At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.
Flexible, stretchable electronic devices
Fabrication methods are disclosed that facilitate the production of electronic structures that are both flexible and stretchable to conform to non-planar (e.g....
Copper wiring structure forming method
In a Cu wiring structure forming method, a barrier film serving as a Cu diffusion barrier is formed at least on a surface of a recess in a first insulating film...
Contact test structure and method
A system and method for testing electrical connections is provided. In an embodiment one or more floating pads may be manufactured in electrical connection with...
Continuous voltage product binning
A binning process uses curve fitting to create and assign one or more bins based on testing data of operating voltage versus leakage current for test integrated...
Non-destructive, wafer scale method to evaluate defect density in
heterogeneous epitaxial layers
A semiconductor material stack of, from bottom to top, a first semiconductor material having a first lattice constant and a second semiconductor material having...
Semiconductor inspecting apparatus and method of inspecting and
manufacturing semiconductor device using the same
A method of manufacturing a semiconductor device includes: preparing a semiconductor device comprising a first substrate, a second substrate disposed on the...
Light exposure condition analysis method, nontransitory computer readable
medium storing a light exposure...
According to one embodiment, a pattern formed through light exposure is observed under two or more different optical conditions, and a focus shift and exposure...
Method for manufacturing semiconductor device
A method for manufacturing one or more semiconductor devices may include the following steps: providing a dielectric layer on a substrate structure that...
Method for the formation of fin structures for FinFET devices
A SOI substrate layer formed of a silicon semiconductor material includes adjacent first and second regions. A portion of the silicon substrate layer in the...
Semiconductor devices having tensile and/or compressive stress and methods
A semiconductor device and method of manufacturing is disclosed which has a tensile and/or compressive strain applied thereto. The method includes forming at...
Semiconductor structure and fabrication method
The present disclosure provides a method for fabricating semiconductor devices. The method includes providing a substrate with a gate electrode film on the...
Method of manufacturing a semiconductor device with buried channel/body
zone and semiconductor device
A semiconductor device includes a source zone of a first conductivity type formed in a first electrode fin that extends from a first surface into a...
Crack control for substrate separation
A method for separating a layer for transfer includes forming a crack guiding layer on a substrate and forming a device layer on the crack-guiding layer. The...
Method for manufacturing semiconductor chip
A method for manufacturing a semiconductor chip includes forming a front-side groove in a front surface of a substrate; forming a back-side groove wider than...
Method for manufacturing semiconductor device
A method for manufacturing a semiconductor device that includes steps of: (1) adhering a support substrate to a first surface of a wafer using an adhesive, the...
Method for dicing a substrate with back metal
The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a...
Method for manufacturing a semiconductor device
The performances of semiconductor elements disposed in a multilayer wiring layer are improved. A semiconductor device includes: a first wire disposed in a first...
Conductive line system and process
A system and method for providing a conductive line is provided. In an embodiment the conductive line is formed by forming two passivation layers, wherein each...
Embedded structures for package-on-package architecture
Electronic assemblies including substrates and their manufacture are described. One assembly includes a die embedded in a dielectric layer in a multilayer...
Formation of a masking layer on a dielectric region to facilitate
formation of a capping layer on electrically...
A masking layer is formed on a dielectric region of an electronic device so that, during subsequent formation of a capping layer on electrically conductive...
Semiconductor device and method for forming the same
A semiconductor device includes a semiconductor substrate including an active region defined by a device isolation film; a gate electrode filled in the active...
Interconnect structure and method of fabricating same
An interconnect structure and a method of fabrication of the same are introduced. In an embodiment, a post passivation interconnect (PPI) structure is formed...
Method for forming a vertical electrical connection in a layered
The invention proposes a method for forming a vertical electrical connection (50) in a layered semiconductor structure (1), comprising the following steps:...
Gap fill treatment for via process
A gap fill treatment for via process is provided. A substrate with a plurality of openings has formed therein is provided. The substrate includes a dense...
Self-aligned via and air gap
Provided are approaches for forming a self-aligned via and an air gap within a semiconductor device. Specifically, one approach produces a device having: a...
Dry etching gas and method of manufacturing semiconductor device
The present disclosure provides a method of manufacturing a semiconductor device. The method includes providing a semiconductor substrate; forming a conductive...
Line-edge roughness improvement for small pitches
A method for mitigating line-edge roughness on a semiconductor device. The method includes line-edge roughness mitigation techniques in accordance with...
MIM capacitor structure
The present disclosure relates to a MIM (metal-insulator-metal) capacitor, and an associated method of formation. In some embodiments, the MIM capacitor...
CMOS inverters and fabrication methods thereof
A CMOS inverter is provided. The CMOS inverter includes a substrate. The CMOS inverter also includes an NMOS transistor having a first active region, a first...
A method for fabricating a semiconductor apparatus including providing a first silicon substrate having a first contact, wherein providing the first silicon...
Semiconductor device with voids within silicon-on-insulator (SOI)
structure and method of forming the...
A semiconductor device with voids within a silicon-on-insulator (SOI) structure and a method of forming the semiconductor device are provided. Voids are formed...
Apparatus for FinFETs
A FinFET comprises an isolation region formed in a substrate, a reverse T-shaped fin formed in the substrate, wherein a bottom portion of the reverse T-shaped...
Method of forming shallow trench isolation structure
A method of forming a shallow trench isolation (STI) structure in a substrate includes forming a pad oxide layer over the substrate. The method includes forming...
Corner transistor suppression
The threshold voltage of parasitic transistors formed at corners of shallow trench isolation regions is increased and mobility decreased by employing a high-K...
Manufacturing method for semiconductor integrated circuit device
A method for manufacturing a semiconductor integrated circuit device includes the step of forming an SOI device region and a bulk device region on an SOI type...
Substrate conveying method, recording medium in which program is recorded
for causing substrate conveying...
A substrate conveying method conveying a layered body having first and second substrates stacked with a spacer member provided between their respective bottom...
Substrate treating apparatus with substrate reordering
A treating section has substrate treatment lines arranged one over the other for treating substrates while transporting the substrates substantially...
Elevator-based tool loading and buffering system
A substrate processing apparatus is provided. The apparatus has a casing, a low port interface and a carrier holding station. The casing has processing devices...
Transfer robot, its substrate transfer method and substrate transfer relay
A transfer robot is equipped with a first hand and a second hand. The first and the second hands, each have two blades, for holding respective substrates. In...
Substrate processing device with connection space
Provided is a substrate processing apparatus. The substrate processing apparatus includes a chamber providing a stacking space in which a substrate is stacked...
Systems and methods of controlling semiconductor wafer fabrication
A system and method of controlling a semiconductor wafer fabrication process. The method includes positioning a semiconductor wafer on a wafer support assembly...
Semiconductor wafer cleaning system
A semiconductor wafer cleaning apparatus comprising a first supporting unit, a movable unit having a first chamber, a second supporting unit having a second...
Plasma processing apparatus
The present invention provides a temperature control unit for an electrostatic adsorption electrode that is capable of controlling the wafer temperature rapidly...
Mechanical debonding method and system
A mechanical debonding method and system are provided. A mechanical debonding method, used to debond temporary bonding wafers formed by bonding a device wafer...
Apparatus and method for self-aligning chip placement and leveling
An approach is provided for aligning and leveling a chip package portion. The approach involves filling, at least partially, a reservoir formed between a first...
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an...
Method of joining semiconductor substrate
A method of joining semiconductor substrates includes: forming an alignment key on a first semiconductor substrate; forming a first protrusion and a second...
Method for manufacturing semiconductor device
It includes the step of pressing a correcting tool against the main surface of a semiconductor chip while a solder material coated over a die pad is in a molten...
Retaining ring having inner surfaces with facets
A retaining ring comprises a generally annular body. The body comprises a top surface, a bottom surface, an outer surface connected to the top surface at an...
Temperature ramping using gas distribution plate heat
A method for etching a dielectric layer disposed on a substrate is provided. The method includes de-chucking the substrate from an electrostatic chuck in an...