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Lower supporting pin layout determination apparatus and lower supporting
pin layout determination method
A lower supporting pin module 22 is given a shape having a contact surface 26a. On the occasion of position recognition for determining a position of a pin on...
Electronic component mounting apparatus
An electronic component mounting apparatus includes a loading unit which loads a printed circuit board. This apparatus includes a first substrate moving unit...
Electronic component mounting system
A substrate standby unit that is capable of keeping only one substrate 4 on standby in a substrate sorting mechanism 40 that moves the substrate 4 from the...
Method of mounting electronic parts
In an electronic component mounting method, electronic components are picked up from a component supply unit in which first and second tray supply mechanisms...
Electronic component mounting system
In a case where a solder amount of a solder portion printed on an electrode does not meet a reference amount, solder is additionally applied to a center...
Electrical gasket and electronic module having electrical gasket
An electrical gasket provides an electrical seal between first and second components in an electrical module. The electrical gasket includes an attachment...
Fan assembly for rack optimized server computers
A fan assembly for an electrical device which comprises a number of heat generating electrical components mounted in an enclosure that includes a front wall, a...
Cold air containment system in a data centre
A system is provided for containing cold air in a corridor created on the side of a computer cabinet, comprising a base mountable on the computer cabinet, and a...
In an electronic device, a substrate mounting unit is provided at a front side inside a housing, and contains a plurality of electronic substrates under a state...
Sealed battery charger housing
A housing or other enclosure used to facilitate fluid cooling of a circuitry of a battery charger, such as but not limited to a battery charger of the type used...
Heat dissipating assembly and electronic device using the same
A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly...
Field-replaceable bank of immersion-cooled electronic components
A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes...
Surface modification of hoses to reduce depletion of corrosion inhibitor
An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a...
Electronic product including a heat dissipating device
An electronic product including a heat dissipating device is disclosed. The electronic product includes a casing, a heat conducting board, at least one fan unit...
Heat dissipation of power electronics of a cooling unit
A cooling unit in a transport unit includes power electronics; a heat exchanger for thermally coupling a cooling agent of a central cooling system of the...
Data center module with leveling pad
A system includes a floor, one or more modules, one or more pads between a base of the modules and the floor, and one or more pad compression mechanisms. The...
Cable management arm of server rack
A cable management arm of a server rack includes two cable frames, two first connecting bases and two first connecting members. The cable frames are pivotally...
Electronic circuit unit capable of external connection
An electronic circuit unit includes a circuit board (10) with conductors for connection (14) on an edge (12), a case (20) for housing the circuit board (10) and...
An electronic apparatus includes: a panel having at least one of an input section and a display section; a main body configured to retain the panel rotatably;...
Electrical connector having an improved stiffener
An electrical connector for electrically connecting an IC package to a substrate, includes an insulating housing (21), a stiffener (20) located on one side of...
A display apparatus includes a display panel including lower and upper substrates confronting each other, and a film member combined with the upper substrate;...
Wiring device with integrated direct current output
The present disclosure provides a wiring device with integrated DC output interfaces alongside AC output interfaces. The wiring device converts AC power...
Electronic device opened by magnetic force
An electronic device opened by magnetic force includes a bottom cover, a top cover, at least one engaging module, a conductive logo, and at least one...
The ventilation member of the present invention includes: a support having a through hole serving as a part of an air passage between an interior space and an...
A printer includes a body case and an interface connector unit that is movable between a hidden position where the interface connector unit is hidden by the...
A display which thickness is allowed to be reduced is provided. A display includes: a display panel; and a back-face member having rigidity and provided on a...
Electronic component case and electronic component device
An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer...
Wiring board, semiconductor device, and method for manufacturing wiring
A wiring board includes first and second insulating layers, first and second through holes, a via, a plane layer, and signal wirings. The first insulating layer...
Multilayer printed wiring board and method for manufacturing multilayer
printed wiring board
A method for manufacturing a multilayer printed wiring board includes preparing a metal layer having metal member portions and connector portions connecting the...
Interposer and method for manufacturing same
An interposer includes an insulating substrate, a photosensitive dielectric film, a conductive layer, and a conductive via. The insulating substrate includes a...
Electronic circuit, light source device, and method of manufacturing
An electronic circuit having an electronic component mounted on a substrate, a light source device having the electronic circuit, and a method of manufacturing...
Electronic component mounting device and electronic component mounting
A bottom reception pin module 22 which is allowed to stand upright on a bottom reception base part 21 having a magnetic member 21a provided on an upper surface...
Resin composition for insulating film, and use thereof
The present invention provides a resin composition for an insulating film which resin composition is excellent in tack property after drying and allows a...
Process for etching a recessed structure filled with tin or a tin alloy
A process for etching excess tin or tin alloy deposits including the steps of providing a substrate having recessed structures filled with tin or a tin alloy...
Process for producing structure with metal film, mother die for use in the
process, and structure produced by...
The invention provides is a process for producing a structure (22) with a metal film, including the steps of preparing a mother die (10) in which a first metal...
Method of producing multilayer circuit board
The present invention relates to a method of producing a multilayer circuit board including: a film-forming step of forming a swellable resin film on the...
Flexible printed circuit board for packaging semiconductor device and
method of producing the same
A flexible circuit board, a semiconductor package, and methods of forming the same are provided. The flexible circuit board includes: a base film; an input line...
Method for producing conductive tracks
The method for producing conductive tracks includes applying continuous metallization layers to a non-conductive substrate, forming a metallization pattern, and...
A solution is characteristic in being an etching method that processes a surface of a target object by corroding the surface by a corrosive, and the etching...
Electronic package module and method of manufacturing the same
An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic...
Electronic part and electronic control unit
A main body of an electronic part has multiple electrodes, to which multiple terminals are respectively connected. The terminals include a fuse terminal and a...
High-frequency transmission line and electronic device
A high-frequency transmission line includes a laminate including dielectric layers, a first signal line provided in the laminate, a second signal line provided...
Interconnect architecture with stacked flex cable
Stacked flex cable assemblies and their manufacture are described. One assembly includes a first flex cable and a second flex cable electrically coupled to the...
One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and...
Connection structure of circuit board
A connection structure of a circuit board is disclosed. In one aspect, the connection structure includes a first circuit board, a second circuit board and an...
Contact surface arranged on a carrier for connecting to a counter contact
surface arranged on a further...
A contact area is provided on a carrier for connection to a mating contact area on a further carrier using an adhesive containing conductive particles. The...
Ball grid array rework
Embodiments of the invention relates to a method for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the...
Wiring board and method for manufacturing wiring board
An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section...
Ultra low loss dielectric thermosetting resin compositions and high
performance laminates manufactured therefrom
A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B)...
Sandwich of impact resistant material
A sandwich of impact resistant material comprising: a first tile comprising a plurality of nano-particles bonded together, wherein the nano-structure of the...