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Patent # Description
US-8,143,204 Mg++ chemistry and method for fouling inhibition in heat processing of liquid foods and industrial processes
The present invention relates to methods for removing or preventing scale formation in a liquid food processing operation. Aqueous antiscalant solutions...
US-8,143,203 Method for washing device substrate
The present invention provides a washing method for a device substrate, capable of sufficiently removing a resist attached to a device substrate, particularly a...
US-8,143,202 Methacrylate copolymer pour point depressants
Poly methacrylate copolymers are disclosed which comprising from about 60 to about 96 weight percent of a C12-C16 alkyl methacrylate and from about 40 to about...
US-8,143,201 Morpholine derivatives as ashless TBN sources and lubricating oil compositions containing same
Morpholine derivatives useful as ashless TBN sources for lubricating oil compositions that are compatible with fluoroelastomeric engine seal materials, and...
US-8,143,200 Enhancement of low temprature performance of group III base stocks by blending with HVI-PAO
A lubricating oil formulation is disclosed inhibiting a pour point of about -45.degree. C. or lower and a Brookfield viscosity at -40.degree. C. of about 60,000...
US-8,143,199 Compositions and methods for water control and strengthening unconsolidated formations
The present invention relates, in general, to subterranean fluids, and more particularly, to subterranean drilling fluids that may be useful for reducing the...
US-8,143,198 Radiation-induced triggering for set-on-command compositions
The present invention relates to compositions useful for isolating a portion of a wellbore. In one embodiment, a composition includes a sealant composition...
US-8,143,197 Aqueous fracturing fluid
The invention concerns an aqueous viscoelastic fracturing fluid for use in the recovery of hydrocarbons. According to the invention, the fluid comprises a...
US-8,143,196 Ceramic microspheres for cementing applications
A method and apparatus for manufacturing ceramic microspheres from industrial slag. The microspheres have a particle size of about 38 microns to about 150...
US-8,143,195 Arrays for bringing two or more reagents in contact with one or more biological targets and methods for making...
An array for bringing two or more reagents in contact with one or more biological targets comprising, two or more reagents; and one or more barriers adapted to...
US-8,143,194 Method for polishing tape-shaped substrate for oxide superconductor, oxide superconductor, and base material...
An oxide superconductor member is composed of a tape-shaped substrate, an intermediate layer formed on this substrate and an oxide superconductor thin film...
US-8,143,193 Active agents combination exhibiting insecticidal and acaricide properties
The novel active compound combinations of cyclic ketoenols of the formula (I) and the active compounds of the formula (II) listed in the description have very...
US-8,143,192 Methods for increasing the resistance of plants to hypoxic conditions
Methods are provided for increasing the resistance of plants to hypoxic or anoxic conditions. Such methods may be applied to increase the penetrance of plant...
US-8,143,191 Thermosensitive recording material
A thermosensitive recording material including a polypropylene film support, a thermosensitive recording layer, a protective layer and a back layer, where the...
US-8,143,190 Honeycomb structure
There is disclosed a honeycomb structure having a plurality of segments and each including a plurality of cells, wherein each segment has a porous base material...
US-8,143,189 Subnanometer and nanometer catalysts, method for preparing size-selected catalysts
Highly uniform cluster based nanocatalysts supported on technologically relevant supports were synthesized for reactions of top industrial relevance. The...
US-8,143,188 Catalyst, its preparation and use
A dehydrogenation catalyst is described that comprises an iron oxide, an alkali metal or compound thereof, and rhenium or a compound thereof. A process for...
US-8,143,187 Catalytic systems and process for treatment of industrial process and waste streams
A process for preparing supported catalyst in pellet or coated monolith form is disclosed the method includes the steps of: forming a mixed metal carbonate...
US-8,143,186 Promoted Fischer-Tropsch catalysts
A catalyst composition comprising cobalt as an active catalytic element and a lesser amount of nickel as a promoter supported on a metal oxide support. The...
US-8,143,185 Photocatalytic deposition of metals and compositions comprising the same
A photocatalytic metal deposition process and a resulting nanocomposite are described. The nanocomposite includes an electrically conducting carbonaceous...
US-8,143,184 Method for the preparation of olefin polymerisation catalyst
The invention is directed to a process for producing an olefin polymerization catalyst wherein a solution of a soluble magnesium complex containing an element...
US-8,143,183 Nano-linked metallocene catalyst compositions and their polymer products
The present invention provides polymerization catalyst compositions employing novel dinuclear metallocene compounds. Methods for making these new dinuclear...
US-8,143,182 Fused ceramic particle
The present invention provides a fused ceramic particle, having the following chemical composition, in percentages by weight based on the oxides and for a total...
US-8,143,181 Nonlinear optic glassy fiber, methods of making and applications of the same
A process for producing an optical glass fiber from crystal-glass phase material. In one embodiment, the process includes the step of providing a molten...
US-8,143,180 Honeycomb cement with ceramic-forming crystallizable glass and method therefor
Disclosed are cements for ceramic honeycomb bodies. Such cements can be applied to a fired ceramic honeycomb body then fired, or can be applied to an unfired...
US-8,143,179 Transparent, colorless titania-free beta-quartz glass-ceramic
The invention relates to a transparent and essentially colorless .beta.-quartz glass-ceramic material which is free of TiO.sub.2, As.sub.2O.sub.3,...
US-8,143,178 Blue beta-quartz glass-ceramic materials, articles made thereof, and fabrication process
The present invention discloses a blue transparent glass-ceramic material comprising .beta.-quartz solid solution as a predominant crystalline phase and process...
US-8,143,177 Nonwoven fabric
It is an objective of the present invention to provide a nonwoven fabric prepared so as to be able to rapidly transfer a predefined liquid. The nonwoven fabric...
US-8,143,176 Textile two or three dimensional fabric containing materials that are capable of swelling
The present invention relates to textile two- or three-dimensional structures formed from fibers and/or ribbons and swellable materials, the fibers and/or...
US-8,143,175 Dry etching method
The invention provides a dry etching method for performing a wiring process on a semiconductor substrate using a plasma etching apparatus, wherein the wiring...
US-8,143,174 Post-deposition treatment to enhance properties of Si-O-C low K films
A method for providing a dielectric film having enhanced adhesion and stability. The method includes a post deposition treatment that densifies the film in a...
US-8,143,173 Method for manufacturing semiconductor device
A method for manufacturing a semiconductor device includes: (a) forming a stress relaxation layer on a first surface having an electrode of a semiconductor...
US-8,143,172 Printable etching media for silicon dioxide and silicon nitride layers
The present invention relates to a novel printable etching medium having non-Newtonian flow behavior for the etching of surfaces in the production of solar...
US-8,143,171 Method for manufacturing semiconductor device and computer readable medium for storing pattern size setting program
A method of manufacturing a semiconductor device, which forms a pattern by performing pattern transformation steps multiple times, comprises setting finished...
US-8,143,170 Manufacturing method of semiconductor device
A single crystal semiconductor layer is provided over a base substrate with a second insulating film, a first conductive film, and a first insulating film...
US-8,143,169 Methods for multi-stage molding of integrated circuit package
Methods for providing an integrated circuit using a multi-stage molding process to protect wirebonds. In one embodiment, a method includes attaching a die to a...
US-8,143,168 Etching method and manufacturing method of semiconductor device
The present invention discloses technique of etching selectively a layer containing siloxane. The present invention provides a semiconductor device with reduced...
US-8,143,167 Fabrication processes for forming dual depth trenches using a dry etch that deposits a polymer
Trench isolation structures and methods to form same for use in the manufacture of semiconductor devices are described. The trench isolation structures are...
US-8,143,166 Polishing method with inert gas injection
A polishing process in a semiconductor device fabrication process employs a polishing composition in which a gaseous phase is created within the polishing...
US-8,143,165 Method for fabricating semiconductor devices using strained silicon bearing material
A method of manufacturing an integrated circuit on semiconductor substrates, e.g., silicon wafer. The method includes providing a semiconductor substrate...
US-8,143,164 Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
Embodiments of the current invention describe methods of processing a semiconductor substrate that include applying a zincating solution to the semiconductor...
US-8,143,163 Method for forming pattern of semiconductor device
A method for manufacturing a semiconductor device comprises performing a CMP process using an oxide film as an etching barrier film to maintain a polysilicon...
US-8,143,162 Interconnect structure having a silicide/germanide cap layer
An interconnect structure of an integrated circuit and a method for forming the same are provided. The interconnect structure includes a semiconductor...
US-8,143,161 Method for passivating hardware of a microelectronic topography processing chamber
An apparatus for processing microelectronic topographies, a method of use of such an apparatus, and a method for passivating hardware of microelectronic...
US-8,143,160 Method of forming a contact plug of a semiconductor device
In a method of forming a contact plug of a semiconductor device, a nitride layer is prevented from being broken by forming a passivation layer over the nitride...
US-8,143,159 Fabrication of interconnects in a low-k interlayer dielectrics
A method for forming deep lithographic interconnects between a first metal and a second metal is provided. The method comprises depositing a first insulator...
US-8,143,158 Method and device of preventing delamination of semiconductor layers
Embodiments of the present invention describe a method and device of preventing delamination of semiconductor layers in a semiconductor device. The...
US-8,143,157 Fabrication of a diffusion barrier cap on copper containing conductive elements
A method for fabricating a self-aligned diffusion-barrier cap on a Cu-containing conductive element in an integrated-circuit device comprises:--providing a...
US-8,143,156 Methods of forming high density semiconductor devices using recursive spacer technique
High density semiconductor devices and methods of fabricating the same are disclosed. Spacer fabrication techniques are utilized to form circuit elements having...
US-8,143,155 Wire bonding method and semiconductor device
After forming a pressure-bonded ball and a ball neck by bonding an initial ball to a pad, a capillary is moved upward, away from a lead, and then downward,...
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