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Patent # Description
US-9,356,024 Semiconductor device
A semiconductor device includes a semiconductor substrate having an active layer in which an element region and a contact region are formed, a support substrate...
US-9,356,023 Planar device on fin-based transistor architecture
Techniques are disclosed for forming a planar-like transistor device on a fin-based field-effect transistor (finFET) architecture during a finFET fabrication...
US-9,356,022 Semiconductor device with termination structure for power MOSFET applications
A semiconductor device may have an active device region containing a plurality of active devices and a termination structure that surrounds the active device...
US-9,356,021 Self-alignment for two or more layers and methods of forming same
Embodiments of the present disclosure include self-alignment of two or more layers and methods of forming the same. An embodiment is a method for forming a...
US-9,356,020 Semiconductor arrangement
A semiconductor arrangement includes a first semiconductor device including a first type region having a first conductivity type and a second type region having...
US-9,356,019 Integrated circuit with on chip planar diode and CMOS devices
An electrical circuit, planar diode, and method of forming a diode and one or more CMOS devices on the same chip. The method includes electrically isolating a...
US-9,356,018 Semiconductor devices and methods of fabricating the same
Provided is a semiconductor device including a substrate, first and second gate structures provided on the substrate, a source/drain region provided adjacent to...
US-9,356,017 Switch circuit and semiconductor device
In an embodiment, a switch circuit includes an input drain node, an input source node and an input gate node, and a high voltage transistor having a current...
US-9,356,016 Semiconductor device and method for manufacturing the same
A semiconductor device includes a semiconductor substrate, a transistor, a conductive contact and a capacitor. The transistor is formed on the semiconductor...
US-9,356,015 Composite semiconductor device
In a composite semiconductor device which is provided with a normally-on-type first transistor and a normally-off-type second transistor which are serially...
US-9,356,014 High-voltage metal-insulator-semiconductor field effect transistor structures
Semiconductor structures and methods of manufacture are disclosed herein. Specifically, disclosed herein are methods of manufacturing a high-voltage...
US-9,356,013 Semiconductor devices and arrangements for electrostatic (ESD) protection
A semiconductor device including: a first semiconductor region of a first conductivity type; a second semiconductor region of a second conductivity type...
US-9,356,012 High voltage ESD protection apparatus
An ESD protection apparatus comprises a metal contact formed on the emitter of a transistor. The metal contact has a different conductivity type from the...
US-9,356,011 Junction-isolated blocking voltage structures with integrated protection structures
Junction-isolated blocking voltage devices and methods of forming the same are provided. In certain implementations, a blocking voltage device includes an anode...
US-9,356,009 Interconnect structure with redundant electrical connectors and associated systems and methods
Semiconductor die assemblies having interconnect structures with redundant electrical connectors are disclosed herein. In one embodiment, a semiconductor die...
US-9,356,008 Semiconductor package and fabrication method thereof
A semiconductor package is provided, which includes: a first semiconductor device having a first top surface and a first bottom surface opposite to the first...
US-9,356,007 Light emitting device and lighting apparatus including the same
A light emitting device is disclosed. The disclosed light emitting device includes a light emitting structure including a first-conductivity-type semiconductor...
US-9,356,006 Batch process fabrication of package-on-package microelectronic assemblies
A microelectronic assembly can be made by joining first and second subassemblies by electrically conductive masses to connect electrically conductive elements...
US-9,356,005 Package of light emitting diode with heat sink
Disclosed herein is a light emitting diode (LED) package. The present invention is directed to a light emitting diode (LED) package capable of efficiently...
US-9,356,004 Light emitting device array
Disclosed is a light emitting device array. The light emitting device array comprises a light emitting device and a body comprises first and second lead frames...
US-9,356,003 Highly integrated flex sensor package
Packaging techniques are described for fabricating a flex sensor package that includes a flex printed circuit with a flex window, an adhesive layer with an...
US-9,356,002 Semiconductor package and method for manufacturing the same
A semiconductor package includes a lower package including a lower substrate, a lower semiconductor chip, and a lower molding layer exposing an upper surface of...
US-9,356,001 Semiconductor device with at least one voltage-guided conductive filament
A semiconductor device includes at least a first semiconductor die and a second semiconductor die. The first semiconductor dies comprises a first and second...
US-9,356,000 Semiconductor integrated circuit and semiconductor system with the same
A semiconductor integrated circuit may include a plurality of semiconductor chips configured to be stacked in three dimensions, a first group of through-chip...
US-9,355,999 Semiconductor device
A semiconductor device includes: a substrate having an insulating resin and a metal pattern provided on the insulating resin; a mounted component mounted on the...
US-9,355,998 Semiconductor device with circuits connected to each other in contactless manner
In a semiconductor device, a first semiconductor chip includes a first circuit and a first inductor, and a second semiconductor chip includes a second circuit...
US-9,355,997 Integrated circuit assemblies with reinforcement frames, and methods of manufacture
An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames...
US-9,355,996 Microelectronic package with consolidated chip structures
A chip package has multiple chips that may be arranged side-by-side or in a staggered, stair step arrangement. The contacts of the chips are connected to...
US-9,355,995 Semiconductor packages utilizing leadframe panels with grooves in connecting bars
According to an exemplary implementation, a method includes utilizing a leadframe panel comprising a plurality of leadframe modules, each of the plurality of...
US-9,355,994 Build-up package for integrated circuit devices, and methods of making same
A device is disclosed which includes, in one illustrative example, an integrated circuit die having an active surface and a molded body extending around a...
US-9,355,993 Integrated circuit system with debonding adhesive and method of manufacture thereof
A system and method of manufacture of an integrated circuit system includes: a die having a via, the die having a top side and a bottom side; a top interconnect...
US-9,355,992 Land grid array semiconductor device packages
A semiconductor device package includes a land grid array package. At least one semiconductor die is mounted to an interposer substrate, with bond pads of the...
US-9,355,991 Integrating multi-output devices having vertically stacked semiconductor chips
A method for fabricating an electronic multi-output device. A substrate having a pad and pins is provided. A first chip is provided having a first and a second...
US-9,355,990 Manufacturing method of device embedded substrate and device embedded substrate manufactured by this method
The present invention provides a manufacturing method of a device embedded substrate, including: forming a bonding layer of an insulation material on a metal...
US-9,355,989 Wire bonding device and method of eliminating defective bonding wire
A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the...
US-9,355,988 Semiconductor device
A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in...
US-9,355,987 Electronic component and manufacturing method for electronic component
A first metal film, of which major component is copper, is formed on a surface of a conductive portion which becomes a front surface electrode of a...
US-9,355,986 Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the...
There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing...
US-9,355,985 Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof
Microelectronic packages and methods for producing microelectronic packages having sidewall-deposited heat spreader structures are provided. In one embodiment,...
US-9,355,984 Electronic device and method for fabricating an electronic device
An embodiment method for fabricating electronic devices having two components connected by a metal layer includes applying a metal layer to each component and...
US-9,355,983 Integrated circuit packaging system with interposer structure and method of manufacture thereof
A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a...
US-9,355,982 Semiconductor structure and manufacturing method thereof
A semiconductor structure includes a semiconductor substrate and a pad. The pad is on a top surface of the semiconductor substrate. The semiconductor structure...
US-9,355,981 Semiconductor device
Provided is a semiconductor device in which misalignment between a semiconductor die and a substrate (e.g., a circuit board) can be prevented or substantially...
US-9,355,980 Three-dimensional chip stack and method of forming the same
A three-dimensional chip stack includes a first chip bonded to a second chip to form a bonded interconnection therebetween. The bonded interconnection includes...
US-9,355,979 Alignment structures and methods of forming same
Embodiments of the present disclosure include interconnect structures and methods of forming interconnect structures. An embodiment is a method of forming an...
US-9,355,978 Packaging devices and methods of manufacture thereof
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad...
US-9,355,977 Bump structures for semiconductor package
A package structure includes a first substrate bonded to a second substrate by connecting metal pillars on the first substrate to connectors on the second...
US-9,355,976 Semiconductor memory chips and stack-type semiconductor packages including the same
Provided are semiconductor memory chips and semiconductor packages with the same. The semiconductor package may include a memory chip including first data pads...
US-9,355,975 Chip package and method for forming the same
A chip package including a chip having an upper surface, a lower surface and a sidewall is provided. The chip includes a signal pad region adjacent to the upper...
US-9,355,974 Semiconductor device and manufacturing method therefor
A semiconductor device includes a plurality of protrusions formed on a first face of the semiconductor device; first bonding portions formed on upper portions...
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