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Method and apparatus for planarization of substrate coatings
A method of forming a coating, comprises applying a first coating to a substrate having a plurality of topographical features, planarizing a top surface of the...
Vacuum seal arrangement useful in plasma processing chamber
A vacuum seal arrangement comprising a one-piece elastomeric gasket having at least first and second O-rings interconnected by a planar web, a first part having...
Apparatus and method for pre-baking substrate upstream of process chamber
A pre-baking apparatus for heating a substrate upstream of a process tool is adapted to be connected to an EFEM (equipment front end module) and includes: a...
Plasma etching method and plasma etching apparatus
A plasma etching apparatus includes a processing chamber; a holding unit for holding the substrate within the processing chamber; an electrode plate facing the...
Substrate processing apparatus
A substrate processing apparatus capable of removing deposits attached on a component of a lower temperature in a gap between two components, temperatures of...
Mechanisms for wafer cleaning
Embodiments that relate to mechanisms for cleaning wafers is provided. A method for wafer cleaning includes cleaning wafers by a wet-bench cleaning operation....
Semiconductor device and method of forming WLCSP with semiconductor die
embedded within interconnect structure
A semiconductor device includes a semiconductor die. An encapsulant is deposited over the semiconductor die. An insulating layer is formed over the encapsulant...
SiP system-integration IC chip package and manufacturing method thereof
A system-in-package (SiP) system-integration integrated circuit (IC) chip package and a manufacturing method thereof are provided. The package includes a...
Device and method for localized underfill
A device and method for localizing underfill includes a substrate, a plurality of dies, and underfill material. The substrate includes a plurality of contacts...
Electronic package with embedded materials in a molded structure to
control warpage and stress
A method and system are provided for an electronic package with embedded materials in a molded structure to control warpage and stress. A first material can be...
A lead frame includes a plurality of unit lead frames arranged in a matrix. Leads of adjacent ones of the unit lead frames are connected via a connecting bar,...
Stackable semiconductor package and manufacturing method thereof
A semiconductor package includes a set of stud bumps, which can be formed by wire bonding technology and can be bonded or joined to a semiconductor element to...
Assembly structure for connecting multiple dies into a system-in-package
chip and the method thereof
A method for assembling multiple integrated circuit dies into a system-in-package chip is disclosed, the method comprising: providing a plurality of integrated...
Semiconductor process temperature optimization
A method including forming a structure including a plurality of semiconductor devices surrounded by a dielectric layer such that a top surface of the dielectric...
Methods of protecting a dielectric mask layer and related semiconductor
Devices and methods for forming semiconductor devices with a protection layer for a dielectric mask layer are provided. One method includes, for instance;...
Method of forming line pattern
A method of forming a line pattern including following steps. First of all, a substrate having a first region and a second region is provided. Next, a directed...
Metal hardmask all in one integrated etch
A method for forming conductive contacts in a dielectric layer is provided. Partial vias are etched into the dielectric layer through a via mask. Trenches are...
Oxide etch selectivity systems and methods
Embodiments of the present technology may include a method of etching a substrate. The method may include striking a plasma discharge in a plasma region. The...
Use of topography to direct assembly of block copolymers in
A method is provided for forming a patterned topography on a substrate. The substrate is provided with features formed atop that constitute an existing...
Plasma processing method
A plasma processing method in which a stable process region can be ensured in a wide range, from low microwave power to high microwave power. The plasma...
Semiconductor wafer chuck and method
A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism,...
Ruthenium complex, method for producing same, and method for producing
ruthenium-containing thin film
The present invention is to provide a ruthenium complex represented by formula (1a), (2), (3), etc., which is useful for producing a ruthenium-containing thin...
Semiconductor device manufacturing method and semiconductor device
A semiconductor device manufacturing method includes: forming an element isolation insulating film in a semiconductor substrate; forming a first film on a...
Method for fabricating semiconductor device
A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having gate structure thereon, wherein the...
Gate contact with vertical isolation from source-drain
A method of forming a semiconductor structure includes forming a gate structure having a first conductive material above a semiconductor substrate, gate spacers...
Semiconductor memory device and method of manufacturing the same
A semiconductor memory device includes conductive films and insulating layers alternately stacked on a substrate, substantially vertical channel layers...
Methods of processing semiconductor wafers having silicon carbide power
Methods of forming a silicon carbide semiconductor device are disclosed. The methods include forming a semiconductor device at a first surface of a silicon...
Methods of manufacturing semiconductor devices
Methods of manufacturing semiconductor devices are disclosed. In one embodiment, a material layer is formed over a workpiece. The workpiece includes a first...
Non-planar semiconductor device with aspect ratio trapping
As disclosed herein, a semiconductor device with aspect ratio trapping is provided, including a bulk substrate, a plurality of isolation pillars formed on the...
Method for manufacturing semiconductor device
To improve electric characteristics of a semiconductor device including an oxide semiconductor. Alternatively, to improve reliability of a semiconductor device...
Method for making electronic device using group III nitride semiconductor
having specified dislocation density...
The present invention discloses an electronic device using a group III nitride substrate fabricated via the ammonothermal method. By utilizing the high-electron...
Crystal formation on non-lattice matched substrates
A semiconductor structure can be created by forming an insulator layer over a surface of a substrate. An intermediate layer can be formed on top of the...
Method for manufacturing nitride semiconductor layer
According to one embodiment, a method for manufacturing a nitride semiconductor layer is disclosed. The method can include forming a first lower layer on a...
Vacuum processing apparatus and vacuum processing method
A vacuum processing apparatus is configured to include a process chamber, a turntable provided in the process chamber, and a substrate receiving area provided...
Method for fabricating quasi-SOI source/drain field effect transistor
The present invention discloses a method for fabricating a quasi-SOI source/drain field effect transistor device, which comprises the steps of forming an active...
Method of manufacturing semiconductor device and method of processing
substrate and substrate processing apparatus
In a low-temperature, a silicon nitride film having a low in-film chlorine (Cl) content and a high resistance to hydrogen fluoride (HF) is formed. The formation...
Method of manufacturing semiconductor device, substrate processing
apparatus, substrate processing system and...
A thin film having excellent etching resistance and a low dielectric constant is described. A method of manufacturing a semiconductor device includes forming a...
Pattern formation method
According to an embodiment, a guide pattern having a first opening pattern and a second opening pattern shallower than the first opening pattern, is formed on a...
Method for depositing a film and film deposition apparatus
A method for depositing a film is provided. In the method, an object to be processed is accommodated in a process chamber, and an insulating film made of a...
Method of fabricating semiconductor device
Methods of fabricating a semiconductor device include forming a deposited film on a semiconductor substrate in a process chamber by repeatedly forming unit...
Liquid chemical for forming water repellent protecting film, and process
for cleaning wafers using the same
A liquid chemical for forming a water repellent protecting film on a wafer having at its surface an uneven pattern and containing at least one kind of element...
According to one embodiment, an incandescent lamp includes: a bulb; a pair of lead sections that have respectively a holding section including nickel or...
Coupling devices and source assemblies including them
Certain embodiments described herein are directed to couplers that can be used to provide a seal between a source assembly and a vacuum chamber. In certain...
A mass analyzer in which ions form packets that oscillate with a period has an ion detector comprising: a detection arrangement; and compensation circuitry. The...
Quantitative analysis method using mass spectrometry wherein laser pulse
energy is adjusted
A quantitative analysis method using MALDI mass spectrometry wherein laser pulse energy is adjusted is disclosed. More particularly, a method for measuring the...
Process for locating a positron radionuclide, applications and device for
The present disclosure relates to a method for locating a radionuclide emitting positons and having a child core emitting a photon by de-excitation, that...
Magnetron for cylindrical targets
A magnet arrangement which is usable as both a retrofit magnetic arrangement in a rotatable cylindrical magnetron sputtering electrode as well as a drive...
Remote plasma system having self-management function and self management
method of the same
A remote plasma system having a self-management function measures an operating state of a remote plasma generator while a remote plasma generator operates,...
Plasma etching method and plasma etching apparatus
A plasma etching method includes a plasma process of plasma-processing a surface of a photoresist, which has a predetermined pattern with plasma generated from...
Total release method for sample extraction in an energetic-beam instrument
A substrate located in an energetic-beam instrument has a region of interest to be extracted as a sample for further analysis. Cuts are made in the substrate to...