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Patent # Description
US-9,357,686 Dispensing apparatus having substrate inverter system and clamping system, and method for dispensing a viscous...
A dispenser, which is capable of dispensing viscous material on a substrate having a top surface and a bottom surface, includes a frame, a gantry system, and a...
US-9,357,685 Component mounting apparatus
A inverting head 20 that inverts a component 4 picked up by a nozzle 20a upside down includes a flat-plate-like base 31 provided on a vertically-movable...
US-9,357,684 Spring assemblies with spring energized seal members and related methods
Seal assemblies in which a seal member having an energizer located in a seal body groove is positioned inside a housing cavity of a housing are disclosed. The...
US-9,357,683 Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam
According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam frames and covers...
US-9,357,682 Cooling method with automated seasonal freeze protection
An automated multi-fluid cooling method is provided for cooling an electronic component(s). The method includes obtaining a coolant loop, and providing a...
US-9,357,681 Modular data center row infrastructure
A data center row infrastructure module enables rapid deployment of a computing room enclosure for computer systems that provides intake air circulation to, and...
US-9,357,680 Method for notifying abnormality in electro device, and electro device
An electronic device including a fan unit capable of setting an air blowing direction toward any of an interface plate side of a casing and a back plate side...
US-9,357,679 Electronic equipment cooling system with auxiliary cooling device
Embodiments of the present invention disclose an electronic equipment cooling system including: a cabinet; at least one electronic equipment chassis that is...
US-9,357,678 Semiconductor module
A semiconductor module can be attached to a heat sink. The semiconductor module includes a case housing a component of the semiconductor module, and an elastic...
US-9,357,677 Electronic device with efficient heat radiation structure for electronic components
An electronic device includes a metallic body, a circuit substrate having electronic components and wiring conductors, a heat conduction member that absorbs a...
US-9,357,676 Cooling device and electronic apparatus
A cooling device includes: a heat dissipating part disposed at an end of a heat transfer member; a heat-receiving plate disposed at the other end of the heat...
US-9,357,675 Pump-enhanced, immersion-cooling of electronic component(s)
Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling...
US-9,357,674 Liquid-cooling apparatus with integrated coolant filter
Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from an electronic component(s). The...
US-9,357,673 Digital signage
There is disclosed a digital signage including a display panel, a housing having the display panel arranged in a front surface, the housing comprising an inlet...
US-9,357,672 Air guidance system
The invention relates to an air guidance system having an air guidance housing and an air passage grating fastened thereto, the air passage grating being held...
US-9,357,671 Cooling unit and method
A cooling unit (10) includes a housing (12) having a front (14) and a back (16), one or more fans (28) provided at either the front (14) or the back (16) of the...
US-9,357,670 Efficient heat transfer from conduction-cooled circuit cards
A conduction-cooled card assembly is disclosed that includes a conduction-cooling frame, a printed wiring board mounted on the frame, and a wedgelock fastener....
US-9,357,669 Removable locking cover for rack-mounted equipment
An improved locking cover assembly to prevent access to rack-mounted equipment and the connections to and from conventional rack systems without trays or...
US-9,357,668 Power management systems
Provided are a power management system and method. At least one frame module includes at least one bay and a plurality of first connectors at a rear portion of...
US-9,357,667 Mounting apparatus for battery module
A battery mounting apparatus requiring a minimum of screw fixings includes an enclosure, two positioning members, and a supporting mechanism. The enclosure...
US-9,357,666 Field-serviceable IT device
An IT device includes a system board, a drive controller system, a mid-plane assembly, a bridge connector assembly configured to releasably couple the system...
US-9,357,665 Handheld device enclosure
This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an...
US-9,357,664 Portable terminal
A portable terminal has a main machine body and a cell, one of the main machine body and the cell is arranged a pushing button moving axially, and a compression...
US-9,357,663 Electronic unit of a fluid sensor or valve and fluid sensor or fluid valve unit
An electronic unit of a fluid sensor or fluid valve has a substantially cylindrical housing with a longitudinal axis and an open end face, which can be closed...
US-9,357,662 Display, backlight module, and frame structure thereof
A backlight module includes a light-guiding plate, a back-light source disposed at a side of the light-guiding plate, and a frame structure disposed surrounding...
US-9,357,661 Module unit with circuit board receiving element
A module unit includes a receiving element formed from an extrusion profile and configured to receive at least one circuit board. The receiving element includes...
US-9,357,660 Printed circuit board, and method for manufacturing printed circuit board
A printed wiring board includes a core substrate having opening, an electronic component device accommodated in the opening of the substrate and including...
US-9,357,659 Packaging substrate having embedded through-via interposer
A packaging substrate having an embedded through-via interposer is provided, including an encapsulant layer, a through-via interposer embedded in the...
US-9,357,658 Molding method for COB-EUSB devices and metal housing package
A dual-personality extended USB (EUSB) system supports both USB and EUSB devices using an extended 9-pin EUSB socket. Each EUSB device includes a PCBA having...
US-9,357,657 Lead-free solder alloy for printed circuit board assemblies for high-temperature environments
A solder alloy suitable for high temperature environments, such as for example electronic systems used in an oil or gas well where the temperature may be in the...
US-9,357,656 Method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards
A method for solderless electrical press-fit contacting of electrically conductive press-fit pins in circuit boards include: providing a circuit board having a...
US-9,357,655 Apparatus for efficient wire routing in a device
Techniques for efficient routing of wires and electrical components within a device are disclosed. A wire can be routed, for example, in the space between two...
US-9,357,654 Low-profile plug with cam and flexible circuit board
A cable assembly including a connector insert to fit in a connector receptacle in an electronic device, where a back surface of the connector insert is...
US-9,357,653 Inverting head
A nozzle holder 34 includes a nozzle base 51 whose both ends are supported, the nozzle base 51 inside which a vacuum path is formed, extending in a horizontal...
US-9,357,652 Method of manufacturing circuit board and semiconductor package
A method of manufacturing a circuit board may include: preparing a circuit board body including an insulating layer having a first surface and a second surface...
US-9,357,651 Magnetic core inductor integrated with multilevel wiring network
An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive...
US-9,357,650 Method of making magnetic core inductor integrated with multilevel wiring network
An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive...
US-9,357,649 276-pin buffered memory card with enhanced memory system interconnect
An embodiment is a memory card including a rectangular printed circuit card having a first side and a second side, a first length of between 151.35 and 161.5...
US-9,357,648 Above motherboard interposer with quarter wavelength electrical paths
A multi-layer interposer substrate includes multiple layers of single interposer substrates. Each single interposer substrate has a first array of interposer...
US-9,357,647 Packaging substrate, method for manufacturing same, and chip packaging body having same
A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a...
US-9,357,646 Package substrate
A package substrate includes an insulating layer; and circuit patterns formed on the insulating layer and divided into pad areas and pattern areas that have...
US-9,357,645 Joining sheet, electronic component, and producing method thereof
A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles...
US-9,357,644 Joined structural body of members, joining method of members, and package for containing an electronic component
According to one embodiment, a joined structural body for mounting an electronic component on the body which is provided with a first member, a second member...
US-9,357,643 Ceramic/copper circuit board and semiconductor device
A ceramic/copper circuit board of an embodiment includes a ceramic substrate and first and second copper plates bonded to surfaces of the ceramic substrate via...
US-9,357,642 Circuit board laminate and metal-based circuit board
A circuit board laminate includes a metal substrate, an insulation layer disposed on the metal substrate, and a metal foil disposed on the insulation layer. A...
US-9,357,641 Molded package and light emitting device
A molded package includes a molded resin and a lead. The molded resin has a recess portion provided on an upper surface of the molded resin to accommodate a...
US-9,357,640 Method of manufacturing a multi-layer printed circuit board
A method of manufacturing a multi-layer printed circuit board by bonding together a plurality of circuit board layers, each of which includes a substrate and a...
US-9,357,639 Circuit board having a plated through hole through a conductive pad
In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a...
US-9,357,638 Flexible display device and fabrication method thereof
Disclosed is a flexible display device capable of forming a display device on a glass substrate and simultaneously ensuring flexibility, and a fabrication...
US-9,357,637 Flexible substrate, support platform, flexible display and manufacturing method thereof
The invention relates to manufacturing of displays. A flexible substrate is disclosed, which has a plurality of spacers arranged at intervals on one side...
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