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Patent # Description
US-9,420,736 Component supplying apparatus and component supplying method
A component supplying apparatus includes a main tape entering port, a component supply port through which components are picked up from a carrier tape, a main...
US-9,420,735 Structure and structure manufacturing method
A structure includes a housing made of a dielectric substance, an electrically conductive member embedded in the housing so as to penetrate the housing, and an...
US-9,420,734 Combined electromagnetic shield and thermal management device
Various EMI shields with thermal management capabilities are disclosed. In one aspect, an EMI shield is provided that includes a thermal spreader plate adapted...
US-9,420,733 Electromagnetic pulse protected hard drive
A computer storage system protected from electromagnetic pulses is described. The storage system utilizes either a hard drive or a solid state drive to hold the...
US-9,420,732 Solar inverter
A solar inverter is provided having a cooling module, a DC module, an inverter module and an AC module provided side-by-side within a chassis. The DC module...
US-9,420,731 Electronic power device and method of fabricating an electronic power device
An electronic device comprises a power module comprising a first main surface and a second main surface opposite to the first main surface, wherein at least a...
US-9,420,730 Container data center
A container data center includes a container, a number of air filtering modules, a number of cabinets received in the container, a heat dissipation apparatus,...
US-9,420,729 Systems and associated methods for controllably cooling computer components
Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet...
US-9,420,728 Liquid-cooled heat sink configured to facilitate drainage
Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to...
US-9,420,727 Electronic equipment enclosure
An electronic equipment enclosure includes a frame structure and a customizable side air dam kit. The frame structure includes a front frame, a rear frame,...
US-9,420,726 Container-type data center and air-conditioning control method
A container includes a server and a management server. A general fan takes in outside air to the container and sends the taken-in outside air to the server. An...
US-9,420,725 Air conditioning apparatus and air conditioning control method
A controller and indoor unit introducing outdoor air and/or return air from an air conditioning control target, and discharging introduced air to the air...
US-9,420,724 Power converter assembly
A power converter assembly includes a housing, a cold plate located within the housing, a power converter module coupled with the cold plate, receiving a power...
US-9,420,723 Heat-dissipation structure for motor controller
A heat-dissipation structure for a motor controller. The heat-dissipation structure includes a control box, a circuit board, a plurality of radiators, and IGBT...
US-9,420,722 Composite heat sink device for cooling of multiple heat sources in close proximity
In one aspect, an apparatus comprises a substrate, a first electrically-driven device disposed on the substrate, a second electrically-driven device disposed on...
US-9,420,721 Liquid-cooled heat sink assemblies
Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface;...
US-9,420,720 Liquid cooling apparatus
A liquid cooling apparatus includes a plurality of system boards each having a first surface and a second surface opposite the first surface, each of the system...
US-9,420,719 Slice-IO housing with side ventilation
An input/output (I/O) device having a base portion configured to communicatively connect the I/O device with at least one other device, an I/O module physically...
US-9,420,718 Adjustable device carrier for modular chassis
Adjustable device carriers for modular chassis. In some embodiments, a carrier configured to receive an electronic device may include a front panel and lateral...
US-9,420,717 Plug-in unit protection
A plug-in unit that is configured to stacking in an electronic equipment unit is protected during replacement of an adjacent plug-in unit in the electronic...
US-9,420,716 Electronic module installation tools for electronic racks
An electronic module installation tool temporarily supports electronic modules in electronic racks. The tool has a frame configured to be inserted into a rack...
US-9,420,715 Electrononic equipment building blocks for rack mounting
A rack-mountable module assembly, comprising: a plurality of electronic equipment modules, each having a height in multiples of approximately 1.75 inches and a...
US-9,420,714 Electronic device with unified display mounting structures
An electronic device is provided with a display such as a liquid crystal display mounted in an electronic device housing. The display has display layers such as...
US-9,420,713 Double anodizing processes
Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve...
US-9,420,712 Portable clamping apparatus for mobile equipment
A portable clamping apparatus for mobile equipment, which comprises a clamping assembly, a holding assembly and a tube-pole assembly used to connect other...
US-9,420,710 Electrical enclosure
A sealed electrical enclosure for housing an electrical component is provided. In one exemplary embodiment, the sealed electrical enclosure includes a housing,...
US-9,420,709 Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing...
Disclosed herein are a coreless board for a semiconductor package and a method of manufacturing the same. The coreless board for the semiconductor package...
US-9,420,708 Method for manufacturing multilayer printed wiring board
A method for manufacturing a printed wiring board includes preparing a core substrate having a metal layer having a first penetrating hole and insulation layers...
US-9,420,707 Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers...
US-9,420,706 Multilayer wiring board
In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling...
US-9,420,705 Current conducting element
A current conducting element including a substrate, a through hole, an electrode layer and a conductor structure is provided. The through hole is disposed...
US-9,420,704 Connection using conductive vias
In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for...
US-9,420,703 Wiring board and manufacturing method of the same
To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and...
US-9,420,702 Component mounting line and component mounting method
A component mounting line has a screen printing apparatus and component mounting apparatuses. The screen printing apparatus carries in substrates based on...
US-9,420,701 Flexible direct or USB plug-in platform for foldable or flexible electronics
An apparatus comprises a flexible circuit substrate that includes a body portion and at least one connector portion formed monolithically with the body portion....
US-9,420,700 Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies
An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An...
US-9,420,699 Non-deleterious technique for creating continuous conductive circuits upon the surfaces of a non-conductive...
A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer...
US-9,420,698 Conductive substrate comprising a metal fine particle sintered film
Provided is a conductive substrate which is prepared by forming a pattern-shaped metal fine particle sintered film such as a copper wiring and the like on a...
US-9,420,697 Method for manufacturing printed wiring board
A method for manufacturing a printed wiring board includes forming an interlayer insulation layer on a conductive circuit, applying laser to a portion of the...
US-9,420,696 Method of manufacturing wiring substrate
A method of manufacturing a wiring substrate includes forming a pair of core substrates, each including a cavity; applying a film that covers the cavity to each...
US-9,420,695 Semiconductor package structure and semiconductor process
Disclosed is a semiconductor package structure and manufacturing method. The semiconductor package structure includes a first dielectric layer, a second...
US-9,420,694 Method for controlling warpage within electronic products and an electronic product
The present invention discloses a method for minimizing warpage in the electronic products, and the structures of such electronic products as well. Groove holes...
US-9,420,693 Integration of embedded thin film capacitors in package substrates
An embedded thin film capacitor and methods of its fabrication are disclosed. The embedded thin film capacitor includes two conductive plates separated by a...
US-9,420,692 Vehicular electronic control device
An electronic control device for executing fundamental and additional functions includes: a fundamental circuit element that executes the fundamental function;...
US-9,420,691 Electronic device, method for manufacturing thereof, and electronic apparatus
An electronic device includes a first member including a reference potential terminal; a second member placed on a first surface of the first member and having...
US-9,420,690 Connector
The instant disclosure relates to a connector including a wiring layer, a dielectric layer, a conductive structure, a first protective layer and at least one...
US-9,420,689 Method of making a circuitized substrate
A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a...
US-9,420,687 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and...
A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned...
US-9,420,686 Coating system with electrostatic discharge protection
A coating system on a substrate for the protection against electrostatic discharge, includes in the following order a) an undercoat on the substrate, b) a...
US-9,420,685 Electronic device comprising a substrate board equipped with a local reinforcing or balancing layer
A substrate board includes an electrical connection network on a face thereof. An integrated-circuit chip is mounted to the face of the substrate board in...
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