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| Patent # | Description |
|---|---|
| US-8,048,724 |
Semiconductor switching device A switching device and methods of making and operating the same are provided. In one aspect, a method of operating a switching device is provided that includes... |
| US-8,048,723 |
Germanium FinFETs having dielectric punch-through stoppers A method of forming a semiconductor structure includes providing a composite substrate, which includes a bulk silicon substrate and a silicon germanium (SiGe)... |
| US-8,048,722 |
Manufacturing method of semiconductor device Performing electrolysis plating to a wiring is made possible, aiming at the increasing of pin count of a semiconductor device. Package substrate 3 by which ring... |
| US-8,048,721 |
Method for filling multi-layer chip-stacked gaps A method for filling multi-layer chip-stacked gaps is revealed, primarily comprising the steps as below. Firstly, a chip-stacked assembly is provided,... |
| US-8,048,720 |
Wire loop and method of forming the wire loop A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding... |
| US-8,048,719 |
Semiconductor device and manufacturing method thereof A semiconductor device capable of preventing contact between electrode terminals and a die pad as well as capable of surely performing wire bonding to the... |
| US-8,048,718 |
Semiconductor device comprising an excess resin portion, manufacturing
method thereof, and apparatus for... A partly finished product of a semiconductor device includes a resin body encapsulating a semiconductor chip, first and second leads extended outwardly from the... |
| US-8,048,717 |
Method and system for bonding 3D semiconductor devices A method and system and for fabricating 3D (three-dimensional) SIC (stacked integrated chip) semiconductor devices. The system includes a vacuum chamber, a... |
| US-8,048,716 |
Structure of embedded active components and manufacturing method thereof A structure of embedded active components and the manufacturing method thereof are provided. The manufacturing steps involve providing a molding plate, and... |
| US-8,048,715 |
Multi-chip module and methods A substrate includes first and second regions over which first and second semiconductor devices are to be respectively positioned. The first region is located... |
| US-8,048,714 |
Semiconductor device and method for manufacturing a semiconductor device
having improved heat dissipation... A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface... |
| US-8,048,713 |
Process for manufacturing a CBRAM memory having enhanced reliability The invention relates to a process for manufacturing a plurality of CBRAM memories, each comprising a memory cell in a chalcogenide solid electrolyte, an anode,... |
| US-8,048,712 |
Method for producing localized patterns A method for producing at least one pattern on a top surface of a support made from a material presenting a first thermal conductivity comprises a step of... |
| US-8,048,711 |
Method for forming deep isolation in imagers An image sensor having an imaging area that includes a substrate layer and a plurality of pixels formed therein. Multiple pixels each include a photodetector... |
| US-8,048,710 |
Photoelectric conversion device and method for producing photoelectric
conversion device A photoelectric conversion device according to the present invention has a plurality of photoreceiving portions provided in a substrate, an interlayer film... |
| US-8,048,709 |
Photovoltaic panel, relative production process and plant for carrying out
such a process A photovoltaic panel made by direct co-extrusion of a plurality of superimposed polymeric layers and a plant for carrying out such a process. |
| US-8,048,708 |
Method and apparatus providing an imager module with a permanent carrier Method and apparatus providing a wafer level fabrication of imager modules in which a permanent carrier protects imager devices on an imager wafer and is used... |
| US-8,048,707 |
Sulfur salt containing CIG targets, methods of making and methods of use
thereof A method of making a photovoltaic device includes forming a compound semiconductor layer including copper, indium, gallium, selenium and sulfur by reactive... |
| US-8,048,706 |
Ablative scribing of solar cell structures Provided herein are improved methods of laser scribing photovoltaic structures to form monolithically integrated photovoltaic modules. The methods involve... |
| US-8,048,705 |
Method and structure for a CMOS image sensor using a triple gate process A method of forming a CMOS image sensor device, the method includes providing a semiconductor substrate having a P-type impurity characteristic including a... |
| US-8,048,704 |
Method of forming a MEMS topped integrated circuit with a stress relief
layer The bow in a wafer that results from fabricating a large number of MEMS devices on the top surface of the passivation layer of the wafer so that a MEMS device... |
| US-8,048,703 |
Light emitting devices with inhomogeneous quantum well active regions A method of fabricating a light emitting device includes modulating a crystal growth parameter to grow a quantum well layer that is inhomogeneous and that has a... |
| US-8,048,702 |
Method of fabricating nitride-based semiconductor optical device In the method of fabricating a nitride-based semiconductor optical device by metal-organic chemical vapor deposition, a barrier layer is grown at a first... |
| US-8,048,701 |
Nitride semiconductor LED using a hybrid buffer layer and a fabrication
method therefor The present invention relates to a nitride semiconductor light emitting device using a hybrid buffer layer and a method for fabricating the same which can... |
| US-8,048,700 |
Semiconductor light emitting element and manufacturing method thereof A semiconductor light-emitting device (LE1) comprises a multilayer structure LS generating light. This multilayer structure includes a plurality of laminated... |
| US-8,048,699 |
Dual panel type organic electroluminescent display device and method of
fabricating the same An organic electroluminescent device includes: a switching element and a driving element connected to each other on a substrate including a pixel region; a... |
| US-8,048,698 |
Thin film transistor array substrate and method for manufacturing the same A thin film transistor array structure and a method for manufacturing the same are provided. The thin film transistor array structure comprises a substrate,... |
| US-8,048,697 |
Method for manufacturing an LCD device employing a reduced number of
photomasks including bottom and top gate... A manufacturing method of the present invention includes a process using a first multi-tone mask, in which a first conductive layer in which a transparent... |
| US-8,048,696 |
Light emitting diode devices and manufacturing method thereof A light emitting diode (LED) device includes a stacked epitaxial structure, a heat-conductive plate and a seed layer. The stacked epitaxial structure... |
| US-8,048,695 |
Method for fabricating a light source that includes phosphor-converted LED A light source and method for fabricating the same are disclosed. The light source includes a die, a light conversion component, and a scattering ring. The die... |
| US-8,048,694 |
Package base structure and associated manufacturing method A package base structure of a light emitting device and associated manufacturing method is provided. The method includes steps of forming a first mask layer and... |
| US-8,048,693 |
Methods and structures for relaxation of strained layers The present invention provides methods for relaxing a strained-material layer and structures produced by the methods. Briefly, the methods include depositing a... |
| US-8,048,692 |
LED light emitter with heat sink holder and method for manufacturing the
same An LED light emitter with heat sink holder and a method for manufacturing it are both disclosed. The LED light emitter with heat sink holder includes a heat... |
| US-8,048,691 |
Wiring forming method Size reduction and high integration of each of the laminated substrates are achieved, while forming an excellent wiring which electrically connects the... |
| US-8,048,690 |
Pressure-sensitive adhesive sheet and process for producing semiconductor
device having same A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is... |
| US-8,048,689 |
Semiconductor chip with backside conductor structure Various semiconductor devices and methods of testing such devices are disclosed. In one aspect, a method of manufacturing is provided that includes forming a... |
| US-8,048,688 |
Method and apparatus for evaluation and improvement of mechanical and
thermal properties of CNT/CNF arrays A method and apparatus for the evaluation and improvement of the mechanical and thermal properties of carbon-nanotube (CNT) and carbon nanofiber (CNF) arrays... |
| US-8,048,687 |
Processing method for recovering a damaged low-k film of a substrate and
storage medium There is provided a processing method for performing a recovery process on a damaged layer formed on a surface of a low-k film of a target substrate by... |
| US-8,048,686 |
Production of a device comprising magnetic structures formed on one and
the same substrate and having... The invention relates to a method for producing a device comprising magnetic blocks magnetized in different directions, comprising steps of: a) forming, in a... |
| US-8,048,685 |
Magnetic RAM A memory element for a magnetic RAM, having a first magnetic portion in a first recess of a first insulating layer; and a non-magnetic portion and a second... |
| US-8,048,684 |
Structure and method for manipulating spin quantum state through dipole
polarization switching Disclosed herein is a structure and method for manipulating a spin state, regarded as important in the field of spintronics, by which the distribution of... |
| US-8,048,683 |
Insect repellent and process for identifying other insect repellent
molecules This invention is based on the identification of the role played by the receptor mX on certain insects through the behavior evinced in the taste sensory... |
| US-8,048,682 |
Device and method for detecting sulfur dioxide at high temperatures The present invention relates to a method for selectively detecting and/or measuring gaseous SO.sub.2 at a temperature of at least 500.degree. C., the method... |
| US-8,048,681 |
Methods for nucleic acid isolation and instruments for nucleic acid
isolation The present invention relates to a technique for efficient isolation of long nucleic acids and short nucleic acids from a sample containing long nucleic acids... |
| US-8,048,680 |
Holographic sensor A sensor for the detection of an analyte comprising a cis-diol moiety, which comprises a holographic element comprising a medium and a hologram disposed... |
| US-8,048,679 |
Method for employing SEC-FTIR data to predict mechanical properties of
polyethylene The present invention provides several methods of determining values of physical or chemical properties of polymers. In these methods, at least two polymer... |
| US-8,048,678 |
Cell separation method and apparatus Disclosed herein are apparatus and methods for isolating a fraction of interest from a physiological fluid sample. A sample holder for isolating a fraction of... |
| US-8,048,677 |
Sensor board The invention relates to a sensor board comprising a plate-like body comprising a body material and having two surfaces substantially parallel to each other,... |
| US-8,048,676 |
Systems of diagnosing cervical cancer The invention provides reagents and methods for detecting pathogen infections in human samples. This detection utilizes specific proteins to detect the presence... |
| US-8,048,675 |
Integration-free human induced pluripotent stem cells from blood Provided herein are methods for generating human induced pluripotent stem cells free from genomic integration of exogenous transgenes by transfecting into... |
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