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Semiconductor device and method of forming a vertical interconnect
structure for 3-D FO-WLCSP
A semiconductor device is made by forming a first conductive layer over a carrier. The first conductive layer has a first area electrically isolated from a...
IC package with non-uniform dielectric layer thickness
An integrated circuit (IC) package substrate with non-uniform dielectric layers is disclosed. The IC package substrate is a multilayer package substrate that...
Interconnect structure and method of forming the same
An interconnect structure and a method of forming an interconnect structure are disclosed. The interconnect structure includes a lower etch stop layer (ESL); an...
Electric contact structure having a diffusion barrier for an electronic
device and method for manufacturing the...
An electric contact structure includes a first structural layer; a second structural layer made of dielectric material extending over the first structural...
Split contact structure and fabrication method thereof
A split contact structure includes a semiconductor substrate having a major surface; a first upwardly protruding structure disposed on the major surface; a...
Planar polysilicon regions for precision resistors and electrical fuses
and method of fabrication
A semiconductor structure providing a precision resistive element and method of fabrication is disclosed. Polysilicon is embedded in a silicon substrate. The...
Semiconductor device having an on die termination circuit
According to one embodiment, a semiconductor device includes a transistor formed on a semiconductor chip, a lower-layer wiring connected to a diffusion layer of...
Protected through semiconductor via (TSV)
A semiconductor structure having a through semiconductor via (TSV) which includes a semiconductor wafer of a semiconductor material and having a front side and...
Semiconductor devices and structures thereof
A structure having air gaps between interconnects is disclosed. A first insulating material is deposited over a workpiece, and a second insulating material...
A display device includes, on a substrate, light emitting elements each formed by sequentially stacking a first electrode layer, an organic layer including a...
A combined substrate includes a first substrate having multiple first metal posts, a second substrate having multiple second metal posts such that the second...
A semiconductor device is provided, in which a first lead (11) is joined with the bottom electrode (23) of a MOS-FET (21) with first solder (51), the top...
Quad flat no-lead package and manufacturing method thereof
A quad flat no-lead package includes an encapsulant, and a plurality of chip pads, a plurality of bond pads and a chip disposed in the encapsulant. Each chip...
Heat sink mount and assembly
An assembly for a heat sink having a contact plate with opposing first and second faces, a plurality of fins extending from the first face of the contact plate,...
Electronic devices with improved thermal performance
Electronic devices with improved thermal performance, such as thermal dissipation, of flip chip packages that include one or more flip chip dies are disclosed....
Thermal hot spot cooling for semiconductor devices
A semiconductor device package which includes a semiconductor package, a semiconductor device joined to the semiconductor package; and a lid to be placed over...
Method of testing semiconductor device
A method of testing a semiconductor device having a substrate in and on which a cell structure and a termination structure are formed, the cell structure having...
Automated optical inspection of unit specific patterning
A method of automated optical inspection (AOI) for a plurality of unique semiconductor packages can comprise providing a plurality of semiconductor die formed...
TSV redundancy scheme and architecture using decoder/encoder
A method of redirecting signal bits associated with or corresponding to defective TSVs of a TSV array to a row or a column of redundant TSVs in the TSV array...
Self aligned structure and method for high-K metal gate work function
A semiconductor device and a method for fabricating the device. The method includes: forming a STI in a substrate having a nFET and a pFET region; depositing a...
Method to form trench structure for replacement channel growth
Embodiments may include a method of semiconductor patterning including forming a first trench bordered by a first spacer material. The method may involve...
Multiheight contact via structures for a multilevel interconnect structure
Contact openings extending to sacrificial layers located at different depths can be formed by sequentially exposing a greater number of openings in a mask layer...
Packaging devices, methods of manufacture thereof, and packaging methods
Packaging devices, methods of manufacture thereof, and packaging methods are disclosed. In some embodiments, a packaging device includes a first substrate...
Method forming through-via using electroless plating solution
The present invention provides a method for forming a through-via, including the steps of (1) forming an alloy film as a diffusion-preventive layer that...
Self-aligned capillarity-assisted microfabrication
A manufacturing process, which we term Self-Aligned Capillarity-Assisted Lithography for manufacturing devices having nano-scale or micro-scale features, such...
Air gaps structures for damascene metal patterning
A pattern of parallel lines defines first regions where no conductive material is to be located, a distance between adjacent lines in the first regions being...
Patterning method for low-k inter-metal dielectrics and associated
Semiconductor fabrication techniques and associated semiconductor devices are provided in which conductive lines are separated by a low dielectric constant...
Handler wafer removal by use of sacrificial inert layer
The present invention relates generally to semiconductor structures and methods of manufacture and, more particularly, to the temporary bonding of a...
FinFET fin bending reduction
An embodiment method of controlling fin bending in a fin field-effect transistor (FinFET) includes forming an isolation region over a substrate, performing a...
Semiconductor device having a gate that is buried in an active region and
a device isolation film
A semiconductor device includes an active region with a first gate trench formed when a gate region is etched to a first depth, a device isolation film defining...
Media substrate gripper including a plurality of snap-fit fingers
One aspect of an assembly configured to grip a substrate includes a gripper including a first finger and a second finger, a first chuck body snap-fit to the...
Support for semiconductor substrate
A moveable semiconductor substrate support includes a control device receiving data from one or more sensors and providing control signals to one or more...
Method and device for transferring a chip to a contact substrate
A method and device for transferring a chip (18) situated on a transfer substrate (26) to a contact substrate (50), and for contacting the chip with the contact...
Electrostatic chuck mechanism and charged particle beam apparatus
Proposed are an electrostatic chuck mechanism and a charged particle beam apparatus including a first plane that is a plane of a side in which a sample is...
Vacuum robot adapted to grip and transport a substrate and method thereof
with passive bias
A vacuum robot adapted to grip and transport a substrate. The robot includes a robot drive coupled to an arm and having an end-effector adapted to support the...
Load port apparatus and clamping device to be used for the same
To suppress deformation of a portion to be clamped even when a load applied to the portion to be clamped is increased at the time of fixing a front opening...
Compact substrate transport system
A substrate processing system including a load port module configured to hold at least one substrate container for storing and transporting substrates, a...
Polishing apparatus and polishing method
A polishing apparatus for polishing a substrate includes a polishing table holding a polishing pad, a top ring configured to press the substrate against the...
Transporting device for substrate of liquid crystal display and using
A transporting device for transporting substrate of liquid crystal display and using method thereof are provided. The transporting device comprises a fixing...
A coating apparatus includes: a slit nozzle including a retention chamber that retains the coating material; a moving mechanism that moves the slit nozzle; a...
Semiconductor apparatus and method for producing the same
A method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, includes: an arranging step of arranging on one...
Semiconductor device and method of backgrinding and singulation of
semiconductor wafer while reducing kerf...
A semiconductor device has a semiconductor wafer with an interconnect structure formed over a first surface of the wafer. A trench is formed in a non-active...
Low CTE interposer
An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to...
Methods for packaging integrated circuits
Techniques for packaging an integrated circuit include attaching a die to a conductive layer before forming dielectric layers on an opposing surface of the...
Plasma processing apparatus
Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on...
Chemical mechanical planarization topography control via implant
Systems and methods for chemical mechanical planarization topography control via implants are disclosed. In one embodiment, a method of manufacturing a...
A semiconductor device includes: a substrate comprised by gallium arsenide; an active layer provided on the substrate; a first nickel-plated layer provided on a...
Substrate treatment method
A substrate treatment method includes the steps of: supporting a substrate with a support member; arranging an extension surface such that the extension surface...
Method of manufacturing semiconductor device, cleaning method, substrate
processing apparatus and...
Provided is a method of manufacturing a semiconductor device, which efficiently removes a high permittivity film (high-k film). The method of manufacturing a...
Mask set for fabricating integrated circuits and method of fabricating
A mask set is described. In one implementation, the mask set includes: a first plurality of base layer masks, where each base layer mask of the first plurality...