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Self-aligned semiconductor fabrication with fosse features
The present disclosure describes methods for transferring a desired layout into a target layer on a semiconductor substrate. An embodiment of the methods...
Non-volatile memory device and method for manufacturing same
According to an embodiment, a non-volatile memory device includes a first wiring provided on an underlayer, a first memory cell array provided on the first...
Method of supplying cobalt to recess
A method of supplying cobalt to a recess formed in an insulation film of an object to be processed is disclosed. In one embodiment, the method includes forming...
Method of forming copper wiring
A method of forming a copper wiring buried in a recess portion of a predetermined pattern formed in an interlayer insulation layer of a substrate is disclosed....
2D self-aligned via first process flow
A method of forming 2D self-aligned vias before forming a subsequent metal layer and reducing capacitance of the resulting device and the resulting device are...
Hybrid interconnect scheme and methods for forming the same
A device includes a first low-k dielectric layer, and a copper-containing via in the first low-k dielectric layer. The device further includes a second low-k...
Methods and apparatuses for atomic layer cleaning of contacts and vias
Described are cleaning methods for removing contaminants from an electrical contact interface of a partially fabricated semiconductor substrate. The methods may...
Methods of fabricating BEOL interlayer structures
Methods are provided for fabricating an interlayer structure useful in, for instance, providing BEOL interconnect for circuit structures. The method includes,...
Semiconductor device and method of forming 3D dual side die embedded
build-up semiconductor package
A semiconductor device has a plurality of semiconductor die. A substrate is provided with bumps disposed over the substrate. A first prefabricated insulating...
SOI structure and method for utilizing trenches for signal isolation and
Disclosed is a structure for improved electrical signal isolation between adjacent devices situated in a top semiconductor layer of the structure and an...
Manufacturing method for display device
A method of manufacturing a display device that includes: performing a surface treatment on at least one of two opposing surfaces of a carrier substrate and a...
OTP memory cell and fabricating method thereof
A one-time programmable (OTP) memory cell is provided, which includes: a well of a first conductivity type; a gate insulating layer formed on the well and...
Method of processing substrate holder material as well as substrate holder
processed by such method
A method is provided of processing substrate holder material for a substrate holder on which on a first side of said substrate holder a semiconductor substrate...
Dicing tape-integrated film for semiconductor back surface
The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a...
Suppporting device, method for manufacturing thin film transistor array
substrate and method for manufacturing...
A supporting device includes a main body and a ring-shaped glue layer. The main body includes a top surface and a bottom surface opposite to the top surface....
Method for treatment of a temporarily bonded product wafer
A method for treatment of a product wafer temporarily bonded on a carrier wafer with the following steps: grinding and/or backthinning of the product wafer on...
Method for aligning substrates in different spaces and having different
A method for aligning substrates in different spaces and having different sizes includes: capturing actual local images of two substrates; comparing specific...
Article supporting device
Each of a pair of support members includes a lightweight-article support portion that is inserted into an insertion space of a lightweight article and supports...
Substrate warp correcting device and substrate warp correcting method
A substrate warp correcting device includes, a lower member including a concave portion, and the lower member on which a substrate is to be arranged, an upper...
Substrate processing apparatus
A substrate processing apparatus includes a housing, a mounting table provided in the housing and configured to mount a substrate thereon, a drive mechanism...
Etching method, etching apparatus, and storage medium
Provided is a method of etching a silicon oxide film, which includes supplying a mixture gas of a halogen element-containing gas and a basicity gas onto a...
Shielded lid heater assembly
A shielded lid heater lid heater suitable for use with a plasma processing chamber, a plasma processing chamber having a shielded lid heater and a method for...
Substrate treatment method
A substrate treatment method employs a substrate holding unit, a gas ejection nozzle, and a gas supply unit. The substrate holding unit is configured to hold a...
A washing device is disclosed, which is capable of preventing damage of a substrate caused by drooping of the substrate. The washing device includes a plasma...
Semiconductor apparatus and method for producing the same
A method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, includes: an arranging step of arranging on one...
Article and panel comprising semiconductor chips, casting mold and methods
of producing the same
A panel with a reconfigured wafer including semiconductor chips arranged in rows and columns on semiconductor device positions includes: at least one...
Methods for forming semiconductor device packages with photoimageable
dielectric adhesive material, and related...
Methods for forming semiconductor device packages include applying a photoimageable dielectric adhesive material to a major surface of a semiconductor die and...
Flip-chip electronic device and production method thereof
A method for making a set of electronic devices is proposed. The method comprises the steps of providing a support comprising a base plate of electrically...
Microelectronic devices, stacked microelectronic devices, and methods for
manufacturing such devices
Stacked microelectronic devices and methods for manufacturing such devices are disclosed herein. In one embodiment, a stacked microelectronic device assembly...
Package stack device and fabrication method thereof
A package stack device includes a first package structure having a plurality of first metal posts and a first electronic element, a second package structure...
Method of making a semiconductor device having a functional capping
A wafer level method of making a micro-electronic and/or micro-mechanic device, having a capping with electrical wafer through connections (vias), comprising...
IC package and method for manufacturing the same
An IC package is provided. The IC package comprises a leadframe comprising a metal strip (222) partially etched on a first side. The leadframe may be configured...
Plasma treating apparatus, substrate treating method, and method of
manufacturing a semiconductor device
A substrate treating method may be performed by a plasma treating apparatus. The substrate treating method may include: providing a substrate on a platform in a...
Method of manufacturing semiconductor device
In a manufacturing process of a transistor including an oxide semiconductor film, oxygen doping treatment is performed on the oxide semiconductor film, and then...
Semiconductor device manufacturing method
A semiconductor device manufacturing method, the method including: forming an insulation layer having a protruding portion, the insulation layer having a...
Chip package and fabrication method thereof
A fabrication method of a chip package includes the following steps. A wafer structure having a wafer and a protection layer is provided. The first opening of...
Method for forming a mask by etching conformal film on patterned ashable
Methods and apparatuses for multiple patterning using image reversal are provided. The methods may include depositing gap-fill ashable hardmasks using a...
Systems and methods for a sequential spacer scheme
The present disclosure describes methods for transferring a desired layout into a target layer. The method includes a step of forming a spacer, having a second...
Fast atomic layer etch process using an electron beam
An etch process gas is provided to a main process chamber having an electron beam plasma source, and during periodic passivation operations a remote plasma...
Enhanced etching processes using remote plasma sources
Methods of etching a patterned substrate may include flowing an oxygen-containing precursor into a first remote plasma region fluidly coupled with a substrate...
Polishing apparatus and polishing method
A polishing apparatus is used for polishing a surface of a substrate such as a semiconductor wafer to planarize the surface of the substrate. The polishing...
Methods for fabricating integrated circuits and components thereof
Methods for fabricating integrated circuits and components thereof are provided. In accordance with an exemplary embodiment, a method for a fabricating a...
Method for processing a workpiece by forming a pourous metal layer
A method for processing a workpiece may include: providing a workpiece including a first region and a second region; forming a porous metal layer over the first...
Process for making a patterned metal oxide structure
There is provided a process for making a patterned metal oxide structure comprising the step of heating an imprint structure comprising a polymerized...
A semiconductor process is described. A semiconductor substrate having a memory area, a first device area and a second device area is provided. A patterned...
Method of patterning a metal gate of semiconductor device
Provided are methods of patterning metal gate structures including a high-k gate dielectric. In an embodiment, a soluble hard mask layer may be used to provide...
Structure and method for integrated devices on different substartes with
The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure includes a semiconductor substrate having a first...
Process for contact doping
Provided is a process for modifying the chemical composition of a surface region of a material, employing rapid thermal processing (RTP) conditions.
Method of manufacturing a silicon carbide semiconductor device
A silicon carbide substrate including a first impurity region, a well region, and a second impurity region separated from the first impurity region by the well...
Lithography process and composition with de-crosslinkable crosslink
The present disclosure provides a method that includes forming a polymeric material layer on a substrate, wherein the polymeric material layer includes...