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Packaged semiconductor devices and packaging methods
Packaged semiconductor devices and packaging methods are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die and...
Semiconductor device including semiconductor chips mounted over both
surfaces of substrate
A semiconductor chip 10 flip-chip mounted on a first surface 32 of a wiring substrate 30, a semiconductor chip 20 flip-chip mounted on a second surface 33 of...
A semiconductor device includes a package substrate, an IF chip, and a core chip. The package substrate has: first electrodes aligned and disposed on a first...
Semiconductor assembly having bridge module for die-to-die interconnection
In one example, a semiconductor assembly comprises a first IC die, a second IC die, and a bridge module. The first IC die includes, on a top side thereof, first...
Embedded interposer with through-hole vias
A method of forming an integrated circuit package may include forming a first layer of a package substrate and mounting an interposer structure on the first...
Chip package structure
A chip package structure includes a carrier and a chip group. The chip group includes a pair of first chips that are identical IC chips. The pair of first chips...
Methods for wafer bonding, and for nucleating bonding nanophases
Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second...
Semiconductor device and method of forming WLP with semiconductor die
embedded within penetrable encapsulant...
A semiconductor device has a first substrate with a plurality of first conductive vias formed partially through the first substrate. A first semiconductor die...
Apparatus and method of substrate to substrate bonding for three
dimensional (3D) IC interconnects
An apparatus including a bond head, a supplemental support, a reduction module, and a transducer is provided. The bond head holds a first substrate that...
Semiconductor chip and semiconductor package
The driver semiconductor package includes a base substrate. The semiconductor package includes a semiconductor chip mounted on the base substrate. The...
Systems of bonded substrates
A system of bonded substrates may include a first substrate, a second substrate, and a composite bonding layer. The first substrate may include a bonding...
Anisotropic conductive adhesive
An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy...
Semiconductor package, printed circuit board substrate and semiconductor
A semiconductor package includes: a semiconductor integrated circuit; an interlayer film disposed on the semiconductor integrated circuit; a rewiring layer...
Zero stand-off bonding system and method
A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a...
Plasma treatment for semiconductor devices
A semiconductor device having a polymer layer and a method of fabricating the same is provided. A two-step plasma treatment for a surface of the polymer layer...
Integrated circuit chip assembled on an interposer
A device includes a chip assembled on an interposer. An electrically-insulating layer coats an upper surface of the interposer around the chip. First metal...
Packaging through pre-formed metal pins
A package includes first package component and a second package component. The first package component includes a first electrical connector at a surface of the...
Packaging devices and methods of manufacture thereof
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad...
Semiconductor structure with composite barrier layer under redistribution
layer and manufacturing method thereof
A mechanism of a semiconductor structure with composite barrier layer under redistribution layer is provided. A semiconductor structure includes a substrate...
Multiple band multiple mode transceiver front end flip-chip architecture
and circuitry with integrated power...
An integrated circuit architecture and circuitry is defined by a die structure with a plurality of exposed conductive pads arranged in a grid of rows and...
Semiconductor device having voids between top metal layers of metal
The invention provides a semiconductor device including a substrate, a dielectric layer, a dummy bonding pad, a bonding pad, a redistribution layer, and a metal...
Method of making bond pad
A method of making a bonding pad for a semiconductor device includes depositing a first region of the bonding pad on a top metal of the semiconductor device at...
Mechanisms for forming connectors with a molding compound for package on
The described embodiments of mechanisms of forming connectors for package on package enable smaller connectors with finer pitch, which allow smaller package...
Integrated circuit for generating or processing a radio frequency signal
An integrated circuit includes a signal line for carrying a radio frequency signal; a coupling line inductively coupled to the signal line for delivering an...
A semiconductor package includes a support substrate; a stress relaxation layer provided on a main surface of the support substrate; a semiconductor device...
Semiconductor package and method of manufacturing the same
A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may...
In one embodiment, a semiconductor package includes a first semiconductor die having a first surface facing upwardly to expose a bond pad, a second ...
Semiconductor device and method of forming B-stage conductive polymer over
contact pads of semiconductor die in...
A semiconductor wafer contains a plurality of semiconductor die with bumps formed over contact pads on an active surface of the semiconductor die. A b-stage...
Structures and methods for stack type semiconductor packaging
Methods and structures for stack type semiconductor packaging are disclosed. In one embodiment, a semiconductor device includes a semiconductor chip mounted...
Contact structure for NAND based non-volatile memory device and a method
A NAND-based non-volatile memory contact structure includes a trench located adjacent to layered alternating conducting and insulating layers, the layers lining...
Semiconductor device having a graphene interconnect
A semiconductor device includes a graphene interconnect, an insulation film formed on the graphene interconnect, and a via conducting portion formed in a via...
Integrated circuit and method of forming an integrated circuit
An integrated circuit includes a base element and a copper element over the base element, the copper element having a thickness of at least 5 .mu.m and a ratio...
Power line structure for semiconductor apparatus
A semiconductor apparatus has one or more semiconductor chips. The semiconductor apparatus may include a power supply pad; power lines disposed on one side of...
Integrated circuit line ends formed using additive processing
Integrated circuit structures formed using methods herein include a layer, and a material-filled line in the layer. The material-filled line includes a first...
Structure and fabrication method for electromigration immortal nanoscale
After forming a trench opening including narrow trench portions spaced apart by wide trench portions and forming a stack of a first diffusion barrier layer and...
Through-substrate via formation with improved topography control
A device include a substrate and an interconnect structure over the substrate. The interconnect structure comprising an inter-layer dielectric (ILD) and a first...
Integrated circuit system with tunable resistor and method of manufacture
An integrated circuit system, and a method of manufacture thereof, includes: an integrated circuit substrate; and a discretized tunable precision resistor...
Package structure and manufacturing method thereof
A manufacturing method of a package structure includes the following steps. A substrate including a core layer, first and second patterned metal layers is...
A power module, having a printed circuit board core, which contains at least one electronic power component embedded in an insulating layer, the core being...
Integrated circuit with sewn interconnects
A packaged integrated circuit (IC) device includes a flexible substrate having contact pads, an IC die mounted on the substrate and electrically connected to...
Protrusion bump pads for bond-on-trace processing
An embodiment apparatus includes a dielectric layer, a conductive trace in the dielectric layer, and a bump pad. The conductive trace includes a first portion...
Stretchable electronic device
A stretchable electronic device is disclosed. In one aspect, the device includes at least one combination of a stretchable electronic structure having a first...
Package-on-package semiconductor assemblies and methods of manufacturing
Package-on-package systems for packaging semiconductor devices. In one embodiment, a package-on-package system comprises a first semiconductor package device...
Electronic component and method for electrically coupling a semiconductor
die to a contact pad
In an embodiment, an electronic component includes a dielectric core layer, one or semiconductor dies comprising a first major surface, a first electrode...
Stacked die integrated circuit
An apparatus relates generally to an integrated circuit package. In such an apparatus, a package substrate has a first plurality of via structures extending...
Semiconductor component having through-silicon vias and method of
A semiconductor component includes a semiconductor substrate having an opening A first dielectric liner having a first compressive stress is disposed in the...
Semiconductor device with reduced thickness
A semiconductor device with reduced thickness is disclosed and may include forming a back end of line (BEOL) comprising a redistribution layer on a dummy...
A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate...
Integrated circuit (IC) package with thick die pad functioning as a heat
An integrated circuit (IC) package includes a die pad and an IC die secured on the die pad. The IC die had outer edges aligned with outer edges of the die pad....
Leadless chip carrier having improved mountability
Consistent with an example embodiment, there is surface-mountable non-leaded chip carrier for a semiconductor device. The device comprises a first contact. A...