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High sheet resistor in CMOS flow
An integrated circuit containing CMOS gates and a counterdoped polysilicon gate material resistor which has a body region that is implanted concurrently with...
Resistor and metal-insulator-metal capacitor structure and method
A passive circuit device incorporating a resistor and a capacitor and a method of forming the circuit device are disclosed. In an exemplary embodiment, the...
Semiconductor integrated circuit device with transistor and non-transistor
In a high-frequency circuit, it is necessary to provide galvanic blocking between active elements such as transistors and between an active element and an...
Group III-V and group IV composite switch
In one implementation, a group III-V and group IV composite switch includes a group IV transistor in a lower active die, the group IV transistor having a source...
Electrostatic discharge protection device for differential signal devices
A robust electrostatic (ESD) protection device is provided. In one example, the ESD protection device is configured to accommodate three nodes. When used with a...
Protection devices for precision mixed-signal electronic circuits and
methods of forming the same
Apparatus and methods for precision mixed-signal electronic circuit protection are provided. In one embodiment, an apparatus includes a p-well, an n-well, a...
Semiconductor device comprising a plurality of cell arrays including a
well potential supply region and...
A well potential supply region is provided in an N-type well region of a cell array. Adjacent gates disposed in both sides of the well potential supply region...
This invention can reduce heat that is generated in a first semiconductor chip and transfers to a second semiconductor chip through through-silicon vias. The...
This invention prevents a substrate of a semiconductor chip that has through-silicon vias collectively arranged in a specific area thereof from becoming...
Power semiconductor module
The purpose of the present invention is to reduce the wiring inductance of a power semiconductor module. It comprises a first power semiconductor device, a...
Stacked packaged integrated circuit devices, and methods of making same
A device is disclosed which includes a first packaged integrated circuit device, a second packaged integrated circuit device positioned above the first packaged...
Discontinuous patterned bonds for semiconductor devices and associated
systems and methods
Discontinuous bonds for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a first substrate and a second...
Optoelectronic component having chips and conversion elements
An optoelectronic component includes a carrier, a first optoelectronic semiconductor chip arranged on the carrier, a first conversion element arranged on the...
Mirco-electro-mechanical system module and manufacturing method thereof
The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit...
Bonding process for a chip bonding to a thin film substrate
A bonding process for a chip bonded to a thin film substrate is disclosed. The thin film substrate has a thickness of about less than 500 um. Curvature occurs...
Method for manufacturing a multilayer structure on a substrate
The invention relates to a method for manufacturing a multilayer strucute on a first substrate, the method including: using the first substrate made of a first...
Wire bonding method and chip structure
A wire bonding method includes the following steps. First, a substrate including at least one metal finger is provided. Next, a first chip including at least...
Bumpless build-up layer package with pre-stacked microelectronic devices
The present disclosure relates to the field of integrated circuit package design and, more particularly, to packages using a bumpless build-up layer (BBUL)...
Method and apparatus of ESD protection in stacked die semiconductor device
An apparatus includes an interposer and a plurality of dies stacked on the interposer. The interposer includes a first conductive network of a first trigger...
Antioxidant gas blow-off unit
An antioxidant gas blow-off unit includes: a base portion configured as a hollow plate having an antioxidant gas flow passage formed therein; a hole that is...
Die bonder and bonding method
The present invention provides a bonding device and a bonding method with a high operation ratio by solving the problems of conventional techniques. In the...
Silver--gold alloy bonding wire
The silver-gold alloy bonding wire of the present invention includes an alloy composed of not lower than 10% and not higher than 30% of gold (Au) and not lower...
Coreless package structure and method for manufacturing same
A coreless package structure and a method for manufacturing same includes the steps of providing a supporting substrate comprising an etching resist layer and a...
Systems and methods for bonding semiconductor elements
A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first...
Semiconductor device, method for manufacturing the same, circuit
substrate, electro-optical apparatus, and...
A semiconductor device is provided with a plurality of protrusions which are made of a resin and which protrude higher than electrodes, and conductive layers...
Package structure and fabrication method thereof
A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer...
Wire tail connector for a semiconductor device
A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a...
Semiconductor package device and forming the same
In some embodiments in accordance with the present disclosure, a semiconductor device having a semiconductor substrate is provided. A metal structure is...
Bonding structure including metal nano particle
A bonding structure including metal nano particles includes a first member having a metal surface on at least one side, a second member having a metal surface...
Manufacturing method for semiconductor devices
A manufacturing method for semiconductor devices includes the steps of forming an Ni/Au film that includes an Ni film and an Au film formed over the Ni film...
An electronic device includes multiple semiconductor chips in a single housing. Such semiconductor chips may comprise different semiconductor materials, for...
Vertical breakdown protection layer
The present disclosure relates to a semiconductor structure including a plurality of connecting lines arranged on a plurality of vertical levels, the plurality...
A semiconductor device includes a first chip mounting portion, a first semiconductor chip arranged over the first chip mounting portion, a first pad formed in a...
Air bridge structure having dielectric coating
A substrate having an air bridge structure with end portions disposed and supported on the substrate and an elevated portion disposed between the end portions...
Package structures and methods for forming the same
A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally...
A semiconductor package includes a substrate in which a plurality of wires are formed; at least one semiconductor chip electrically connected to portions of the...
Shielded device packages having antennas and related fabrication methods
Shielded device packages and related fabrication methods are provided. An exemplary device package includes one or more electrical components, a molding...
Radio frequency shielding within a semiconductor package
Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and...
Apparatus and method for embedding components in small-form-factor,
According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a ...
Molecular self-assembly in substrate processing
Methods for sealing a porous dielectric are presented including: receiving a substrate, the substrate including the porous dielectric; exposing the substrate to...
Methods to form conductive thin film structures
Electrically conductive structures and methods of making electrically conductive structures. The methods include providing a dielectric layer of a material...
Semiconductor devices with enhanced electromigration performance
Semiconductor devices with enhanced electromigration performance and methods of manufacture are disclosed. The method includes forming at least one metal line...
Electro-migration enhancing method for self-forming barrier process in
A method of forming a barrier on both the sidewalls and bottom of a via and the resulting device are provided. Embodiments include forming a metal line in a...
Topological insulator in IC with multiple conductor paths
A topological insulator is grown on an IC wafer in a vacuum chamber as a thin film interconnect between two circuits in the IC communicating with each other. As...
Three-dimensional (3D) semiconductor devices and methods of fabricating 3D
A three-dimensional (3D) semiconductor device includes a stack of conductive layers spaced from each other in a vertical direction, the stack having a...
Data storage device and methods of manufacturing the same
Provided are data storage devices and methods of manufacturing the same. The device may include a plurality of cell selection parts formed in a substrate, a...
Electrical fuse and method of fabricating the same
An electrical fuse is provided. The electrical fuse includes an anode formed on a substrate, a cathode formed on the substrate, a fuse link connecting the anode...
Integrated circuit assembly with cushion polymer layer
A method of forming an integrated circuit assembly includes forming an insulator layer on a preliminary semiconductor assembly. The preliminary semiconductor...
Interconnection between inductor and metal-insulator-metal (MIM) capacitor
Embodiments of mechanisms for forming a semiconductor device structure are provided. The semiconductor device structure includes a metal-insulator-metal (MIM)...
Surface mountable power components
According to an exemplary implementation, a power component includes a component substrate and a power semiconductor device electrically and mechanically...