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Electronic component carrier tape feeding device and electronic component
carrier tape feeding method
Provided are an electronic component carrier tape feeding device and an electronic component carrier tape feeding method. The electronic component carrier tape...
Implantable medical device header
Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a...
Magnetic field shielding for packaging build-up architectures
Magnetic field shielding material with high relative permeability incorporated into a build-up package, for example to restrict a field of a magnet integrated...
EMI-shielding solutions for electronics enclosures using opposing
three-dimensional shapes and channels formed...
The present invention provides a configuration of a computer-chassis containment or other electromagnetic device method for manufacture in which a "one-hit"...
EMI shielding vent panel frame
An electromagnetic interference (EMI) shielded vent panel for disposition over an opening of an electronics enclosure is provided. The panel includes an...
Shielding film and method of manufacturing same
A shielding film includes an insulation layer, a conductive shielding layer and an adhesive layer; and is manufactured in a method including the steps of...
Shielding construction and wiring harness
Edge portions are formed on a shell fixing portion, disposed in upper and lower positions on the shell fixing portion and formed extending horizontally. Crimp...
A wire harness includes a plurality of electric wires, a first wire holding portion for holding one of both end portions of the plurality of electric wires, a...
Configurable shield for hand-held electronic device
A shield for a portable electronic device includes a pouch with an opening sized to accommodate the portable device and a flap. The pouch includes shielding...
Wireless power supply system
A wireless power supply system that wirelessly supplies electric power from a power-supplying coil to a power-receiving coil is provided with a ground...
Power supply device having heat conductive member
Provided is a power supply device that can suitably release heat with a small number of parts. In an AC-DC converter that is a power supply device according to...
Electronic apparatus and cooling method
A system that cools an electric component by a cooling medium cooled by a heat exchanger, the system includes a pipe through which a cooling medium to cool the...
Container-type data center having air conditioning facility
The present invention provides a container-type data center having an air conditioning facility, which enables to effectively cool IT equipment by applying the...
Modular data center
A modular computing system for a data center includes one or more data center modules including rack-mounted computer systems. An electrical module is coupled...
Equipment rack and associated ventilation system
A cable management rack is provided within which a heat-generating device is mountable. The rack includes a first upright and a second upright attached to...
Heat sink retainer unit and thermal module device
A heat sink retainer unit includes a buckle body, a retainer member, an elastic member and a handle. The elastic member is disposed in the buckle body and...
Heat exchange device, electronic system, and cooling method of electronic
A heat exchange device that is coupled to an electronic device that includes an electronic component that generates heat, the heat exchange device includes: a...
Liquid-cooled heat sink assemblies
Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface;...
Power conversion apparatus
An object of the present invention is to improve the cooling performance of a capacitor module used in a power conversion apparatus. The power conversion...
Container data center
A container data center includes a container, a number of server cabinets received in the container, a heat dissipation apparatus, a ventilation pipe, and a...
Rackless computing equipment construction
A self-supporting server chassis accepts blade server computing devices, and other like computing devices and associated infrastructure hardware, and also...
System with movable computing devices
A system for providing computing resources includes a mounting bar and one or more computing devices supported on the mounting bar. The computing devices are...
Electronic device having security structure
A electronic device includes a chassis, a panel, a cover and a security structure. The panel covers a side of the chassis. The cover covers another side of the...
Modules to contain interface cards
A module is insertable into a cage based on movement along a first axis. The module is to contain an interface card. A mechanism is to move the module along a...
Mounting structure for circuit board
A mounting structure in a power supply chassis includes a mounting portion and a securing portion. The mounting portion is located on a first sidewall of the...
Front panel of board, board, and electronic apparatus
The present invention provides a front panel of a board, a board, and an electronic apparatus. The front panel of the board includes a main body of the front...
Provided is an electronic device that is provided with a filter circuit that suppresses the effects of electromagnetic noise propagated through space from a...
Water-proof structure provided with internal barometer for terminal device
and method for controlling a...
A water-proof structure has an internal barometer for a terminal device. The water-proof structure is an internal cavity of the terminal device. The water-proof...
A dustproof device includes a first component, a second component and an engaging mechanism. The first component includes a first plug body which is pluggable...
Housing for electrical devices
A housing for electrical devices is composed of four sheet metal parts, namely a base part, two side parts and a lid. The base part is bent in a U-shape and has...
Power supply device
A power supply device includes a main body, a cover member, a rechargeable battery, and an inverter device. The main body is configured of box-shape formed with...
Landscape controller housing with pivotable locking face pack
A landscape controller housing can be used to enclose the electronic components of a landscape lighting system or an irrigation system includes a face pack that...
Automatic locking mechanism and electronic device therewith
An automatic locking mechanism is configured to lock a housing with a latching groove. The automatic locking mechanism includes a bracket and a magnet. An...
This smartphone (100) has a battery lid (60) attached to the smartphone main body, and a locking member (70) which is held so as to rotatable by the smartphone...
Foam assembly and method for manufacturing the same, and electronic device
using the foam assembly
A foam assembly includes a foam body, the foam body defining a plurality of through holes. The foam assembly further includes a colloid body formed by a first...
Housing and construction kit for a control apparatus
The present invention among other things relates to a housing and a construction kit for a control apparatus, e.g. in the form of a controller for a window...
Radiated noise caused by switching noise of power semiconductor elements in an electrical converter is reduced. The electrical converter is characterized in...
Methods of treating copper surfaces for enhancing adhesion to organic
substrates for use in printed circuit boards
Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly...
Semiconductor device and method of forming flipchip interconnection
structure with bump on partial pad
A semiconductor device has a semiconductor die having a plurality of bumps formed over a surface of the semiconductor die. The bumps can include a fusible...
Vertically separated pass through conveyor system and method in surface
mount technology process equipment
Disclosed herein is an apparatus for depositing viscous material on an electronic substrate. The apparatus comprises a frame, an assembly material applicator...
Circuit board for secondary battery and secondary battery with the circuit
A secondary battery and to a circuit board for the secondary battery. The circuit board having a structure for enhancing the safety of a secondary battery, and...
Electroless gold plating solution for forming fine gold structure, method
of forming fine gold structure using...
An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having...
Making multi-layer micro-wire structure
A method of making a multi-layer micro-wire structure includes providing a substrate with a plurality of micro-channels. First and second material compositions...
Method of fabricating a wiring board
A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern...
Chip embedded board and method of manufacturing the same
There are provided a chip embedded board and a method of manufacturing the same. The chip embedded board includes: a core substrate; a first build-up layer...
Multilayer ceramic capacitor and printed circuit board including the same
The present invention relates to a multilayer ceramic capacitor and a printed circuit board including the same that can minimize thickness deviations of an...
Printed circuit board
A printed circuit board includes a first semiconductor package on a first surface layer of a printed wiring board and a second semiconductor package on a second...
Control module for a transmission control installed in an automatic
The use of a control module having at least one housing part and a multi-layer printed circuit board as the electrical connection between the inner space of the...
Laminated substrate and method of manufacturing laminated substrate
A method of manufacturing a laminated substrate, the method includes: forming a first diameter hole to a first surface of a first substrate so as not to...
Partially depopulated interconnection arrays for packaged semiconductor
devices and printed circuit boards
In one embodiment, a ball grid array (BGA) of a packaged semiconductor device and a corresponding landing pad array of a printed circuit board each have a...