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Electronic control apparatus for vehicle using sloped structure and method
The present disclosure relates to an electronic control apparatus for a vehicle using a sloped structure, and a manufacturing method thereof, in which an...
Universal/portable cable support and EMI reduction bar
A Universal/Portable Cable Support and EMI Reduction Bar which to attenuate electromagnetic interference on the input/output cables of the electronics rack...
Dispensible electrical gasket, electronic module having dispensible
electrical gasket, and method of...
An electronic module and method of making an electronic module include a printed circuit board (PCB) having a surface, at least one conductive trace being...
Power converter performing evaporative cooling of a switching element
A power converter, which performs cooling of a switching element by using a boiling cooling apparatus that makes use of a boiling phenomenon of a coolant...
Electronic control apparatus for vehicle using overmolding and
manufacturing method thereof
The present disclosures provides an electronic control apparatus for a vehicle using overmolding in which a heat radiating plate is attached to an opposite side...
Multi-level redundant cooling method for continuous cooling of an
A cooling method is provided to remove heat generated by one or more electronic systems. The method includes providing a coolant-based cooling apparatus,...
Multi-level redundant cooling system for continuous cooling of an
A cooling system is provided to remove heat generated by one or more electronic systems. The cooling system includes a coolant-based cooling apparatus,...
Managing data center airflow
Techniques for cooling a data center include operating an air handling system in a first mode of operation to provide an outside airflow cooled through a direct...
Cold air containment system in a data centre
A method is provided for containing cold air in a corridor created on the side of a computer cabinet. The method includes providing a base mountable on the...
Header panel assembly for preventing air circulation above electronic
A hot/cold aisle containment system includes a frame structure, at least one electronic equipment enclosure installed at least partially within the frame...
Cooling heat-generating electronics
A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in...
Pluggable module housing assembly
A pluggable module housing assembly comprises a base at least partially surrounding a socket having an entrance sized and dimensioned to receive a pluggable...
Heat sinking pad and printed circuit board
The present invention relates to a heat sinking pad and a printed circuit board. The surface of the heat sinking pad on which electronic components are placed...
Multi-component heatsink with self-adjusting pin fins
A heatsink includes a rigid plate and a plurality of pin fins. The plate has a two dimensional array of holes through the rigid plate from a first face to a...
Power electronics system with liquid cooling system
A power electronics system includes a multipart housing having three housing elements of cuboid basic structure to define a central element with inlet and...
Chip stack structures that implement two-phase cooling with radial flow
A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack...
Direct coolant contact vapor condensing
Cooling apparatuses and methods are provided facilitating transfer of heat from a working fluid to a coolant. The cooling apparatus includes a vapor condenser...
Radiator, electronic apparatus and cooling apparatus
A radiator includes a header including a supply chamber for a coolant to cool an electronic part mounted on a circuit board and a discharge chamber partitioned...
Cooling device for electronic machine
A cooling device for an electronic machine includes an airflow channel through which external air passes, an air inlet duct through which external air is...
Thermal plate with optional cooling loop in electronic display
Disclosed is a thermal plate assembly and method for cooling an electronic display. The thermal plate may contain a first portion which is in thermal...
Cooled electrical assembly
A cooled electrical assembly is disclosed which includes a plurality of cooled components and a first cooling fan adapted to provide a cooling flow for cooling...
An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the...
Slide assemblies that include at least an inner slide segment and an outer slide segment. Many of the slide assemblies also include an intermediate slide...
Connector alignment system
A stacked connector alignment system includes a board with processor and a board connector coupled to the processor. An alignment element is mounted to the...
Electronic device storage case
An electronic device storage case for use in storing a substrate therein, includes a hollow box-shaped case body. The case body includes an open surface with an...
A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the...
Multiple configuration electronic thermometer
A plurality of custom thermometer models are manufactured from a universal clinical thermometer core. The thermometer core includes a housing, a controller...
Alignment device of a hard disk drive bay
An alignment device of a hard disk drive (HDD) bay has a casing, at least one door, and at least one alignment mechanism. The at least one door is mounted on a...
Mobile identification indicator
The invention relates to a mobile identification indicator (1) for locking and unlocking a closure device of a motor vehicle, comprising an electronic unit (6)...
Modular housing system
The invention relates to a modular housing system for accommodating electronic circuits, in particular telematics units. Said system comprises at least one...
Unitary housing for electronic device
An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part...
Retractable storage system for handheld electronic device
A retractable storage system for handheld electronic device has a plug head actuation system to operably connect or disconnect the plug head and one or more...
Wiring board and method of manufacturing wiring board
A wiring board includes a first wiring layer including a first conductive layer and a second conductive layer coating a first surface and a side surface of the...
Method of manufacturing printed wiring board
A method of manufacturing a printed wiring board (10) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through...
Conductive structures for microfeature devices and methods for fabricating
Methods for fabricating conductive structures on and/or in interposing devices and microfeature devices that are formed using such methods are disclosed herein....
Printed wiring board
A printed wiring board includes an insulative resin substrate having a penetrating hole, a first conductive layer formed on first surface of the substrate, a...
Method for manufacturing a double-sided printed circuit board
Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the...
Low viscosity polymeric printing solutions and electronic components
bearing polyimide based upon the low...
An electrical component that includes a substrate and a polymeric layer oriented in working relation with the substrate, the polymeric layer including a low...
Method for electrophoretically depositing a film on an electronic assembly
A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a...
Double-layered transparent conductive film and manufacturing method
A double-layered transparent conductive film includes: a first substrate; a first imprint adhesive layer formed on the first substrate, the first imprint...
Method for forming copper wiring
There is provided a Cu wiring forming method for forming a Cu wiring by filling Cu in a recess, which is formed in a predetermined pattern in a Si-containing...
Wiring substrate and manufacturing method of wiring substrate
A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core,...
Substrate having electronic component embedded therein and method of
manufacturing the same
A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns...
Electronic component and electronic component package
An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection...
Slot-mounted printed circuit board having small insertion force
A printed circuit board (PCB) prevents damage to tabs of the PCB and pins of a slot by reducing insertion force when the PCB is inserted in the slot. The PCB...
Attenuation reduction structure for high frequency signal contact pads of
An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of...
Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel,...
Embodiments of the present packages comprise a package body that is made of an insulating material, has a front surface and a back surface, and has a...
Conductive film, manufacturing method thereof, and touch screen having the
A conductive film includes a substrate, a first matrix layer, a first conductive layer, a second matrix layer, and a second conductive layer. The substrate...
Substrate structure and manufacturing method thereof
A manufacturing method of a substrate structure includes the following steps. A substrate including a supporting layer, two release layers and two base metal...