Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-9,312,173 Self-limiting silicide in highly scaled fin technology
A method of forming a metal semiconductor alloy on a fin structure that includes forming a semiconductor material layer of a polycrystalline crystal structure...
US-9,312,172 Semiconductor device and method for making same
One or more embodiments relate to a semiconductor device that includes: a conductive layer including a sidewall; a conductive capping layer disposed over the...
US-9,312,171 Semiconductor devices having through-electrodes and methods for fabricating the same
The present inventive concepts provide semiconductor devices and methods for fabricating the same. The method includes forming an inter-metal dielectric layer...
US-9,312,170 Metal on elongated contacts
An integrated circuit containing elongated contacts, including elongated contacts which connect to at least three active areas and/or MOS gates, and including...
US-9,312,169 Interconnection of several levels of a stack of supports for electronic components
Method for producing a microelectronic device formed from a stack of supports (W) each provided with one or more electronic components (C) and comprising a...
US-9,312,168 Air gap structure integration using a processing system
A method for forming an air gap structure in an integrated layer stack includes dry etching a mold layer disposed on the stack in a processing system under...
US-9,312,167 Air-gap structure formation with ultra low-k dielectric layer on PECVD low-k chamber
Methods for reducing the k value of a layer using air gaps and devices produced by said methods are disclosed herein. Methods disclosed herein can include...
US-9,312,166 Method for manufacturing composite wafers
This invention provides a method for manufacturing composite wafers in which at least two composite wafers can be obtained from one donor wafer, and in which...
US-9,312,165 Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group...
A group III nitride composite substrate includes a group III nitride film and a support substrate formed from a material different in chemical composition from...
US-9,312,164 Localized region of isolated silicon over dielectric mesa
An integrated circuit is formed by forming an isolation mesa over a single crystal substrate which includes silicon, and forming a first epitaxial layer on the...
US-9,312,163 Impurity-doped layer formation apparatus and electrostatic chuck protection method
An electrostatic chuck protection method includes providing an exposed chuck surface with a protective surface for preventing adherence of foreign materials...
US-9,312,162 Dicing sheet and a production method of a semiconductor chip
A dicing sheet includes a base, an intermediate layer on one face of the base, and an pressure sensitive adhesive layer provided on the intermediate layer and...
US-9,312,161 Accommodating device for retaining wafers
A receiving means for receiving and mounting of wafers. The receiving means includes a mounting surface. A mounting means is provided for mounting a wafer on...
US-9,312,160 Wafer suction method, wafer suction stage, and wafer suction system
A method of attaching a wafer by suction, includes a step of mounting a wafer on a right arm and a left arm of a transfer jig, moving the transfer jig toward a...
US-9,312,159 Transport apparatus and exposure apparatus
A substrate is transported between a first space and a second space, which are separated by a partition wall, through an opening portion formed in the partition...
US-9,312,158 Article transport vehicle with linkage mechanism
An article transport vehicle is provided which can prevent a lid from falling from the container gripped by grip portions and which can prevent increase in the...
US-9,312,157 Wafer carrier
A front opening wafer container suitable for large wafers such as 450 mm utilizes componentry with separate fasteners to lock the componentry together in an...
US-9,312,156 Thin film transistor
A thin film transistor includes a gate electrode; a gate insulating layer which is provided to cover the gate electrode; a semiconductor layer which is provided...
US-9,312,155 High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
A wafer-processing apparatus includes: eight or ten reactors with identical capacity for processing wafers on the same plane, constituting four or five discrete...
US-9,312,154 CVD apparatus for improved film thickness non-uniformity and particle performance
Embodiments of the invention provide improved apparatus for depositing layers on substrates, such as by chemical vapor deposition (CVD). The inventive apparatus...
US-9,312,153 Substrate processing system, transfer module, substrate processing method, and method for manufacturing...
A substrate processing system is provided with: a first transfer unit, which extends from a loader module to a first processing chamber for processing...
US-9,312,152 Recirculation substrate container purging systems and methods
Methods and systems to reduce the consumption of purge gas for semiconductor substrate containers. The recirculation purging system recycles purge gas back to...
US-9,312,151 Method of manufacturing semiconductor device and method of manufacturing electronic device including an...
A method of manufacturing a semiconductor device, includes: providing a first adhesive layer on a support member; providing a film on the first adhesive layer;...
US-9,312,150 Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a...
A method for forming metallurgical interconnections and polymer adhesion of a flip chip to a substrate includes providing a chip having a set of bumps formed on...
US-9,312,149 Method for forming chip-on-wafer assembly
A device includes a bottom chip and an active top die bonded to the bottom chip. A dummy die is attached to the bottom chip. The dummy die is electrically...
US-9,312,148 Method of packaging a semiconductor device
A method of packaging a semiconductor device includes forming an insulating layer over a semiconductor device, wherein the semiconductor device has a contact...
US-9,312,147 Phase changing on-chip thermal heat sink
A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the...
US-9,312,146 Manufacturing method of a thin film transistor
Embodiments of the invention provide a thin film transistor and a manufacturing method thereof and a display device. The thin film transistor includes a gate...
US-9,312,145 Conformal nitridation of one or more fin-type transistor layers
Fin-type transistor fabrication methods and structures are provided having one or more nitrided conformal layers, to improve reliability of the semiconductor...
US-9,312,144 Composition for forming a silicon-containing resist under layer film and patterning process
A composition for forming a silicon-containing resist under layer film includes a silicon-containing compound which is obtained by hydrolysis, condensation or...
US-9,312,143 Formation of isolation surrounding well implantation
Embodiments of present invention provide a method of making well isolations. The method includes forming a hard-mask layer on top of said substrate; forming a...
US-9,312,142 Chemical mechanical polishing method and apparatus
Methods for polishing a semiconductor wafer using a pad resurfacing arm and an apparatus therefor are disclosed. Embodiments may include providing a...
US-9,312,141 Vapor phase chemical mechanical polishing of magnetic recording disks
A method for polishing a carbon overcoat of a magnetic media that results in a smooth surface free of carbon cluster debris. The method involves forming a...
US-9,312,140 Semiconductor structures having low resistance paths throughout a wafer
A semiconductor structure with low resistance conduction paths and methods of manufacture are disclosed. The method includes forming at least one low resistance...
US-9,312,139 Semiconductor element having conductive damascene structures extending perpendicular to doping strips, and...
A semiconductor element and a manufacturing method of the same are provided. The semiconductor element includes a substrate, a plurality of doping strips, a...
US-9,312,138 Method for forming gate dielectric layer
A method for forming a semiconductor device is provided. The method includes providing a semiconductor substrate. The method includes forming a buffer layer...
US-9,312,137 Reduction of native oxides by annealing in reducing gas or plasma
Native oxide growth on germanium, silicon germanium, and InGaAs undesirably affects CET (capacitive equivalent thickness) and EOT (effective oxide thickness) of...
US-9,312,136 Replacement metal gate stack for diffusion prevention
A method of forming a semiconductor structure includes depositing a gate dielectric layer lining a recess of a gate structure formed on a substrate with a first...
US-9,312,135 Method of manufacturing semiconductor devices including generating and annealing radiation-induced crystal defects
The generation of auxiliary crystal defects is induced in a semiconductor substrate. Then the semiconductor substrate is pre-annealed at a temperature above a...
US-9,312,134 Nonvolatile semiconductor memory device and method for manufacturing same
A nonvolatile semiconductor memory device, includes: a stacked structural unit including a plurality of insulating films alternately stacked with a plurality of...
US-9,312,133 Wafer structure for electronic integrated circuit manufacturing
A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device...
US-9,312,132 Method of forming high-density arrays of nanostructures
A method for forming nanostructures includes bonding a flexible substrate to a crystalline semiconductor layer having a two-dimensional material formed on a...
US-9,312,131 Selective epitaxial formation of semiconductive films
Epitaxial layers are selectively formed in semiconductor windows by a cyclical process of repeated blanket deposition and selective etching. The blanket...
US-9,312,130 Surface doping and bandgap tunability in hydrogenated graphene
A method of introducing a bandgap in single layer graphite on a SiO.sub.2 substrate comprising the steps of preparing graphene flakes and CVD grown graphene...
US-9,312,129 Group III-V substrate material with particular crystallographic features and methods of making
A method of forming a semiconductor substrate including providing a base substrate including a semiconductor material, and forming a first semiconductor layer...
US-9,312,128 Compound semiconductor integrated circuit and method to fabricate same
A structure includes a substrate having a surface and a first transistor disposed in a first region supported by the surface of the substrate. The first...
US-9,312,127 Method for producing semiconductor apparatus substrate
A method for producing a semiconductor apparatus substrate includes steps of: forming silicon-containing film having silicon content of 1% by mass or more and...
US-9,312,126 Method for processing gate dielectric layer deposited on germanium-based or group III-V compound-based substrate
The present invention discloses a method for processing a gate dielectric layer deposited on a germanium-based or Group III-V compound-based substrate,...
US-9,312,125 Cyclic deposition method for thin film formation, semiconductor manufacturing method, and semiconductor device
A cyclic deposition method for thin film formation includes forming a silicon thin film on an object by injecting a silicon precursor into a chamber in which...
US-9,312,124 Methods of fabricating gate insulating layers in gate trenches and methods of fabricating semiconductor devices...
A method of fabricating a semiconductor device may include: forming a field region defining an active region in a substrate; forming a gate trench in which the...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.