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Patent # Description
US-8,067,284 Oxynitride bilayer formed using a precursor inducing a high charge trap density in a top layer of the bilayer
A semiconductor device including a bilayer charge storing layer and methods of forming the same are provided. Generally, the method includes: (i) forming a...
US-8,067,283 Semiconductor device fabricating method
A semiconductor device fabricating method is described. The semiconductor device fabricating method includes providing a substrate. A first gate insulating...
US-8,067,282 Method for selective formation of trench
A method for selective formation of trenches is disclosed. First, a substrate is provided. The substrate includes a first semiconductor element and a second...
US-8,067,281 Method of fabricating complementary metal-oxide-semiconductor (CMOS) Device
A method of fabricating a CMOS device is provided. First, first and second gates, first and second offset spacers and first and second lightly-doped regions are...
US-8,067,280 High performance CMOS devices and methods for making same
An integrated circuit having high performance CMOS devices with good short channel effects may be made by forming a gate structure over a substrate; forming...
US-8,067,279 Application of different isolation schemes for logic and embedded memory
The present invention facilitates semiconductor device fabrication by providing mechanisms for utilizing different isolation schemes within embedded memory and...
US-8,067,278 Semiconductor device and method for manufacturing the same
A semiconductor device includes at least one thin film transistor including a semiconductor layer that has a crystalline region including a channel region, a...
US-8,067,277 Active matrix device with photo sensor
An active matrix pixel device is provided, for example an electroluminescent display device, the device comprising circuitry supported by a substrate and...
US-8,067,276 Semiconductor device and manufacturing method thereof
An oxide or nitride semiconductor layer is formed over a substrate. A first conductive layer including a first element and a second element, and a second...
US-8,067,275 Integrated circuit package system with package integration
An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support...
US-8,067,274 Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor...
In this manufacturing method of a semiconductor device, a metal plate having a plurality of projection electrodes in each of a plurality of semiconductor device...
US-8,067,273 Self locking and aligning clip structure for semiconductor die package
A semiconductor die package. The semiconductor die package includes a semiconductor die, and a lead comprising a flat surface. It also includes a clip structure...
US-8,067,272 Integrated circuit package system for package stacking and manufacturing method thereof
A stackable multi-chip package system is provided including forming an external interconnect having a base and a tip, connecting a first integrated circuit die...
US-8,067,271 Integrated circuit package system with encapsulation lock
An integrated circuit package system is provided including forming an external interconnect and a tie bar, forming a lead tip and a lead body of the external...
US-8,067,270 Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an...
US-8,067,269 Method for fabricating at least one transistor
A method for fabricating transistors such as high electron mobility transistors, each transistor comprising a plurality of epitaxial layers on a common...
US-8,067,268 Stacked integrated circuit package system and method for manufacturing thereof
A method for manufacturing of a stacked integrated circuit package system includes: providing a base integrated circuit package having a base encapsulation with...
US-8,067,267 Microelectronic assemblies having very fine pitch stacking
A method of making a stacked microelectronic assembly includes providing a first microelectronic package that includes a first substrate having a first...
US-8,067,266 Methods for the fabrication of microelectronic device substrates by attaching two cores together during fabrication
The present disclosure relates to fabricating substrates for use in microelectronic device packages. In at least one embodiment, two substrate cores may be...
US-8,067,265 Electric devices and methods of manufaturing the same
A process for manufacturing an electrical device, the process comprising the steps: providing a substrate; bringing a stamp into contact with the substrate...
US-8,067,264 Polythiophenes and devices thereof
An electronic device containing a polythiophene ##STR00001## wherein R represents a side chain, m represents the number of R substituents; A is a divalent...
US-8,067,263 Thermal management and method for large scale processing of CIS and/or CIGS based thin films overlying glass...
The thermal management and method for large scale processing of CIS and/or CIGS based thin film overlaying glass substrates. According to an embodiment, the...
US-8,067,262 Polymeric precursors for CAIGS silver-containing photovoltaics
This invention relates to compounds, polymeric compounds, and compositions used to prepare semiconductor and optoelectronic materials and devices including thin...
US-8,067,261 Solid-state imaging device and manufacturing method thereof
A solid-state imaging device includes a photoelectric conversion unit, a transistor, and an element separation region separating the photoelectric conversion...
US-8,067,260 Fabricating sub-lithographic contacts
A small critical dimension element, such as a heater for an ovonic unified memory, may be formed within a pore by using successive sidewall spacers. The use of...
US-8,067,259 Method of producing high performance photovoltaic and thermoelectric nanostructured bulk and thin films
Embodiments of the invention provide methods of forming photovoltaic or thermoelectric materials, including photovoltaic or thermoelectric films. In one...
US-8,067,258 Protective thin films for use during fabrication of semiconductors, MEMS, and microstructures
A method of protecting a substrate during fabrication of semiconductor, MEMS, or biotechnology devices. The method includes application of a protective thin...
US-8,067,257 Nitride based semiconductor optical device, epitaxial wafer for nitride based semiconductor optical device, and...
In the nitride based semiconductor optical device LE1, the strained well layers 21 extend along a reference plane SR1 tilting at a tilt angle .alpha. from the...
US-8,067,256 Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic...
A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a...
US-8,067,255 Nitride semiconductor light emitting device, method of manufacturing nitride semiconductor light emitting...
Provided are a nitride semiconductor light emitting device including a coat film formed at a light emitting portion and including an aluminum nitride crystal or...
US-8,067,254 Common optical element for an array of phosphor converted light emitting devices
A device is provided with an array of a plurality of phosphor converted light emitting devices (LEDs) that produce broad spectrum light. The phosphor converted...
US-8,067,253 Electrical device and method of manufacturing electrical devices using film embossing techniques to embed...
An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a...
US-8,067,252 Method for determining low-noise power spectral density for characterizing line edge roughness in semiconductor...
According to one exemplary embodiment, a method for determining a power spectral density of an edge of at least one patterned feature situated over a...
US-8,067,251 Semiconductor device and a method of manufacturing the same
A method including forming an intermediate product, the intermediate product being configured to include a wiring substrate including a plurality of first...
US-8,067,250 Ferroelectric memory device and method of manufacturing the same
A method of manufacturing a ferroelectric memory device includes: forming a hydrogen barrier film which covers a ferroelectric capacitor including a lower...
US-8,067,249 Method for functionalizing biosensor chips
A method is disclosed for functionalizing biosensors. The biosensors are based on semiconductor chips mounted on a finished processed wafer. They are provided...
US-8,067,248 Method for diagnosing rheumatoid arthritis via assaying myofibroblast-like synoviocytes for fibroblast...
The invention relates to methods for diagnosing rheumatoid arthritis by assaying for Fibroblast Activation Protein Alpha expression in rheumatoid, myofibroblast...
US-8,067,247 Use of anti-CD100 antibodies for the treatment of inflammatory disorders affecting the central or peripheral...
The invention relates to the use a BD16 and/or BB18 anti-CD100 antibody or of a chimeric or humanized or human form thereof, or a fragment thereof, for the...
US-8,067,246 Diagnostic testing process
A method and apparatus for use in a flow through assay process is disclosed. The method is characterised by a "pre-incubation step" in which the sample which is...
US-8,067,245 Automated microscope for blood cell analysis
An apparatus and method of automated blood cell analysis uses technologies from other systems to create a new, robust, improved type of automated microscope,...
US-8,067,244 Method and device for investigation of a surface layer
A method and device for investigation of a surface layer of a material. The material without surface layer is exposed for a gas and the penetration of the gas...
US-8,067,243 Methods and systems for analyzing medication levels in a sample
Methods and systems for assessing patient compliance with opioid drug therapy are provided. A liquid chromatography tandem mass spectrometer (LC/MS/MS) can be...
US-8,067,242 Method for methylmalonic acid detemination based on alkylative extraction associated to liquid chromatography...
The present invention relates to the determination of the presence of methylmalonic acid in biologic samples including the steps of methylmalonic extraction...
US-8,067,241 Method and apparatus for antigen retrieval process
The invention provides a method for antigen retrieval of a formaldehyde-fixed tissue sample comprising incubating a formaldehyde-fixed tissue sample in a first...
US-8,067,240 Methods for the diagnosis and treatment of lung cancer
The present invention provides methods for aiding in the diagnoses of the neoplastic condition of a lung cell and methods of screening for a potential...
US-8,067,239 Reagents for recombinogenic engineering and use thereof
The present invention features homologous recombination methods and systems. The methods and systems promote highly efficient homologous recombination in cells...
US-8,067,238 Use of acid stable protease in animal feed
The present invention relates to acid-stable proteases homologous to those derived from strains of the genus Nocardiopsis, their use in animal feed,...
US-8,067,237 Scaffolds for cell transplantation
A device that includes a scaffold composition and a bioactive composition with the bioactive composition being incorporated into or coated onto the scaffold...
US-8,067,236 Optimized human T1R3 nucleic acid molecule
The present invention relates to a screening system for modulators of GPCRs. Further it relates to recombinant vector systems for the heterologous expression of...
US-8,067,235 Optimized human T1R2 nucleic acid molecule
The present invention relates to a screening system for modulators of GPCRs. Further it relates to recombinant vector systems for the heterologous expression of...
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