At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.
Vertical memory devices and methods of manufacturing the same
A vertical memory device including a substrate including first regions and a second region; a plurality of channels in the first regions, the plurality of...
Non-volatile memory device having a multilayer block insulating film to
suppress gate leakage current
According to one embodiment, a non-volatile memory device includes electrodes, one semiconductor layer, conductive layers, and first and second insulating...
Three-dimensional vertical gate NAND flash memory including dual-polarity
A memory includes a three-dimensional array including a plurality of levels is described. Each level includes a bit line pad, a source line pad, and a plurality...
Memory devices having semiconductor patterns on a substrate and methods of
manufacturing the same
A memory device may include a plurality of semiconductor patterns on a substrate including a plurality of first impurity regions doped at a first impurity...
Method for manufacturing a semiconductor device
The performances of a semiconductor device are improved. In a method for manufacturing a semiconductor device, in a memory cell region, a control gate electrode...
Semiconductor device and a manufacturing method thereof
The performances of a semiconductor device are improved. The semiconductor device has a first control gate electrode and a second control gate electrode spaced...
Method of fabricating a memory structure
The present invention provides a method of fabricating a memory structure, especially forming an oxide on top of a spacer to prevent the spacer from being...
Semiconductor integrated circuit device and a method of manufacturing the
A semiconductor device including a memory cell featuring a first gate insulating film over a semiconductor substrate, a control gate electrode over the first...
Utilization of block-mask and cut-mask for forming metal routing in an IC
A method of forming metal routing in an IC device utilizing a cut mask in conjunction with a block mask is disclosed. Embodiments include forming a hard-mask...
Pitch-halving integrated circuit process
A pitch-halving IC process is described. Parallel base line patterns are formed over a substrate, each being connected with a hammerhead pattern at a first or...
Meander line resistor structure
A method comprises implanting ions in a substrate to form a first active region and a second active region, depositing a first dielectric layer over the...
Three dimensional multilayer circuit
A three dimensional multilayer circuit (600) includes a plurality of crossbar arrays (512) made up of intersecting crossbar segments (410, 420) and programmable...
High mobility transistors
An integrated circuit containing an n-channel finFET and a p-channel finFET has a dielectric layer over a silicon substrate. The fins of the finFETs have...
Semiconductor device and fabricating method thereof
A semiconductor device includes an interlayer insulating film formed on a substrate and including a trench, a gate insulating film formed in the trench, a work...
Flip-flop layout architecture implementation for semiconductor device
A semiconductor device includes a substrate including PMOSFET and NMOSFET regions. First and second gate electrodes are provided on the PMOSFET region, and...
In one embodiment, a semiconductor device includes a semiconductor substrate, and first and second transistors of first and second conductivity types on the...
Eliminating field oxide loss prior to FinFET source/drain epitaxial growth
Method for forming FinFET source/drain regions with reduced field oxide loss and the resulting devices are disclosed. Embodiments include forming silicon fins...
Integrated circuit and related manufacturing method
A method for manufacturing an integrated circuit may include the following steps: forming a first transistor, which includes a first active region; forming a...
Semiconductor device and method of manufacturing semiconductor device
A first transistor includes a first impurity layer of a first conduction type formed in a first region of a semiconductor substrate, a first epitaxial...
Very planar gate cut post replacement gate process
A semiconductor structure with improved gate planarity and method of fabrication are provided. In a replacement gate scheme, an array of sacrificial gate...
Self-aligned gate contact structure
Embodiments of present invention provide a method of forming a semiconductor device. The method includes depositing a layer of metal over one or more channel...
Power semiconductor device
An exemplary power semiconductor device with a wafer having an emitter electrode on an emitter side and a collector electrode on a collector side, an (n-) doped...
Integrated circuits and methods of design and manufacture thereof
Integrated circuits and methods of manufacture and design thereof are disclosed. For example, a method of manufacturing includes using a first mask to pattern a...
Method of making an integrated switchable capacitive device
A method is provided for forming an integrated circuit chip with a variable capacitor disposed in a metallization. A back end of line metallization is formed...
Lateral bipolar junction transistor
A lateral bipolar junction transistor includes an emitter region; a base region surrounding the emitter region; a gate disposed at least over a portion of the...
Electronic device, circuit and method for trimming electronic components
A circuit comprises a plurality of electronic components integrated on a substrate, and a trim arrangement arranged to provide trim data to a respective...
High-performance device for protection from electrostatic discharge
The semiconductor device for protection from electrostatic discharges comprises several modules (MDi) for protection from electrostatic discharges comprising...
A photoelectric device includes a base, an LED (light emitting diode) element and a zener diode. The base includes a first electrode and a second electrode. The...
Diode circuit layout topology with reduced lateral parasitic bipolar
Diode circuit layout topologies and methods are disclosed that exhibit reduced lateral parasitic bipolar characteristics at lateral parasitic bipolar circuit...
Semiconductor device and method of forming shielding layer over integrated
passive device using conductive channels
A semiconductor device is made by providing a substrate, forming a first insulation layer over the substrate, forming a first conductive layer over the first...
The semiconductor device 100 comprises a first semiconductor element 113 provided on a face on one side of a flat plate shaped interconnect component 101, an...
Multi-chip structure and method of forming same
A device comprises a first chip and a second chip stacked together to form a multi-chip structure, wherein the multi-chip structure is embedded in an...
Chip-on-heatsink light emitting diode package and fabrication method
The present disclosure provides a novel light-emitting diode package and corresponding fabrication method for making such a package. The novel LED package...
Package-on-package devices, methods of fabricating the same, and
In a package-on-package (PoP) device according to the inventive concepts, an anisotropic conductive film is disposed between a lower semiconductor package and...
Method of tuning color temperature of light-emitting device
A method of tuning color temperature of light-emitting device having an overall color temperature, comprising: providing a carrier; disposing at least two LED...
A light-emitting diode (LED) is provided. An LED die includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a first...
Folded 3-D light sheets containing printed LEDs
A method of forming a light sheet includes printing a layer of inorganic LEDs on a first conductive surface of a substrate, depositing a first dielectric layer,...
Transparent LED layer between phosphor layer and light exit surface of
A flexible light sheet lamp includes a thin substrate and an array of printed microscopic vertical LEDs (VLEDs) sandwiched between a transparent first conductor...
An optoelectronic device comprising: a substrate; a plurality of semiconductor units electrically connected with each other and disposed jointly on the...
Signal delivery in stacked device
Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a...
Chip-on-film (COF) tape and corresponding COF bonding method
The present invention provides a chip-on-film (COF) tape and a corresponding COF bonding method. The COF tape comprises a base tape, a plurality of first COFs...
Embedded packages having a connection joint group
An embedded package includes a first semiconductor chip embedded in a package substrate, a second semiconductor chip disposed over a first surface of the...
Wafer-level passive device integration
A device and fabrication techniques are described that employ wafer-level packaging techniques to fabricate semiconductor devices that include an embedded...
Semiconductor chips having improved solidity, semiconductor packages
including the same and methods of...
Semiconductor chips are provided. The semiconductor chip includes a semiconductor chip body having an arch-shaped groove in a backside thereof and a...
Semiconductor device and method of manufacturing the same
There is provided a semiconductor device having a converter circuit, a brake circuit and an inverter circuit and manufacturable by a simplified manufacturing...
Semiconductor device and manufacturing method thereof
A manufacturing method of a semiconductor device according to the present invention includes the steps of (a) preparing an insulating or conductive substrate;...
Semiconductor package and method of manufacturing the same
In one embodiment, a semiconductor package includes a circuit substrate, a plurality of semiconductor chips stacked on the circuit substrate, insulating...
Method and system for height registration during chip bonding
A method of fabricating a composite semiconductor structure is provided. Pedestals are formed in a recess of a first substrate. A second substrate is then...
A method for making a microelectronic package includes the steps of providing a microelectronic assembly that further includes a substrate with a plurality of...
Solder attach apparatus and method
An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder...