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Methods for producing image sensors having multi-purpose architectures
A charge-coupled device (CCD) image sensor includes multiple vertical charge-coupled device (VCCD) shift registers and independently-controllable gate...
Magnetic field shielding sheet for digitizer and method of manufacturing
the same and portable terminal device...
A magnetic field shielding sheet includes: at least one layer thin magnetic sheet made of a Fe-based amorphous alloy and flake-treated so as to be separated...
Security wrapper for an electronic assembly and methods for forming such a
A security wrapper for an electronic assembly and methods for forming such a wrapper are provided. A first wrap layer and/or a second wrap layer may be made...
Data center cooling
A system includes a substantially sealed, substantially airtight cabinet sized for housing a vertical array of heat-producing units, the cabinet having an...
Electronic control unit and rotating electric machine
An electronic control unit is equipped with a semiconductor module having a semiconductor chip electrically connected to the first circuit pattern and the...
Cooling apparatus with dynamic load adjustment
A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to...
Systems, structures and materials for electronic device cooling
An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The...
Exemplary embodiments of the present disclosure are directed to an apparatus including pipes having internal longitudinal walls dividing the pipes into...
Automatic in situ coolant flow control in LFT heat exchanger
In association with a liquid flow through a heat exchanger situated to remove heat from electronic devices, a coolant flow control apparatus is provided. The...
Cooled electronic system
A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to...
Airflow control system
An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned...
Electronics chassis adaptable for forced air or liquid conduction cooling
An electronics chassis comprises a frame including at least one fluid flow path along a side of the frame and that is sealed relative to an interior volume of...
Power supply system comprising a power converter unit and a rack
A power supply system having a power converter unit and a rack. The rack has a shelf and a shelf connection device. The power converter unit has a housing and a...
Modular application of peripheral panels as security protection screens
with individual locking mechanisms...
A rack-based information handling system (RIHS) includes a rack chassis having at least two opposing side panels which are structurally held in place by one or...
Cable backplane assembly and method
An electronic device includes a bulkhead assembly. The bulkhead assembly includes a bulkhead and one or more cable cassettes coupled to the bulkhead. The cable...
Sliding mechanism with locking function
A sliding mechanism with locking function includes a slide frame and a resilient plate. The slide frame includes opposite front and rear ends and an end plate...
Server rack architecture that facilitates reduced current density
A server rack with vertically stacked shelves is disclosed. The shelves are used for housing loads (e.g. servers) and power supply units. Thus, both the power...
Surrounding-buckle type mobile hard drive rack
A hard drive rack includes a frame and a buckle arm. The frame includes a plurality of plates and at least one insertion opening. A buckle trough is formed on...
An electronic device is provided. The electronic device includes a display module, a support plate on which the display module is disposed, and a plurality of...
According to one embodiment, a display device includes a display, a circuit substrate, connector terminals, a first cover, a second cover, and a fastening...
Driver assembly and method for manufacturing the same
A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower...
A display device having a compact structure includes a main board and an inverter board of the display device connected to each other. A bracket supports the...
Power semiconductor module and method of manufacturing a power
A power semiconductor module, and method for its manufacture, comprising a first housing part having a cutout and a DC voltage load connection apparatus forming...
Low cost high strength surface mount package
A hermetically sealed package has an electrically insulating substrate, a plurality of electrically and thermally conductive tabs, and a lid. The electrically...
Electrical module and device using the same
An electrical module and a device using the same are provided. The electrical module comprises a base, a composite component and a pressing sheet. The composite...
Electrical junction box with built-in isolation transformer
An electrical junction box with a built-in isolation transformer is provided. The junction box includes an interior base portion having at least one opening, a...
Waterproof structure for electronic unit
A waterproof structure for an electronic unit includes a sub-case that defines an accommodating portion that accommodates a first terminal, and has a cable...
Cold shrinkable primary joint
A splice housing is configured to slide over and engage with a metallic connector that couples together cable conductors in an electrical distribution system....
An enclosure includes a plurality of modular construction units that connect together to at least partially define an internal compartment of the enclosure....
Provided is a display device that is exceptionally easy to assemble. A display device includes an electroconductive housing. A case body accommodates the...
A mobile terminal may be provided that includes a case having a through window formed in front of the case, an optical sensor arranged in the case toward the...
Wiring board with through wiring
A wiring board includes a substrate body provided with a through hole penetrating the substrate body from one surface to another surface; and a through wiring...
Method of producing resonant patterns adapted to the implementation of RF
A method for producing one or more radio-frequency resonant patterns on a printed circuit includes a step of cutting one or more resonant patterns directly into...
Pad structure and mounted structure
A pad structure includes an insulating layer; a first metal layer formed on one surface of the insulating layer and including an intermetallic compound layer of...
Method of manufacturing surface mount device
Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a...
Electronic component package
An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one...
Transparent conductive film and preparation method thereof
A transparent conductive film includes a transparent substrate and a polymer layer formed on the transparent substrate, a surface of the polymer layer is...
Printed circuit board and method of manufacturing the same
Disclosed herein are a printed circuit board (PCB) and a method of manufacturing the same. The PCB includes a core layer, metal bumps embedded in the core...
Chip-embedded printed circuit board and semiconductor package using the
PCB, and manufacturing method of the PCB
A chip-embedded printed circuit board (PCB), a semiconductor package using the PCB, and a manufacturing method of the chip-embedded PCB. The semiconductor...
Package and method of manufacturing package thereof
A method of manufacturing a package may include forming a package module by disposing a plurality of components on an insulating plate filled with a viscous...
A semiconductor package includes a substrate, a first conductive layer, a second conductive layer, a first surface mount device, a second surface mount device...
Electric component module
There is provided an electronic component module capable of increasing the degree of integration by mounting electronic components on both surfaces of a...
Package, electronic device, method of manufacturing electronic device,
electronic apparatus, and mobile body
A package includes an accommodation space portion, and a first base body that forms at least a part of the accommodation space portion. A first through-hole,...
Method for manufacturing printed circuit board with shallow solder pad
An exemplary printed circuit board includes a base, solder pads, and signal traces. The base includes outer surfaces. The signal traces having a first height...
Wiring substrate having border portion separating two side metallic foils
and manufacturing method of wiring...
A wiring substrate includes a resin substrate in which first and second through holes are formed, a metallic foil on one surface of the resin substrate coating...
Multi-stacked electronic device with defect-free solder connection
A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe,...
Method and structure to improve the conductivity of narrow copper filled
Techniques for improving the conductivity of copper (Cu)-filled vias are provided. In one aspect, a method of fabricating a Cu-filled via is provided. The...
Metal-clad laminate, method for producing same, and flexible printed board
A metal-clad laminate, including metal foil, and a first resin layer arranged on the metal foil, the first resin layer including an epoxy resin and a...
Biomass photosensitive material and method for manufacturing the same, and
printed circuit board
A method of forming a biomass photosensitive material is provided, which includes (1) polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer,...
A circuit board includes a multi-layer structure, a ceramic member, and a first conductive layer. The multi-layer structure has a thru-hole penetrating two...