Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-8,067,835 Method and apparatus for manufacturing semiconductor module
Disclosed herewith is a semiconductor module manufacturing apparatus capable of reducing occurrence of warping of the wiring substrate, etc., as well as...
US-8,067,834 Semiconductor component
In various embodiments, semiconductor components and methods to manufacture these components are disclosed. In one embodiment, a method to manufacture a...
US-8,067,833 Low noise high thermal conductivity mixed signal package
An improved microelectronic assembly (100) and packaging method includes a device package for housing a semiconductor die or chip, (105), an array of passive...
US-8,067,832 Embedded integrated circuit package system and method of manufacture thereof
A method of manufacture of an embedded integrated circuit package system includes: forming a first conductive pattern on a first structure; connecting a first...
US-8,067,831 Integrated circuit package system with planar interconnects
An integrated circuit package system is provided including forming a first substrate, mounting a first integrated circuit to the first substrate, and forming...
US-8,067,830 Dual or multiple row package
A dual or multiple row package (300) is provided which comprises a first plurality of terminals (303, 304, 305) and a second plurality of terminals (306, 307),...
US-8,067,829 System and method for multi-chip module die extraction and replacement
A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first...
US-8,067,828 System for solder ball inner stacking module connection
An integrated circuit package-in-package system including: providing a substrate; mounting a structure over the substrate; supporting an inner stacking module...
US-8,067,827 Stacked microelectronic device assemblies
An assembly of microelectronic devices and method for forming an assembly of microelectronic devices. In one embodiment, the method includes positioning a first...
US-8,067,826 Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package
A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the...
US-8,067,825 Integrated circuit package system with multiple die
An integrated circuit package system includes providing die; forming leads adjacent the die; forming a die paddle adjacent the leads with the die thereover; and...
US-8,067,824 Integrated circuit module package and assembly method thereof
An integrated circuit module package includes a lead frame having a recessed area. A semiconductor die containing active electrical components is attached to...
US-8,067,823 Chip scale package having flip chip interconnect on die paddle
A flip chip lead frame package includes a die and a lead frame having a die paddle and leads, and has interconnection between the active site of the die and the...
US-8,067,822 Integrated circuit package for semiconductor devices with improved electric resistance and inductance
A semiconductor integrated circuit package having a leadframe (108) that includes a leadframe pad (103a) disposed under a die (100) and a bonding metal area...
US-8,067,821 Flat semiconductor package with half package molding
In accordance with the present invention, there are provided multiple embodiments of a semiconductor package, each embodiment including a uniquely configured...
US-8,067,820 Silocon wafer supporting method, heat treatment jig and heat-treated wafer
Provided is a method applicable to the production of silicon wafers having crystal orientation <100> or <110> and consisting in specifying...
US-8,067,819 Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads...
The present invention discloses a semiconductor wafer having a scribe line dividing the semiconductor wafer into a matrix of plural semiconductor chips. The...
US-8,067,818 Nonplanar device with thinned lower body portion and method of fabrication
A nonplanar semiconductor device having a semiconductor body formed on an insulating layer of a substrate. The semiconductor body has a top surface opposite a...
US-8,067,817 Semiconductor device and method of manufacturing the same
A semiconductor device includes a ferroelectric capacitor formed over a semiconductor substrate, wherein the ferroelectric capacitor including a lower...
US-8,067,816 Techniques for placement of active and passive devices within a chip
A semiconductor die includes a semiconductive substrate layer with first and second sides, a metal layer adjacent the second side of the semiconductive...
US-8,067,815 Aluminum copper oxide based memory devices and methods for manufacture
Memory devices are described along with methods for manufacturing. A memory device as described herein includes a first electrode and a second electrode. The...
US-8,067,814 Semiconductor device and method of manufacturing the same
In the present invention, a first circuit pattern 3 composing a semiconductor element is formed on the front side of a substrate 1, a first insulating layer 2...
US-8,067,813 Integrated MIS photosensitive device using continuous films
An integrated photosensitive device with a metal-insulator-semiconductor (MIS) photodiode constructed with one or more substantially continuous layers of...
US-8,067,812 Acceleration sensor and method of producing the same
An acceleration sensor includes a weight; a base portion, a beam; and a piezo resistance element. The weight is arranged to displace upon receiving...
US-8,067,811 MEMS device, MEMS device module and acoustic transducer
A MEMS device includes a first insulating film formed on a semiconductor substrate, a vibrating film formed on the first insulating film, and a fixed film above...
US-8,067,810 Self-actuating RF MEMS device by RF power actuation
Systems and methods for controlling a micro electromechanical device using power actuation are disclosed. The disclosed micro electromechanical systems comprise...
US-8,067,809 Semiconductor storage device including a gate insulating film with a favorable nitrogen concentration profile...
A semiconductor storage device with excellent electrical characteristics (write/erase characteristics) by favorable nitrogen concentration profile of a gate...
US-8,067,808 Apparatus of memory array using FinFETs
A memory cell includes a FinFET select device and a memory element. In some embodiments a memory cell has a contact element coupled between a surface of the fin...
US-8,067,807 Semiconductor integrated circuit device
In an LCD driver IC, a high-breakdown-voltage MISFET is mounted together with a typical low-breakdown-voltage MISFET. Because the high-breakdown-voltage MISFET...
US-8,067,806 Gate structures of CMOS device and method for manufacturing the same
Gate structures of CMOS device and the method for manufacturing the same are provided. A substrate having an NMOS region, a PMOS region, and a work function...
US-8,067,805 Ultra shallow junction formation by epitaxial interface limited diffusion
A method of forming a field effect transistor creates shallower and sharper junctions, while maximizing dopant activation in processes that are consistent with...
US-8,067,804 Semiconductor device having an SOI structure, manufacturing method thereof, and memory circuit
The present invention provides a semiconductor device capable of suppressing a body floating effect, and a manufacturing method thereof. A semiconductor device...
US-8,067,803 Memory devices, transistor devices and related methods
A memory device and method of making the memory device. The memory device comprises a storage transistor at a surface of a substrate. The storage transistor...
US-8,067,802 Flexible device and method of manufacturing the same
The rollable device of the invention comprises a substrate of an insulating material (12) with apertures (15) extending from a first to a second side. On the...
US-8,067,801 Semiconductor device and method of manufacturing the same
A semiconductor device is provided, which comprises a first transistor and a second transistor formed in a semiconductor layer. The first transistor includes a...
US-8,067,800 Super-junction trench MOSFET with resurf step oxide and the method to make the same
A super-junction trench MOSFET with Resurf Stepped Oxide is disclosed. The inventive structure can apply additional freedom for better optimization and...
US-8,067,799 Semiconductor device having recess channel structure and method for manufacturing the same
A semiconductor device having a recess channel structure includes a semiconductor substrate having a recess formed in a gate forming area in an active area; an...
US-8,067,798 Semiconductor device
The semiconductor device of the present invention includes a first conductive type semiconductor layer; a second conductive type source region formed in a...
US-8,067,797 Variable threshold trench IGBT with offset emitter contacts
A trench type IGBT as disclosed herein includes a plurality of channel regions having one threshold voltage for the normal operation of the device and a...
US-8,067,796 Semiconductor component with cell structure and method for producing the same
A semiconductor component comprises a semiconductor body comprising a first component electrode arranged on one of the surfaces of the semiconductor body, a...
US-8,067,795 Single poly EEPROM without separate control gate nor erase regions
A single-poly EEPROM memory device comprises source and drain regions in a semiconductor body, a floating gate overlying a portion of the source and drain...
US-8,067,794 Conductive layers for hafnium silicon oxynitride films
Electronic apparatus and methods of forming the electronic apparatus include a HfSiON film on a substrate for use in a variety of electronic systems. The HfSiON...
US-8,067,793 Semiconductor device including storage capacitor with yttrium oxide capacitor dielectric
A method for manufacturing a semiconductor device with high response speed and high reliability. In the method for manufacturing a semiconductor device of the...
US-8,067,792 Memory device with memory cell including MuGFET and FIN capacitor
One embodiment of the present invention relates to a memory cell. The memory cell includes a multi-gate field effect transistor associated with a first region...
US-8,067,791 Semiconductor device and method for fabricating the same
A semiconductor device formed by the steps of: forming a dummy electrode 22n and a dummy electrode 22p; forming a metal film 32 on the dummy electrode 22p;...
US-8,067,790 Semiconductor device with less power supply noise
A semiconductor device includes a first power supply line; a second power supply line; a first cell arrangement area in which a first cell is arranged; and a...
US-8,067,789 Semiconductor integrated circuit device
To provide a semiconductor integrated circuit device advantageous against EM and ESD. A plurality of I/O cells; a power wire formed of a plurality of...
US-8,067,788 Semiconductor device
A semiconductor device includes a substrate common to a first field effect transistor and a second field effect transistor, a channel layer of a first...
US-8,067,787 Semiconductor electronic device
A semiconductor electronic device comprises a substrate; a buffer layer formed on the substrate, the buffer layer including not less than two layers of...
US-8,067,786 Gallium nitride material devices including conductive regions
Semiconductor structures comprising a III-nitride (e.g., gallium nitride) material region and methods associated with such structures are provided. In some...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.