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A semiconductor device includes a semiconductor substrate having an active layer in which an element region and a contact region are formed, a support substrate...
Planar device on fin-based transistor architecture
Techniques are disclosed for forming a planar-like transistor device on a fin-based field-effect transistor (finFET) architecture during a finFET fabrication...
Semiconductor device with termination structure for power MOSFET
A semiconductor device may have an active device region containing a plurality of active devices and a termination structure that surrounds the active device...
Self-alignment for two or more layers and methods of forming same
Embodiments of the present disclosure include self-alignment of two or more layers and methods of forming the same. An embodiment is a method for forming a...
A semiconductor arrangement includes a first semiconductor device including a first type region having a first conductivity type and a second type region having...
Integrated circuit with on chip planar diode and CMOS devices
An electrical circuit, planar diode, and method of forming a diode and one or more CMOS devices on the same chip. The method includes electrically isolating a...
Semiconductor devices and methods of fabricating the same
Provided is a semiconductor device including a substrate, first and second gate structures provided on the substrate, a source/drain region provided adjacent to...
Switch circuit and semiconductor device
In an embodiment, a switch circuit includes an input drain node, an input source node and an input gate node, and a high voltage transistor having a current...
Semiconductor device and method for manufacturing the same
A semiconductor device includes a semiconductor substrate, a transistor, a conductive contact and a capacitor. The transistor is formed on the semiconductor...
Composite semiconductor device
In a composite semiconductor device which is provided with a normally-on-type first transistor and a normally-off-type second transistor which are serially...
High-voltage metal-insulator-semiconductor field effect transistor
Semiconductor structures and methods of manufacture are disclosed herein. Specifically, disclosed herein are methods of manufacturing a high-voltage...
Semiconductor devices and arrangements for electrostatic (ESD) protection
A semiconductor device including: a first semiconductor region of a first conductivity type; a second semiconductor region of a second conductivity type...
High voltage ESD protection apparatus
An ESD protection apparatus comprises a metal contact formed on the emitter of a transistor. The metal contact has a different conductivity type from the...
Junction-isolated blocking voltage structures with integrated protection
Junction-isolated blocking voltage devices and methods of forming the same are provided. In certain implementations, a blocking voltage device includes an anode...
Interconnect structure with redundant electrical connectors and associated
systems and methods
Semiconductor die assemblies having interconnect structures with redundant electrical connectors are disclosed herein. In one embodiment, a semiconductor die...
Semiconductor package and fabrication method thereof
A semiconductor package is provided, which includes: a first semiconductor device having a first top surface and a first bottom surface opposite to the first...
Light emitting device and lighting apparatus including the same
A light emitting device is disclosed. The disclosed light emitting device includes a light emitting structure including a first-conductivity-type semiconductor...
Batch process fabrication of package-on-package microelectronic assemblies
A microelectronic assembly can be made by joining first and second subassemblies by electrically conductive masses to connect electrically conductive elements...
Package of light emitting diode with heat sink
Disclosed herein is a light emitting diode (LED) package. The present invention is directed to a light emitting diode (LED) package capable of efficiently...
Light emitting device array
Disclosed is a light emitting device array. The light emitting device array comprises a light emitting device and a body comprises first and second lead frames...
Highly integrated flex sensor package
Packaging techniques are described for fabricating a flex sensor package that includes a flex printed circuit with a flex window, an adhesive layer with an...
Semiconductor package and method for manufacturing the same
A semiconductor package includes a lower package including a lower substrate, a lower semiconductor chip, and a lower molding layer exposing an upper surface of...
Semiconductor device with at least one voltage-guided conductive filament
A semiconductor device includes at least a first semiconductor die and a second semiconductor die. The first semiconductor dies comprises a first and second...
Semiconductor integrated circuit and semiconductor system with the same
A semiconductor integrated circuit may include a plurality of semiconductor chips configured to be stacked in three dimensions, a first group of through-chip...
A semiconductor device includes: a substrate having an insulating resin and a metal pattern provided on the insulating resin; a mounted component mounted on the...
Semiconductor device with circuits connected to each other in contactless
In a semiconductor device, a first semiconductor chip includes a first circuit and a first inductor, and a second semiconductor chip includes a second circuit...
Integrated circuit assemblies with reinforcement frames, and methods of
An assembly with modules (110, 1310) containing integrated circuits and attached to a wiring substrate (120) is reinforced by one or more reinforcement frames...
Microelectronic package with consolidated chip structures
A chip package has multiple chips that may be arranged side-by-side or in a staggered, stair step arrangement. The contacts of the chips are connected to...
Semiconductor packages utilizing leadframe panels with grooves in
According to an exemplary implementation, a method includes utilizing a leadframe panel comprising a plurality of leadframe modules, each of the plurality of...
Build-up package for integrated circuit devices, and methods of making
A device is disclosed which includes, in one illustrative example, an integrated circuit die having an active surface and a molded body extending around a...
Integrated circuit system with debonding adhesive and method of
A system and method of manufacture of an integrated circuit system includes: a die having a via, the die having a top side and a bottom side; a top interconnect...
Land grid array semiconductor device packages
A semiconductor device package includes a land grid array package. At least one semiconductor die is mounted to an interposer substrate, with bond pads of the...
Integrating multi-output devices having vertically stacked semiconductor
A method for fabricating an electronic multi-output device. A substrate having a pad and pins is provided. A first chip is provided having a first and a second...
Manufacturing method of device embedded substrate and device embedded
substrate manufactured by this method
The present invention provides a manufacturing method of a device embedded substrate, including: forming a bonding layer of an insulation material on a metal...
Wire bonding device and method of eliminating defective bonding wire
A method of eliminating a defective bonding wire is provided, including moving a bonding member from a first region of a carrier to a second region of the...
A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in...
Electronic component and manufacturing method for electronic component
A first metal film, of which major component is copper, is formed on a surface of a conductive portion which becomes a front surface electrode of a...
Solder joint structure, power module, power module substrate with heat
sink and method of manufacturing the...
There are provided a solder joint structure, a power module using the joint structure, a power module substrate with a heat sink and a method of manufacturing...
Microelectronic packages having sidewall-deposited heat spreader
structures and methods for the fabrication thereof
Microelectronic packages and methods for producing microelectronic packages having sidewall-deposited heat spreader structures are provided. In one embodiment,...
Electronic device and method for fabricating an electronic device
An embodiment method for fabricating electronic devices having two components connected by a metal layer includes applying a metal layer to each component and...
Integrated circuit packaging system with interposer structure and method
of manufacture thereof
A system and a method of manufacture thereof of integrated circuit packaging system, including: a pillar; a conductive buildup attached to the pillar; and a...
Semiconductor structure and manufacturing method thereof
A semiconductor structure includes a semiconductor substrate and a pad. The pad is on a top surface of the semiconductor substrate. The semiconductor structure...
Provided is a semiconductor device in which misalignment between a semiconductor die and a substrate (e.g., a circuit board) can be prevented or substantially...
Three-dimensional chip stack and method of forming the same
A three-dimensional chip stack includes a first chip bonded to a second chip to form a bonded interconnection therebetween. The bonded interconnection includes...
Alignment structures and methods of forming same
Embodiments of the present disclosure include interconnect structures and methods of forming interconnect structures. An embodiment is a method of forming an...
Packaging devices and methods of manufacture thereof
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad...
Bump structures for semiconductor package
A package structure includes a first substrate bonded to a second substrate by connecting metal pillars on the first substrate to connectors on the second...
Semiconductor memory chips and stack-type semiconductor packages including
Provided are semiconductor memory chips and semiconductor packages with the same. The semiconductor package may include a memory chip including first data pads...
Chip package and method for forming the same
A chip package including a chip having an upper surface, a lower surface and a sidewall is provided. The chip includes a signal pad region adjacent to the upper...
Semiconductor device and manufacturing method therefor
A semiconductor device includes a plurality of protrusions formed on a first face of the semiconductor device; first bonding portions formed on upper portions...