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Patent # Description
US-8,072,081 Microelectromechanical system package
A microelectromechanical system package includes a chip carrier, a first microelectromechanical system chip, a silicon cover, a layer of metal, a plurality of...
US-8,072,080 Connection structure, electro-optical device, and method for production of electro-optical device
The invention provides a connection structure including: a first electro-conductive film that is formed on a substrate; an insulation film that is formed on the...
US-8,072,079 Through hole vias at saw streets including protrusions or recesses for interconnection
A semiconductor package includes a semiconductor die having a contact pad formed over a top surface of the semiconductor die. The semiconductor die may include...
US-8,072,078 Semiconductor device and dummy pattern arrangement method
A semiconductor device includes a plurality of wiring patterns arranged in a first wiring layer of the semiconductor device and extending in a first direction,...
US-8,072,077 Semiconductor memory device
Disclosed herein is a semiconductor memory device for reducing a junction resistance and increasing amount of current throughout the unit cell. A semiconductor...
US-8,072,076 Bond pad structures and integrated circuit chip having the same
Bonding pad structures and integrated circuits having the same are provided. An exemplary embodiment of a bond pad structure comprises a bond pad layer. A...
US-8,072,075 CuSiN/SiN diffusion barrier for copper in integrated-circuit devices
The present invention relates to an integrated-circuit device that has at least one Copper-containing feature in a dielectric layer, and a diffusion-barrier...
US-8,072,074 Semiconductor device and method of manufacturing same
A technique for enhancing the performance of a memory- and logic-equipped semiconductor device is provided. The semiconductor device comprises a semiconductor...
US-8,072,073 Semiconductor device and method of manufacturing same
A highly reliable semiconductor device in which connection reliability is assured at very small vias comprises: a semiconductor substrate; a first wiring...
US-8,072,072 Integrated circuit including different types of gate stacks, corresponding intermediate integrated circuit...
The present invention provides a manufacturing method for an integrated circuit and a corresponding integrated circuit. The integrated circuit comprises a...
US-8,072,071 Semiconductor device including conductive element
A semiconductor device includes a chip comprising a contact element, a structured dielectric layer over the chip, and a conductive element coupled to the...
US-8,072,070 Low fabrication cost, fine pitch and high reliability solder bump
A barrier layer is deposited over a layer of passivation including in an opening to a contact pad created in the layer of passivation. A column of three layers...
US-8,072,069 Semiconductor device and method of manufacturing a semiconductor device
A semiconductor device includes at least a wiring board, a semiconductor chip that is mounted on one face side of the wiring board, connection pads that are...
US-8,072,068 Semiconductor device and a method for manufacturing the same
A semiconductor device according to the present invention includes: a semiconductor chip; a sealing resin layer formed on the semiconductor chip; and a post...
US-8,072,067 Semiconductor structure
A semiconductor structure including a substrate, an insulating layer, a composite pad structure, a passivation layer, and a bump is provided. A circuit...
US-8,072,066 Metal interconnects for integrated circuit die comprising non-oxidizing portions extending outside seal ring
An integrated circuit includes a substrate; a sealing element spanning a periphery of the substrate that forms a protective boundary for the substrate; a...
US-8,072,065 System and method for integrated waveguide packaging
A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one...
US-8,072,064 Semiconductor package and method for making the same
The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a first chip and a second chip....
US-8,072,063 LED lamp module and fabrication method thereof
An LED lamp module includes a heat sink element having one-piece form; a circuit substrate affixed onto the heat sink element, wherein the substrate has at...
US-8,072,062 Circuit device with at least partial packaging and method for forming
A circuit device is placed within an opening of a conductive layer which is then partially encapsulated with an encapsulant so that the active surface of the...
US-8,072,061 Semiconductor device with cooling element
Some embodiments discussed herein include a semiconductor having a source region, a drain region and an array of fins operatively coupled to a gate region...
US-8,072,060 Semiconductor fingerprint apparatus with flat touch surface
In a fingerprint apparatus, fingerprint sensing members disposed on a silicon substrate detect skin textures of a finger placed thereon to generate electric...
US-8,072,059 Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of...
A semiconductor device is made by forming a first conductive layer over a temporary carrier. A UBM layer is formed over the temporary carrier and fixed in...
US-8,072,058 Semiconductor package having a plurality input/output members
A semiconductor package has a first substrate having a plurality of electrically conductive patterns formed thereon. A first semiconductor die is coupled to the...
US-8,072,057 Semiconductor device and method of fabrication
A semiconductor device includes a first die pad, a first semiconductor chip provided on the first die pad, a second die pad, a second semiconductor chip...
US-8,072,056 Apparatus for restricting moisture ingress
Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.
US-8,072,055 High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies
A stacked semiconductor die assembly includes at least two partially offset semiconductor dice with bond pads located adjacent at least one peripheral side...
US-8,072,054 Lead frame
A lead frame includes a plurality of leads electrically connected to a semiconductor chip and a lead lock including a base layer disposed over the plurality of...
US-8,072,053 Leadless integrated circuit package having electrically routed contacts
A leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the...
US-8,072,052 Trench substrate
Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on...
US-8,072,051 Folded lands and vias for multichip semiconductor packages
Semiconductor packages and methods for making and using the same are described. The semiconductor packages contain a lead frame that has been folded to create...
US-8,072,050 Semiconductor device with increased I/O leadframe including passive device
In accordance with the present invention, there are provided multiple embodiments of a semiconductor package, each embodiment including a uniquely configured...
US-8,072,049 Polysilicon drift fuse
A polysilicon resistor fuse has an elongated bow-tie body that is wider at the opposite ends relative to a narrow central portion. The opposite ends of the body...
US-8,072,048 Semiconductor apparatus
Disclosed is a semiconductor apparatus that prevents diffusion of materials of a magnetic film during the process for manufacturing the semiconductor apparatus....
US-8,072,047 Integrated circuit package system with shield and tie bar
An integrated circuit package system includes: providing a tie bar and a lead adjacent thereto; connecting an integrated circuit and the lead; mounting a shield...
US-8,072,046 Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode,...
A stacked semiconductor package includes a first semiconductor package having a first semiconductor chip having a first pad and a through-hole passing through a...
US-8,072,045 Extendable connector and network
Extendable connectors are facilitated. According to an example embodiment, an integrated electrical circuit uses a connector that has first and second connected...
US-8,072,044 Semiconductor die containing lateral edge shapes and textures
Methods for singulating a semiconductor wafer into a plurality of individual dies that contain lateral edges or sidewalls and the semiconductor dies formed from...
US-8,072,043 Semiconductor component
A semiconductor component and a method for manufacturing such a semiconductor component which has a resistance behavior which depends heavily on the...
US-8,072,042 Integrated inductor and method for manufacturing an integrated inductor
A method for integrating an inductor into a semiconductor substrate is provided. The method includes providing a semiconductor substrate having a first surface...
US-8,072,041 Passivated optical detectors with full protection layer
In one example, an optoelectronic transducer includes a first contact, a second contact, a passivation layer, and a protection layer. The passivation layer is...
US-8,072,040 Image pickup apparatus, radiation image pickup apparatus and radiation image pickup system
An image pickup apparatus includes light receiving areas arranged two-dimensionally. A vertical scanning circuit comprises unit circuit stages arranged in the...
US-8,072,039 Energy conversion film and quantum dot film comprising quantum dot compound, energy conversion layer including...
An energy conversion film and a quantum dot film which contain a quantum dot compound, an energy conversion layer including the quantum dot film, and a solar...
US-8,072,038 Image sensor
An image sensor having greatly improved physical and electrical bonding forces between a photodiode and a substrate, and a manufacturing method thereof. The...
US-8,072,037 Method and system for electrically coupling a chip to chip package
A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and...
US-8,072,036 Micro-electromechanical system microphone structure
A method of fabricating a micro-electromechanical system microphone structure is disclosed. First, a substrate defining a MEMS region and a logic region is...
US-8,072,035 Semiconductor device and method of manufacturing the same
In an LCD driver, in a high voltage resistant MISFET, end portions of a gate electrode run onto electric field relaxing insulation regions. Wires to become...
US-8,072,034 Array substrate and method of manufacturing the same
According to an embodiment of the invention, an array substrate includes a first test line, a second test line, a first source line group, a second source line...
US-8,072,033 Semiconductor device having elongated electrostatic protection element along long side of semiconductor chip
An electrostatic protection element is disposed commonly to a plurality of output circuits along a long side of an output circuit region. More preferably, the...
US-8,072,032 Semiconductor integrated circuit device having latchup preventing function
Latchup is prevented from occurring accompanying increasingly finer geometries of a chip. NchMOSFET N1 and PchMOSFET P1 form a CMOS circuit including: NchMOSFET...
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