect, can...
US-7,998,801 Manufacturing method of thin film transistor having altered semiconductor layer
Decrease of the off-state current, increase of the on-state current, and reduction of variations of electrical characteristics. A method for manufacturing a...
US-7,998,800 Method for manufacturing semiconductor device
A method for manufacturing a semiconductor device is provided, which comprises at least a steps of forming a gate insulating film over a substrate, a step of...
US-7,998,798 Method of cutting electrical fuse
A method of cutting an electrical fuse including a first conductor and a second conductor, the first conductor including a first cutting target region, the...
US-7,998,797 Semiconductor device
A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The...
US-7,998,796 Semiconductor device and manufacturing method thereof
The present invention provides a technique capable of suppressing variations in the height of each solder ball where an NSMD is used as a structure for each...
US-7,998,795 Method of manufacturing a semiconductor device including plural semiconductor chips
A method for manufacturing a semiconductor device includes mounting a first chip over a first area of a chip mounting section of a lead frame and mounting a...
US-7,998,794 Resin molded semiconductor device and manufacturing method thereof
This invention is directed to provide a method of manufacturing a resin molded semiconductor device with high reliability by preventing a resin leakage portion...
US-7,998,793 Light illumination during wafer dicing to prevent aluminum corrosion
Illumination devices (7a) and (7b) which irradiate light having a wavelength of 1.1 .mu.m or less are arranged on a front surface and a rear surface of a cover...
US-7,998,792 Semiconductor device assemblies, electronic devices including the same and assembly methods
A semiconductor device is formed of two or more dice of similar dimensions and bond pad arrangements, in which bond pads are located in fields along less than...
US-7,998,791 Panel level methods and systems for packaging integrated circuits with integrated heat sinks
Panel level methods and arrangements are described for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce...
US-7,998,790 Integrated circuit packaging system with isolated pads and method of manufacture thereof
A method of manufacture of an integrated circuit die packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a...
US-7,998,789 Method and system for forming copper indium gallium sulfur selenide absorption layer and cadmium sulfide buffer...
A method and a system for forming a copper indium gallium sulfur selenide (CIGSSe) absorption layer and a cadmium sulfide (CdS) buffer layer under non-vacuum...
US-7,998,788 Techniques for use of nanotechnology in photovoltaics
Techniques for combining nanotechnology with photovoltaics are provided. In one aspect, a method of forming a photovoltaic device is provided comprising the...
US-7,998,787 Thin film transistor including organic semiconductor layer and substrate including the same
Provided is a thin film transistor including a gate electrode on a substrate; a gate insulating layer on the gate electrode; source and drain electrodes...
US-7,998,786 Method of manufacturing a TFT array panel
Multi-layered wiring for a larger flat panel display is formed by depositing molybdenum on a substrate in presence of a precursor gas containing at least one...
US-7,998,785 Film deposition of amorphous films with a graded bandgap by electron cyclotron resonance
A method is described of forming a film of an amorphous material on a substrate (14) by deposition from a plasma. The substrate (14) is placed in an enclosure,...
US-7,998,783 Manufacturing method for organic light emitting device
A method for manufacturing an organic light emitting device is disclosed. In one embodiment, the method includes an organic light emitting diode comprising a...
US-7,998,782 Fabrication of image sensor with improved signal to noise ratio
For fabricating an image sensor, an isolation structure is formed to define a first active region of a semiconductor substrate. A first transistor and a second...
US-7,998,781 Method of manufacturing semiconductor device in which functional portion of element is exposed
A method of manufacturing a semiconductor device includes: forming a first resin layer on a wafer having a light receiving portion; patterning the first resin...
US-7,998,780 Thinned image sensor with trench-insulated contact terminals
The invention relates to the fabrication of thinned substrate image sensors, and notably color image sensors. After the fabrication steps carried out from the...
US-7,998,779 Solid-state imaging device and method of fabricating solid-state imaging device
A solid-state imaging device includes: a solid-state imaging element having a light-receiving area; a transparent member disposed so as to oppose the...
US-7,998,778 Method of producing a solid-state imaging device
To provide a solid-state imaging device able to improve light transmittance of a transparent insulation film in a light incident side of a substrate, suppress...
US-7,998,777 Method for fabricating a sensor
A method for fabricating a sensor is disclosed that in one embodiment bonds a first device wafer to an etched second device wafer to create a suspended...
US-7,998,776 Methods for manufacturing MEMS sensor and thin film thereof with improved etching process
A method for manufacturing a MEMS sensor and a thin film thereof includes steps of etching a top surface of a single-crystal silicon wafer in combination of a...
US-7,998,775 Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures
When a native oxide grows on a polysilicon member of, e.g., a MEMS device, delamination between the polysilicon member and subsequently formed layers may occur...
US-7,998,774 Package, in particular for MEMS devices and method of making same
A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS...
US-7,998,773 Method of growing semiconductor heterostructures based on gallium nitride
The method of growing non-polar epitaxial heterostructures for light-emitting diodes producing white emission and lasers, on the basis of compounds and alloys...
US-7,998,772 Method to reduce leakage in a protection diode structure
A method for forming a protection diode utilizes processing operations and materials used in the formation of the CMOS integrated circuit device and provides a...
US-7,998,771 Manufacturing method of light emitting diode including current spreading layer
Provided is a method of manufacturing a light emitting diode using a nitride semiconductor, which including the steps of: forming n- and p-type current...
US-7,998,770 Method for forming a semiconductor light-emitting device
A semiconductor light-emitting device with a new layer structure is disclosed, where the current leaking path is not caused to enhance the current injection...
US-7,998,769 Full-color organic light emitting diode display device and method of fabricating the same
A full-color organic light emitting diode display device and a method of fabricating the same. The display device includes a substrate having red, green and...
US-7,998,768 Method for forming a light emitting diode
A method for forming a light emitting diode includes: (a) growing epitaxially an epitaxial film over an epitaxial substrate; (b) roughening an upper surface of...
US-7,998,767 Method for manufacturing a facet extraction LED
A facet extraction LED improved in light extraction efficiency and a manufacturing method thereof. A substrate is provided. A light emitting part includes an...
US-7,998,766 Semiconductor element and manufacturing method thereof
A semiconductor element and a manufacturing method of the semiconductor element are provided. A ridge waveguide type semiconductor integrated element includes:...
US-7,998,765 Method for forming an LED lens structure and related structure
A method for manufacturing an LED lens structure includes the following steps of disposing a lead frame with the LED chip into a mold, and injecting...
US-7,998,764 Solid-state light emitting display and fabrication method thereof
A solid-state light emitting display and a fabrication method thereof are proposed. The light emitting display includes a metallic board formed with conductive...
US-7,998,763 Method for manufacturing semiconductor apparatus and mold assembly for the same
A method for manufacturing a semiconductor apparatus which does not hamper the miniaturization of products and can simplify the manufacturing process without...
US-7,998,762 Method and system for large scale manufacture of thin film photovoltaic devices using multi-chamber configuration
A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a...
US-7,998,761 Light emitting diode with ITO layer and method for fabricating the same
The present invention relates to a light emitting diode with enhanced luminance and light emitting performance due to increase in efficiency of current...
US-7,998,760 Manufacture method for photovoltaic module including inspection and repair
After overlaying a conductive adhesive film and the wiring material on an electrode of a solar cell and temporarily fixing the wiring material to the solar cell...
US-7,998,759 Maunfacturing method for exposure mask, generating method for mask substrate information, mask substrate,...
There is disclosed a manufacturing method for exposure mask, which comprises acquiring a first information showing surface shape of surface of each of a...
US-7,998,758 Method of fabricating a magnetic stack design with decreased substrate stress
A magnetic element and a method for making a magnetic element. The method includes patterning a first electrode material to form a first electrode on a...
US-7,998,757 Container and method for supporting home testing and diagnosis of infectious diseases
A container is configured to provide sequential access to contents therein, and includes an upper portion and a lower portion connected to the upper portion by...
US-7,998,756 Use of perfluoropolymer submicrometric latexes in the determination of molecular interactions by laser light...
Use of a latex of perfluorinated polymers having particles with an average diameter between 5 and 200 nm for determining the binding constant of two interacting...
US-7,998,755 System and assay for detection of cardiac markers for assessing acute myocardial infarction
Assay systems and methods are provided for detecting a target antigen in a physiological fluid (e.g., blood, serum, or urine). The method includes linking via a...
US-7,998,754 In vitro method for the simultaneous detection and identification of antibiotics of different classes and...
The invention concerns a diagnostic kit for simultaneous assay of antibiotics of different classes. The kit contains a single reaction mixture containing at...
US-7,998,753 Measurement kit and an immunochromatography method
It is an object of the present invention to provide a measurement kit for developing a first developing solution and a second developing solution from different...
US-7,998,752 Biosensor and blood component analytical method
According to the biosensor and the blood component analytical method of the present invention, in a biosensor that is made of a single layer or plural layers of...
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