Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-9,349,622 Method and apparatus for planarization of substrate coatings
A method of forming a coating, comprises applying a first coating to a substrate having a plurality of topographical features, planarizing a top surface of the...
US-9,349,621 Vacuum seal arrangement useful in plasma processing chamber
A vacuum seal arrangement comprising a one-piece elastomeric gasket having at least first and second O-rings interconnected by a planar web, a first part having...
US-9,349,620 Apparatus and method for pre-baking substrate upstream of process chamber
A pre-baking apparatus for heating a substrate upstream of a process tool is adapted to be connected to an EFEM (equipment front end module) and includes: a...
US-9,349,619 Plasma etching method and plasma etching apparatus
A plasma etching apparatus includes a processing chamber; a holding unit for holding the substrate within the processing chamber; an electrode plate facing the...
US-9,349,618 Substrate processing apparatus
A substrate processing apparatus capable of removing deposits attached on a component of a lower temperature in a gap between two components, temperatures of...
US-9,349,617 Mechanisms for wafer cleaning
Embodiments that relate to mechanisms for cleaning wafers is provided. A method for wafer cleaning includes cleaning wafers by a wet-bench cleaning operation....
US-9,349,616 Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure
A semiconductor device includes a semiconductor die. An encapsulant is deposited over the semiconductor die. An insulating layer is formed over the encapsulant...
US-9,349,615 SiP system-integration IC chip package and manufacturing method thereof
A system-in-package (SiP) system-integration integrated circuit (IC) chip package and a manufacturing method thereof are provided. The package includes a...
US-9,349,614 Device and method for localized underfill
A device and method for localizing underfill includes a substrate, a plurality of dies, and underfill material. The substrate includes a plurality of contacts...
US-9,349,613 Electronic package with embedded materials in a molded structure to control warpage and stress
A method and system are provided for an electronic package with embedded materials in a molded structure to control warpage and stress. A first material can be...
US-9,349,612 Lead frame
A lead frame includes a plurality of unit lead frames arranged in a matrix. Leads of adjacent ones of the unit lead frames are connected via a connecting bar,...
US-9,349,611 Stackable semiconductor package and manufacturing method thereof
A semiconductor package includes a set of stud bumps, which can be formed by wire bonding technology and can be bonded or joined to a semiconductor element to...
US-9,349,610 Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
A method for assembling multiple integrated circuit dies into a system-in-package chip is disclosed, the method comprising: providing a plurality of integrated...
US-9,349,609 Semiconductor process temperature optimization
A method including forming a structure including a plurality of semiconductor devices surrounded by a dielectric layer such that a top surface of the dielectric...
US-9,349,608 Methods of protecting a dielectric mask layer and related semiconductor devices
Devices and methods for forming semiconductor devices with a protection layer for a dielectric mask layer are provided. One method includes, for instance;...
US-9,349,607 Method of forming line pattern
A method of forming a line pattern including following steps. First of all, a substrate having a first region and a second region is provided. Next, a directed...
US-9,349,606 Metal hardmask all in one integrated etch
A method for forming conductive contacts in a dielectric layer is provided. Partial vias are etched into the dielectric layer through a via mask. Trenches are...
US-9,349,605 Oxide etch selectivity systems and methods
Embodiments of the present technology may include a method of etching a substrate. The method may include striking a plasma discharge in a plasma region. The...
US-9,349,604 Use of topography to direct assembly of block copolymers in grapho-epitaxial applications
A method is provided for forming a patterned topography on a substrate. The substrate is provided with features formed atop that constitute an existing...
US-9,349,603 Plasma processing method
A plasma processing method in which a stable process region can be ensured in a wide range, from low microwave power to high microwave power. The plasma...
US-9,349,602 Semiconductor wafer chuck and method
A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism,...
US-9,349,601 Ruthenium complex, method for producing same, and method for producing ruthenium-containing thin film
The present invention is to provide a ruthenium complex represented by formula (1a), (2), (3), etc., which is useful for producing a ruthenium-containing thin...
US-9,349,600 Semiconductor device manufacturing method and semiconductor device
A semiconductor device manufacturing method includes: forming an element isolation insulating film in a semiconductor substrate; forming a first film on a...
US-9,349,599 Method for fabricating semiconductor device
A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having gate structure thereon, wherein the...
US-9,349,598 Gate contact with vertical isolation from source-drain
A method of forming a semiconductor structure includes forming a gate structure having a first conductive material above a semiconductor substrate, gate spacers...
US-9,349,597 Semiconductor memory device and method of manufacturing the same
A semiconductor memory device includes conductive films and insulating layers alternately stacked on a substrate, substantially vertical channel layers...
US-9,349,596 Methods of processing semiconductor wafers having silicon carbide power devices thereon
Methods of forming a silicon carbide semiconductor device are disclosed. The methods include forming a semiconductor device at a first surface of a silicon...
US-9,349,595 Methods of manufacturing semiconductor devices
Methods of manufacturing semiconductor devices are disclosed. In one embodiment, a material layer is formed over a workpiece. The workpiece includes a first...
US-9,349,594 Non-planar semiconductor device with aspect ratio trapping
As disclosed herein, a semiconductor device with aspect ratio trapping is provided, including a bulk substrate, a plurality of isolation pillars formed on the...
US-9,349,593 Method for manufacturing semiconductor device
To improve electric characteristics of a semiconductor device including an oxide semiconductor. Alternatively, to improve reliability of a semiconductor device...
US-9,349,592 Method for making electronic device using group III nitride semiconductor having specified dislocation density...
The present invention discloses an electronic device using a group III nitride substrate fabricated via the ammonothermal method. By utilizing the high-electron...
US-9,349,591 Crystal formation on non-lattice matched substrates
A semiconductor structure can be created by forming an insulator layer over a surface of a substrate. An intermediate layer can be formed on top of the...
US-9,349,590 Method for manufacturing nitride semiconductor layer
According to one embodiment, a method for manufacturing a nitride semiconductor layer is disclosed. The method can include forming a first lower layer on a...
US-9,349,589 Vacuum processing apparatus and vacuum processing method
A vacuum processing apparatus is configured to include a process chamber, a turntable provided in the process chamber, and a substrate receiving area provided...
US-9,349,588 Method for fabricating quasi-SOI source/drain field effect transistor device
The present invention discloses a method for fabricating a quasi-SOI source/drain field effect transistor device, which comprises the steps of forming an active...
US-9,349,587 Method of manufacturing semiconductor device and method of processing substrate and substrate processing apparatus
In a low-temperature, a silicon nitride film having a low in-film chlorine (Cl) content and a high resistance to hydrogen fluoride (HF) is formed. The formation...
US-9,349,586 Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and...
A thin film having excellent etching resistance and a low dielectric constant is described. A method of manufacturing a semiconductor device includes forming a...
US-9,349,585 Pattern formation method
According to an embodiment, a guide pattern having a first opening pattern and a second opening pattern shallower than the first opening pattern, is formed on a...
US-9,349,584 Method for depositing a film and film deposition apparatus
A method for depositing a film is provided. In the method, an object to be processed is accommodated in a process chamber, and an insulating film made of a...
US-9,349,583 Method of fabricating semiconductor device
Methods of fabricating a semiconductor device include forming a deposited film on a semiconductor substrate in a process chamber by repeatedly forming unit...
US-9,349,582 Liquid chemical for forming water repellent protecting film, and process for cleaning wafers using the same
A liquid chemical for forming a water repellent protecting film on a wafer having at its surface an uneven pattern and containing at least one kind of element...
US-9,349,581 Incandescent lamp
According to one embodiment, an incandescent lamp includes: a bulb; a pair of lead sections that have respectively a holding section including nickel or...
US-9,349,580 Coupling devices and source assemblies including them
Certain embodiments described herein are directed to couplers that can be used to provide a seal between a source assembly and a vacuum chamber. In certain...
US-9,349,579 Ion detection
A mass analyzer in which ions form packets that oscillate with a period has an ion detector comprising: a detection arrangement; and compensation circuitry. The...
US-9,349,578 Quantitative analysis method using mass spectrometry wherein laser pulse energy is adjusted
A quantitative analysis method using MALDI mass spectrometry wherein laser pulse energy is adjusted is disclosed. More particularly, a method for measuring the...
US-9,349,577 Process for locating a positron radionuclide, applications and device for implementing same
The present disclosure relates to a method for locating a radionuclide emitting positons and having a child core emitting a photon by de-excitation, that...
US-9,349,576 Magnetron for cylindrical targets
A magnet arrangement which is usable as both a retrofit magnetic arrangement in a rotatable cylindrical magnetron sputtering electrode as well as a drive...
US-9,349,575 Remote plasma system having self-management function and self management method of the same
A remote plasma system having a self-management function measures an operating state of a remote plasma generator while a remote plasma generator operates,...
US-9,349,574 Plasma etching method and plasma etching apparatus
A plasma etching method includes a plasma process of plasma-processing a surface of a photoresist, which has a predetermined pattern with plasma generated from...
US-9,349,573 Total release method for sample extraction in an energetic-beam instrument
A substrate located in an energetic-beam instrument has a region of interest to be extracted as a sample for further analysis. Cuts are made in the substrate to...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.