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Biodegradable microwave electronic devices
Substantially biodegradable microwave integrated circuits and method for making the microwave integrated circuits are provided. The integrated circuits, which...
Thin film transistor and manufacturing method thereof
A manufacturing method of a thin film transistor includes the following steps. A substrate is provided first. A semiconductor layer is then formed on the...
Millimetre wave integrated circuits with thin film transistors
MMIC circuits with thin film transistors are provided without the need of grinding and etching of the substrate after the fabrication of active and passive...
Display panel and method of manufacturing the same
A display panel includes a first pixel electrode electrically connected to a first switching electrode, and includes a plurality of first branches forming micro...
Thin film transistor substrate, display apparatus comprising the same,
method of manufacturing thin film...
A thin film transistor (TFT) substrate, a flat display apparatus including the TFT substrate, a method of manufacturing the TFT substrate, and a method of...
Semiconductor device and method for manufacturing the same
It is an object to obtain a liquid crystal display device in which a contact defect is reduced, increase in contact resistance is suppressed, and an opening...
Thin film transistor and method for manufacturing the same, array
substrate and display device
A thin film transistor and a method for manufacturing the same, an array substrate and a display device that can prevent the semiconductor layer in a channel...
Method of manufacturing components of display panel assembly from same
A method of manufacturing a display panel assembly includes: preparing a mother substrate on which are defined first regions and dummy regions respectively...
Semiconductor device and manufacturing method thereof
It is an object of the present invention to provide a semiconductor device where, even in a case of stacking a plurality of semiconductor elements provided over...
Array substrate, manufacturing method thereof and display device
An array substrate and a manufacturing method thereof and a display device are provided, wherein the array substrate includes: a substrate, and a gate...
Pixel structure and method of fabricating the same
A pixel structure includes a thin film transistor device. The thin film transistor device includes a first connection electrode, a second connection electrode,...
A display apparatus includes a first pixel and a second pixel adjacent to each other, wherein a first channel region of a driving transistor of the first pixel...
A liquid crystal display device includes: a TFT substrate that includes gate lines; and a driver circuit section that includes a gate driver that is connected...
High intensity discharge lamps with dosing aid
A ceramic metal halide lamp according to various embodiments can include a discharge vessel and an ionizable fill. The ionizable fill is sealed within the...
Dual-semiconductor complementary metal-oxide-semiconductor device
A method of forming an active device on a semiconductor wafer includes the steps of: forming a plurality of semiconductor fins on at least a portion of a...
Multiple V.sub.T in III-V FETs
In one aspect, a method of forming a multiple V.sub.T device structure includes the steps of: forming an alternating series of channel and barrier layers as a...
A three-dimensional memory, which includes memory cell stacked structures. The memory cell stacked structures are stacked by a plurality of memory cell array...
Semiconductor device and manufacturing method thereof
A semiconductor device and a manufacturing method of a semiconductor device thereof are provided. The manufacturing method includes the following steps. A...
Three dimensional stacked nonvolatile semiconductor memory
A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first...
Vertical channel-type 3D semiconductor memory device and method for
manufacturing the same
A vertical channel-type 3D semiconductor memory device and a method for manufacturing the same are disclosed. In one aspect, the device includes a multi-layer...
Vertical memory cell string with dielectric in a portion of the body
Some embodiments include a memory cell string having a body having a channel extending therein and in contact with a source/drain, a select gate adjacent to the...
Semiconductor device and method of manufacturing the same
A semiconductor device has a vertical channel and includes a first tunnel insulating layer adjacent to a blocking insulating layer, a third tunnel insulating...
Method of making a three-dimensional memory array with etch stop
A method of making a semiconductor device including forming a sacrificial feature over a substrate, forming a plurality of etch through regions having an etch...
3D NAND array architecture
Roughly described, a memory device has a multilevel stack of conductive layers which are divided laterally into word lines. Vertically oriented pillars each...
Methods and apparatuses having strings of memory cells including a metal
Methods for forming a string of memory cells, an apparatus having a string of memory cells, and a system are disclosed. A method for forming the string of...
Wing-type projection between neighboring access transistors in memory
A flash memory device is disposed on a semiconductor substrate. The flash memory device includes flash memory cells arranged in rows and columns. Respective...
Temperature compensation method for high-density floating-gate memory
A temperature compensation technique is provided for a non-volatile memory arrangement. The memory arrangement includes: a memory circuit (12) having a floating...
A semiconductor device according to an embodiment includes a stacked body, and a semiconductor pillar. The stacked body includes first insulating layers and...
Flash memory structure and method of making the same
A method of making a flash memory includes providing a substrate. Then, a first insulating layer, a first conductive layer and a second insulating layer are...
Nonvolatile semiconductor memory device and method of manufacturing the
According to an embodiment, a nonvolatile semiconductor memory device comprises: a semiconductor layer; a first gate insulating film; a plurality of floating...
Semiconductor device manufacturing method and semiconductor device
A semiconductor device manufacturing method includes: forming a first well of the first conductivity type in a substrate; forming a second well of the first...
Static random access memory (SRAM) device with FinFET transistors
The present disclosure provides a static memory cell and fabrication method. A first fin part is formed on a semiconductor substrate. An isolation layer is...
Semiconductor device and method for manufacturing semiconductor device
A semiconductor device includes a substrate, a first well of a first conductivity type formed within the substrate, a second well of a second conductivity type...
Barrier trench structure and methods of manufacture
A structure includes at least one shallow trench isolation structure formed in a substrate to isolate adjacent different type devices. The structure further...
A nitride insulating film which prevents diffusion of hydrogen into an oxide semiconductor film in a transistor including an oxide semiconductor is provided....
Silicided semiconductor structure and method of forming the same
A preferred embodiment includes a method of manufacturing a fuse element that includes forming a polysilicon layer over a semiconductor structure, doping the...
A switching device according to the present invention is a switching device for switching a load by on-off control of voltage, and includes an SiC semiconductor...
Cross-domain electrostatic discharge protection device
A cross-domain electrostatic protection device having four embedded silicon controlled rectifiers (a QSCR structure) embedded in a single cell. Two...
Electrostatic discharge protection device and electrostatic discharge
An ESD device disposed on a substrate is provided. The ESD device includes a first well, a second well, a first poly-silicon region, a second poly-silicon...
In accordance with an embodiment of the present invention, a semiconductor package includes a die paddle and a protection device disposed over the die paddle....
Middle of-line architecture for dense library layout using M0 hand-shake
A dense library architecture using an M0 hand-shake and the method of forming the layout are disclosed. Embodiments include forming first and second active...
Flip chip semiconductor device
A semiconductor device package comprises a lead frame having a die paddle comprising a first chip installation area and a second chip installation area, a...
Semiconductor package and method of fabricating the same
Provided is a semiconductor package in which a cell array region and a peripheral circuit region are formed as different semiconductor chips, respectively....
Photoelectric device and method of manufacturing the same
A photoelectric device includes an electrode structure, an LED (light emitting diode) element, a zener diode and a reflective cup. The LED element, the zener...
An electronic apparatus includes a multilayered structure in which a plurality of semiconductor chips provided with semiconductor devices are stacked,...
Package-on-package assembly and method for manufacturing the same
A package-on-package (PoP) assembly includes a bottom die package and a top die package. The bottom die package includes an interposer having a first side and a...
Stacked microelectronic assemblies
A microelectronic assembly includes units superposed on one another to form at least one stack having a vertical direction. Each unit includes one or more...
The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing...
Semiconductor packages with metal posts, memory cards including the same,
and electronic systems including the same
A semiconductor package includes a flexible package substrate including a first surface and a second surface, a metal post penetrating the flexible package...
Multiple die face-down stacking for two or more die
A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge...