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On-chip RF shields with backside redistribution lines
Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes...
Method of fabricating semiconductor device including a substrate having
A method of fabricating a semiconductor device including a substrate having a copper interconnect exposed on a surface of an insulation film, wherein a layer of...
Self-aligned barrier and capping layers for interconnects
An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing...
Method for depositing a diffusion barrier layer and a metal conductive
We disclose a method of applying a sculptured layer of material on a semiconductor feature surface using ion deposition sputtering, wherein a surface onto which...
Integrated circuit and interconnect, and method of fabricating same
The disclosure relates generally to integrated circuits (IC), IC interconnects, and methods of fabricating the same, and more particularly, high performance...
Low temperature thin wafer backside vacuum process with backgrinding tape
Vacuum processing, such as a backside metallization (BSM) deposition, is performed on a taped wafer after a gas escape path is formed between a base film of the...
Method for residue-free block pattern transfer onto metal interconnects
for air gap formation
A selective wet etching process is used, prior to air gap opening formation, to remove a sacrificial nitride layer from over a first region of an interconnect...
Methods of forming wiring structures and methods of fabricating
Methods of forming a wiring structure are provided including forming an insulating interlayer on a substrate and forming a sacrificial layer on the insulating...
Air-gap forming techniques for interconnect structures
An interconnect structure includes a first low-k dielectric layer formed over a substrate. A first metal line is disposed in the first low-k dielectric layer....
Methods for fabricating dual damascene structures in low temperature
Methods for fabricating dual damascene structures are provided herein. In some embodiments, a method for fabricating a dual damascene interconnect structure may...
Semiconductor memory device
A semiconductor memory device includes a plurality of auxiliary patterns formed over a semiconductor substrate, a plurality of gate line patterns disposed in...
Methods for fabricating device substrates and integrated circuits
Methods for fabricating device substrates are provided where the device substrates have rounded trench corners in medium voltage (MV) and high voltage (HV)...
Semiconductor devices having plug insulators
Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a first bit line structure extending in a first...
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device including performing a first thermal processing a silicon substrate in a first atmosphere and at a first...
Semiconductor package with stator set formed by circuits
A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface...
Transfer unit including suction openings configured to receive suction
pads or seal members therein
A transfer unit transferring a wafer from or to a cassette is provided. The transfer unit includes a holding portion holding the wafer under suction and a...
Substrate transfer apparatus and method, and substrate processing
Provided are a substrate transfer apparatus and method and a substrate processing apparatus. The substrate transfer apparatus includes: a body portion; an arm...
Method for the temporary connection of a product substrate to a carrier
A method for temporary connection of a product substrate to a carrier substrate comprised of the steps of: applying an interconnect layer to a product...
Handle substrate and composite wafer for semiconductor device
In a handle substrate for a composite wafer for a semiconductor, particles from the wafer with a notch formed therein are reduced. The handle substrate 1A or 1B...
Substrate transfer robot, substrate transfer system, and method for
detecting arrangement state of substrate
A substrate transfer robot includes a hand and a controller. The hand includes at least one detector configured to detect an arrangement state of a substrate in...
Substrate damage detection device, substrate transfer robot with substrate
damage detection device, and...
A substrate damage detection device is configured to be mounted to a substrate transfer robot provided with a slidably-movable substrate support. The substrate...
Device and method for loading and unloading quartz reaction tube to and
from semiconductor diffusion equipment
A loading and unloading device and method for a quartz reaction tube of a semiconductor diffusion equipment are provided; the loading and unloading device is...
Methods and systems for electric field deposition of nanowires and other
Methods, systems, and apparatuses for nanowire deposition are provided. A deposition system includes an enclosed flow channel, an inlet port, and an electrical...
Rapid thermal processing chamber with micro-positioning system
Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an...
Wafer debonding and cleaning apparatus and method of use
This description relates to a wafer debonding and cleaning apparatus including an automatic wafer handling module. The automatic wafer handling module loads a...
Tape attaching apparatus and tape attaching method
A tape attaching apparatus includes: a chamber having an airtight space formed therein; a rubber sheet that partitions the airtight space into first and second...
Thermal processing method and thermal processing apparatus for heating
substrate, and susceptor
A semiconductor wafer with (100) plane orientation has two orthogonal cleavage directions. A notch is provided so as to indicate one of these directions. During...
A cleaning apparatus including a holding table for holding a plate-shaped workpiece, a cleaning nozzle for spraying a cleaning fluid to the plate-shaped...
Semiconductor device and method of depositing underfill material with
uniform flow rate
A semiconductor device has a substrate and insulating layer formed over a surface of the substrate. A first conductive layer is formed over the surface of the...
Electrical connectivity for circuit applications
According to example configurations herein, a leadframe includes a first conductive strip, a second conductive strip, and a third conductive strip disposed...
Substrate processing apparatus
A substrate processing apparatus generates an electric field in a processing space between a lower electrode to which a high frequency power is supplied and an...
Method, system, and apparatus for preparing substrates and bonding
semiconductor layers to substrates
Embodiments of preparing substrates for subsequent bonding with semiconductor layer are described herein. A substrate may be prepared with one or more chemicals...
Sample processing apparatus, sample processing system, and method for
There is provided a VUV light processing apparatus that can apply vacuum ultraviolet light to the entire surface of a wafer in excellent reproducibility and can...
Methods of etching films comprising transition metals
Provided are methods for etching films comprising transition metals. Certain methods involve activating a substrate surface comprising at least one transition...
Methods of forming MIS contact structures for semiconductor devices and
the resulting devices
One method disclosed includes, among other things, conformably depositing a layer of contact insulating material and a conductive material layer in a contact...
To provide a means by which polishing rate can further be improved in a polishing composition to be used for an application of polishing an object to be...
Silicon-carbon-nitride selective etch
A method of etching exposed silicon-nitrogen-and-carbon-containing material on patterned heterogeneous structures is described and includes a remote plasma etch...
Methods for fabricating high aspect ratio probes and deforming high aspect
ratio nanopillars and micropillars
Methods for fabricating of high aspect ratio probes and deforming micropillars and nanopillars are described. Use of polymers in deforming nanopillars and...
Provided is an etching method for forming a space with an aspect ratio of 50 or more in a workpiece including a silicon oxide film and a hard mask. The etching...
Phase shift mask, method of forming asymmetric pattern, method of
manufacturing diffraction grating, and method...
A technique of forming an asymmetric pattern by using a phase shift mask, and further, techniques of manufacturing a diffraction grating and a semiconductor...
Etching method, storage medium and etching apparatus
There is a method of selectively etching a silicon oxide film among a silicon nitride film and the silicon oxide film formed on a surface of a substrate to be...
Electropositive metal containing layers for semiconductor applications
Embodiments of the present invention provide methods for forming layers that comprise electropositive metals through ALD (atomic layer deposition) and or CVD...
Manufacturing method of strip-shaped conductive structures and
non-volatile memory cell
A manufacturing method of floating gate is disclosed. A substrate having a plurality of isolation structures is provided, and top surfaces of the isolation...
Surface stabilization process to reduce dopant diffusion
A method for incorporating radicals of a plasma into a substrate or a material on a semiconductor substrate using a remote plasma source. In one embodiment, a...
CMOS image sensor
A CMOS image sensor includes a photodiode, a plurality of transistors for transferring charges accumulated at the photodiode to one column line, and a voltage...
Anisotropic dielectric material gate spacer for a field effect transistor
Capacitive coupling between a gate electrode and underlying portions of the source and drain regions can be enhanced while suppressing capacitive coupling...
Contact formation for split gate flash memory
An integrated circuit structure includes a plurality of flash memory cells forming a memory array, wherein each of the plurality of flash memory cells includes...
Process sheet resistance uniformity improvement using multiple melt laser
Embodiments described herein relate to apparatus and methods of thermal processing. More specifically, apparatus and methods described herein relate to laser...
Silicon--germanium (SiGe) fin formation
Constructing an SiGe fin by: (i) providing an intermediate sub-assembly including a silicon-containing base layer and a silicon-containing first fin structure...
Method for manufacturing SiC substrate
A method for manufacturing a SiC substrate is provided. The method includes: a sacrificial film-forming process of forming a sacrificial film on a surface of a...