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Patent # Description
US-8,143,104 Method for manufacturing ball grid array package stacking system
A method for manufacturing a ball grid array package stacking system includes: providing a base substrate; coupling an integrated circuit to the base substrate;...
US-8,143,103 Package stacking system with mold contamination prevention and method for manufacturing thereof
A method for manufacturing a package stacking system includes: providing a package substrate; mounting an integrated circuit over the package substrate; forming...
US-8,143,102 Integrated circuit package system including die having relieved active region
An integrated circuit package system includes: providing a substrate; attaching a base die to the substrate, the base die having a relief region with a shaped...
US-8,143,101 Semiconductor package and the method of making the same
The present invention relates to semiconductor package and the method of making the same. The method of the invention comprises the following steps: (a)...
US-8,143,100 Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages
A method for making a semiconductor multi-package module includes; providing a lower molded package including a lower substrate and a die, affixing an upper...
US-8,143,099 Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer
The present invention relates to a method of manufacturing a semiconductor package capable of simplifying a process and remarkably reducing a production cost by...
US-8,143,098 Integrated circuit packaging system with interposer and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing an interposer having device contacts, interconnect contacts, and test pads...
US-8,143,097 Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
A semiconductor device is made by mounting a semiconductor wafer to a temporary carrier. A plurality of TSV is formed through the wafer. A cavity is formed...
US-8,143,096 Integrated circuit package system flip chip
An integrated circuit package system includes: providing a substrate having a top side with a trace conductor connected to a bottom side with a system...
US-8,143,095 Sequential fabrication of vertical conductive interconnects in capped chips
A method is provided of forming a capped chip which includes a conductive interconnect exposed through an opening in the cap. A cap having openings extending...
US-8,143,094 Silicon carbide semiconductor device and manufacturing method thereof
A manufacturing method of a silicon carbide semiconductor device in which an electric field applied to a gate oxide film can be relaxed and thereby reliability...
US-8,143,093 Process to make metal oxide thin film transistor array with etch stopping layer
The present invention generally relates to thin film transistors (TFTs) and methods of making TFTs. The active channel of the TFT may comprise one or more...
US-8,143,092 Methods for forming resistive switching memory elements by heating deposited layers
Resistive switching nonvolatile memory elements are provided. A metal-containing layer and an oxide layer for a memory element can be heated using rapid thermal...
US-8,143,091 Method for realizing a thin film organic electronic device and corresponding device
A method realizes a thin film organic electronic device integrated on a substrate and includes an organic material layer and an organic thin film transistor or...
US-8,143,090 Method of fabricating photo sensor
A method of fabricating a photo sensor includes the following steps. First, a substrate is provided, having a conductive layer, a buffer dielectric layer, a...
US-8,143,089 Self-align planerized bottom electrode phase change memory and manufacturing method
A method is described for self-aligning a bottom electrode in a phase change random access memory PCRAM device where a top electrode serves as a mask for...
US-8,143,087 Method of manufacturing photoelectric conversion device
A fragile layer is formed in a region at a depth of less than 1000 nm from one surface of a single crystal semiconductor substrate, and a first impurity...
US-8,143,086 Optically controlled electrical-switch device based upon carbon nanotubes and electrical-switch system using...
Described herein is an optically controlled electrical-switch device which includes a first current-conduction terminal and a second current-conduction...
US-8,143,085 Dye-sensitized solar cell and method for manufacturing the same
Provided is a dye-sensitized solar cell. Specifically, the present invention provides a dye-sensitized solar cell which is designed to reduce the production...
US-8,143,084 Image sensing device and manufacture method thereof
An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes...
US-8,143,083 Physical quantity sensor device and method for producing the same
A circuit board is mounted on a package via an adhesive agent as an elastic member. A sensor element is stacked in fixed relation onto the circuit board. The...
US-8,143,082 Wafer bonding of micro-electro mechanical systems to active circuitry
A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first...
US-8,143,081 Method for dicing a diced optoelectronic semiconductor wafer
A method for dicing an optoelectronic semiconductor wafer has steps of preparing an optoelectronic semiconductor wafer, laser scribing, diamond saw dicing and...
US-8,143,080 Method for manufacturing LED package and substrate thereof
A method for manufacturing a number of LED packages includes following steps: providing an electrode plate and at least one insulating plate; thermally pressing...
US-8,143,079 Silicon nanoparticle white light emitting device
Multiple films of red-green-blue (RGB) luminescent silicon nanoparticles are integrated in a cascade configuration as a top coating in an ultraviolet/blue light...
US-8,143,078 Methods for monitoring the amount of contamination imparted into semiconductor wafers during wafer processing
Methods are disclosed for monitoring the amount of metal contamination imparted during wafer processing operations such as polishing and cleaning. The methods...
US-8,143,077 Microchip and method of manufacturing microchip
A microchip formed by joining a first substrate having at least one recess on its surface and a second substrate, wherein small projections of 0.5 to 30 .mu.m...
US-8,143,076 Manufacture of defect cards for semiconductor dies
A method for producing a defect card for individual dies located on a wafer, comprising: producing first and second defect cards, where the defective individual...
US-8,143,075 Semiconductor manufacture method
A semiconductor device manufacture method has the steps of: (a) forming a semiconductor device structure in a chip and alignment marks, respectively in a...
US-8,143,074 Semiconductor processing system and method of processing a semiconductor wafer
A method of processing semiconductor wafers includes applying reactive gas through a plurality of inlets to the semiconductor wafers. The method further...
US-8,143,073 Apparatus for carrying out an analysis process, in particular for identification of biochemical molecules, and...
An apparatus is disclosed for carrying out an analysis process, in which probe molecules which are immobilized on a substrate within an analysis area are...
US-8,143,072 System for detecting nanoparticles using modulated surface plasmon resonance
A method and system for detecting magnetic nanoparticles include measuring a magneto-optical enhancement of the plasmon absorption in the optical response.
US-8,143,071 Method and device for extracting an analyte
The invention provides columns and methods for the purification and concentration of an analyte (e.g., a biological macromolecule, such as a peptide, protein or...
US-8,143,070 Optical cell
A use composition monitor determines the concentration of peracid and/or peroxide in a use composition using a kinetic assay procedure. A sample mixture...
US-8,143,069 Fluorescent probe and method of measuring hypochlorite ion
A compound represented by the following general formula (II): ##STR00001## wherein R.sup.21 represents hydrogen atom or one to four monovalent substituents...
US-8,143,068 Oxidation resistant indicator molecules
Compounds having enhanced oxidation stability are disclosed. The compounds have an aryl boronic acid residue having one or more electron withdrawing groups on...
US-8,143,067 Hydrophilic, high protein binding, low fluorescence, western blotting membrane
Hydrophilic membrane particularly suited for blotting applications, preferably Western blotting. A pre-wet hydrophobic membrane substrate, preferably made of...
US-8,143,066 Methods and apparatus for performing retention-time matching
A method (100) for analyzing chemicals includes fractionating a complex sample into at least two sample portions that each includes portions of two polypeptides...
US-8,143,065 Specimen processing device, specimen conveyance device, and specimen conveyance method
A specimen processing device comprising: a specimen processing unit for processing specimens; a first conveyance mechanism for conveying specimens from a...
US-8,143,064 Reagents and methods for classifying leukocytes
A reagent for classification of leukocytes includes (a) at least two cationic surfactants; (b) at least one organic compound bearing a hydrophobic group and an...
US-8,143,063 Method for warning of radiological and chemical agents using detection paints on a vehicle surface
A paint that warns of radiological or chemical substances comprising a paint operatively connected to the surface, an indicator material carried by the paint...
US-8,143,062 Method and composition for enhancing weight loss
Compositions for enhancing satiety and weight loss in an individual, assays for assessing a tastant for enhancing satiety and weight loss, and methods of using...
US-8,143,061 Industrial method for producing RNA and system for carrying out said method
The invention relates to an industrial method for producing an interest heterologous RNA and to a system for carrying out said production method consisting (1)...
US-8,143,060 Method of assessing the viability of thawed developmentally competent embryos
The invention relates to a method of assessing the viability of a thawed cell wherein the cell is a gamete, an embryo, a karyoplast, a putative stem cell...
US-8,143,059 Method for identification of cell growth or differentiation factors
The present invention relates to novel immortalized precursor cell populations derived from embryonic stem cell populations and methods to produce such cell...
US-8,143,058 Human CDR-grafted antibody and antibody fragment thereof
A human CDR-grafted antibody or the antibody fragment thereof which specifically reacts with the extracellular region of human CC chemokine receptor 4 (CCR4)...
US-8,143,057 Chelating agents and highly luminescent and stable chelates and their use
This invention relates to a group of novel chelating agents, novel chelates, biomolecules labeled with said chelates or chelating agents as well as solid...
US-8,143,056 Vascular adhesion molecules and modulation of their function
The invention relates to new polypeptides in isolated form belonging to a subfamily of the human immunoglobulin superfamily, which polypeptide shows at least...
US-8,143,055 Self-assembling multicellular bodies and methods of producing a three-dimensional biological structure using...
Structures and methods for tissue engineering include a multicellular body including a plurality of living cells. A plurality of multicellular bodies can be...
US-8,143,054 Fusion protein of HIV regulatory/accessory proteins
The invention relates to fusion proteins comprising the amino acid sequence of at least three HIV proteins selected from Vif, Vpr, Vpu, Rev, and Tat or...
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