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Patent # Description
US-9,392,736 Methods for producing image sensors having multi-purpose architectures
A charge-coupled device (CCD) image sensor includes multiple vertical charge-coupled device (VCCD) shift registers and independently-controllable gate...
US-9,392,735 Magnetic field shielding sheet for digitizer and method of manufacturing the same and portable terminal device...
A magnetic field shielding sheet includes: at least one layer thin magnetic sheet made of a Fe-based amorphous alloy and flake-treated so as to be separated...
US-9,392,734 Security wrapper for an electronic assembly and methods for forming such a wrapper
A security wrapper for an electronic assembly and methods for forming such a wrapper are provided. A first wrap layer and/or a second wrap layer may be made...
US-9,392,733 Data center cooling
A system includes a substantially sealed, substantially airtight cabinet sized for housing a vertical array of heat-producing units, the cabinet having an...
US-9,392,732 Electronic control unit and rotating electric machine
An electronic control unit is equipped with a semiconductor module having a semiconductor chip electrically connected to the first circuit pattern and the...
US-9,392,731 Cooling apparatus with dynamic load adjustment
A cooling apparatus is disclosed, which may include multiple heat producing units. The cooling apparatus may also have a thermal interface material (TIM) to...
US-9,392,730 Systems, structures and materials for electronic device cooling
An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The...
US-9,392,729 Cooling apparatus
Exemplary embodiments of the present disclosure are directed to an apparatus including pipes having internal longitudinal walls dividing the pipes into...
US-9,392,728 Automatic in situ coolant flow control in LFT heat exchanger
In association with a liquid flow through a heat exchanger situated to remove heat from electronic devices, a coolant flow control apparatus is provided. The...
US-9,392,727 Cooled electronic system
A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to...
US-9,392,726 Airflow control system
An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned...
US-9,392,725 Electronics chassis adaptable for forced air or liquid conduction cooling
An electronics chassis comprises a frame including at least one fluid flow path along a side of the frame and that is sealed relative to an interior volume of...
US-9,392,724 Power supply system comprising a power converter unit and a rack
A power supply system having a power converter unit and a rack. The rack has a shelf and a shelf connection device. The power converter unit has a housing and a...
US-9,392,723 Modular application of peripheral panels as security protection screens with individual locking mechanisms...
A rack-based information handling system (RIHS) includes a rack chassis having at least two opposing side panels which are structurally held in place by one or...
US-9,392,722 Cable backplane assembly and method
An electronic device includes a bulkhead assembly. The bulkhead assembly includes a bulkhead and one or more cable cassettes coupled to the bulkhead. The cable...
US-9,392,721 Sliding mechanism with locking function
A sliding mechanism with locking function includes a slide frame and a resilient plate. The slide frame includes opposite front and rear ends and an end plate...
US-9,392,720 Server rack architecture that facilitates reduced current density
A server rack with vertically stacked shelves is disclosed. The shelves are used for housing loads (e.g. servers) and power supply units. Thus, both the power...
US-9,392,719 Surrounding-buckle type mobile hard drive rack
A hard drive rack includes a frame and a buckle arm. The frame includes a plurality of plates and at least one insertion opening. A buckle trough is formed on...
US-9,392,718 Electronic device
An electronic device is provided. The electronic device includes a display module, a support plate on which the display module is disposed, and a plurality of...
US-9,392,717 Display device
According to one embodiment, a display device includes a display, a circuit substrate, connector terminals, a first cover, a second cover, and a fastening...
US-9,392,716 Driver assembly and method for manufacturing the same
A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower...
US-9,392,715 Display device
A display device having a compact structure includes a main board and an inverter board of the display device connected to each other. A bracket supports the...
US-9,392,714 Power semiconductor module and method of manufacturing a power semiconductor
A power semiconductor module, and method for its manufacture, comprising a first housing part having a cutout and a DC voltage load connection apparatus forming...
US-9,392,713 Low cost high strength surface mount package
A hermetically sealed package has an electrically insulating substrate, a plurality of electrically and thermally conductive tabs, and a lid. The electrically...
US-9,392,712 Electrical module and device using the same
An electrical module and a device using the same are provided. The electrical module comprises a base, a composite component and a pressing sheet. The composite...
US-9,392,711 Electrical junction box with built-in isolation transformer
An electrical junction box with a built-in isolation transformer is provided. The junction box includes an interior base portion having at least one opening, a...
US-9,392,710 Waterproof structure for electronic unit
A waterproof structure for an electronic unit includes a sub-case that defines an accommodating portion that accommodates a first terminal, and has a cable...
US-9,392,709 Cold shrinkable primary joint
A splice housing is configured to slide over and engage with a metallic connector that couples together cable conductors in an electrical distribution system....
US-9,392,708 Modular enclosure
An enclosure includes a plurality of modular construction units that connect together to at least partially define an internal compartment of the enclosure....
US-9,392,707 Display device
Provided is a display device that is exceptionally easy to assemble. A display device includes an electroconductive housing. A case body accommodates the...
US-9,392,706 Mobile terminal
A mobile terminal may be provided that includes a case having a through window formed in front of the case, an optical sensor arranged in the case toward the...
US-9,392,705 Wiring board with through wiring
A wiring board includes a substrate body provided with a through hole penetrating the substrate body from one surface to another surface; and a through wiring...
US-9,392,704 Method of producing resonant patterns adapted to the implementation of RF passive functions
A method for producing one or more radio-frequency resonant patterns on a printed circuit includes a step of cutting one or more resonant patterns directly into...
US-9,392,703 Pad structure and mounted structure
A pad structure includes an insulating layer; a first metal layer formed on one surface of the insulating layer and including an intermetallic compound layer of...
US-9,392,702 Method of manufacturing surface mount device
Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a...
US-9,392,701 Electronic component package
An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one...
US-9,392,700 Transparent conductive film and preparation method thereof
A transparent conductive film includes a transparent substrate and a polymer layer formed on the transparent substrate, a surface of the polymer layer is...
US-9,392,699 Printed circuit board and method of manufacturing the same
Disclosed herein are a printed circuit board (PCB) and a method of manufacturing the same. The PCB includes a core layer, metal bumps embedded in the core...
US-9,392,698 Chip-embedded printed circuit board and semiconductor package using the PCB, and manufacturing method of the PCB
A chip-embedded printed circuit board (PCB), a semiconductor package using the PCB, and a manufacturing method of the chip-embedded PCB. The semiconductor...
US-9,392,697 Package and method of manufacturing package thereof
A method of manufacturing a package may include forming a package module by disposing a plurality of components on an insulating plate filled with a viscous...
US-9,392,696 Semiconductor package
A semiconductor package includes a substrate, a first conductive layer, a second conductive layer, a first surface mount device, a second surface mount device...
US-9,392,695 Electric component module
There is provided an electronic component module capable of increasing the degree of integration by mounting electronic components on both surfaces of a...
US-9,392,694 Package, electronic device, method of manufacturing electronic device, electronic apparatus, and mobile body
A package includes an accommodation space portion, and a first base body that forms at least a part of the accommodation space portion. A first through-hole,...
US-9,392,693 Method for manufacturing printed circuit board with shallow solder pad
An exemplary printed circuit board includes a base, solder pads, and signal traces. The base includes outer surfaces. The signal traces having a first height...
US-9,392,692 Wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring...
A wiring substrate includes a resin substrate in which first and second through holes are formed, a metallic foil on one surface of the resin substrate coating...
US-9,392,691 Multi-stacked electronic device with defect-free solder connection
A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe,...
US-9,392,690 Method and structure to improve the conductivity of narrow copper filled vias
Techniques for improving the conductivity of copper (Cu)-filled vias are provided. In one aspect, a method of fabricating a Cu-filled via is provided. The...
US-9,392,689 Metal-clad laminate, method for producing same, and flexible printed board
A metal-clad laminate, including metal foil, and a first resin layer arranged on the metal foil, the first resin layer including an epoxy resin and a...
US-9,392,688 Biomass photosensitive material and method for manufacturing the same, and printed circuit board
A method of forming a biomass photosensitive material is provided, which includes (1) polymerizing (a) itaconic anhydride and (b) acrylate to form a copolymer,...
US-9,392,687 Circuit board
A circuit board includes a multi-layer structure, a ceramic member, and a first conductive layer. The multi-layer structure has a thru-hole penetrating two...
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