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Patent # Description
US-9,445,536 Crystal oscillator fabrication methods using dual-deposition of mounting cement and dual-curing techniques
A crystal oscillator fabrication method includes depositing mounting cement onto first and second mounting pads on a substrate to thereby define first and...
US-9,445,535 High-frequency module
A high-frequency module includes a substrate, an integrated circuit mounted to the substrate, a cylindrical shield enclosing the integrated circuit to block...
US-9,445,534 Compute device casing that doubles as packaging and shipping container for the compute device
An information handling system (IHS) when operational has compute components held by a lightweight server (LWS) chassis. For both shipping and operational...
US-9,445,533 Electronic component case for vehicle
An electronic component case for a vehicle is provided. The electronic component case includes a case body having a first space in which electronic components...
US-9,445,532 Integrated electrical and thermal solution for inverter DC-link capacitor packaging
An improved capacitor packaging solution is presented that incorporates both thermal and electrical considerations. A package can include capacitor elements...
US-9,445,531 Air washing for open air cooling of data centers
A data center system includes a housing to house servers arranged in electronic racks and an air supply system to receive contaminated air from an external...
US-9,445,530 Real-time individual electronic enclosure cooling system
This discloses apparatuses for cooling individual server racks or electrical enclosures. These devices maintain target enclosure temperatures within plus or...
US-9,445,529 Liquid cooled data center design selection
Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor...
US-9,445,528 Thermal gap pad
This application relates to efficiently distributing heat within a portable computing device. More specifically an apparatus for conducting heat between...
US-9,445,526 Modular jet impingement assemblies with passive and active flow control for electronics cooling
Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies...
US-9,445,525 Power supply device
In a power supply device 1, a first space R1 and a second space R2 are delimited, a coil component 20 is arranged in the first space R1, and heat-generating...
US-9,445,524 Systems and methods for thermoelectrically cooling inductive charging stations
In some embodiments, a cooling system for an induction charger includes a thermal conditioning module in fluid communication with an induction charging...
US-9,445,523 Electronic assembly with cooling device
The invention relates to an electronic assembly comprising a plurality of electronic component groups and a cooling device for cooling the electronic component...
US-9,445,522 Structurally-embedded construction, design, and maintenance record data management system and related method
A novel structurally-embedded construction, design, and maintenance record data management system and a related method of operation provide immediate and...
US-9,445,521 Electronic card connection device and electronic device
The present disclosure relates to an electronic card connection device and an electronic device. The electronic card connection device comprises a connector, an...
US-9,445,520 Systems for ejecting removable modules from electronic devices
An electronic device may be provided with an ejectable component assembly having a connector that can receive and retain a removable module within a housing of...
US-9,445,519 Method of manufacturing thick-film electrode
A method of manufacturing a thick-film electrode comprising steps of: (a) applying a conductive paste onto a substrate comprising, (i) 100 parts by weight of a...
US-9,445,518 Display device and apparatus for side surface sealing of display panel
Disclosed is a display device and an apparatus for side surface sealing of display panel, which enable to realize thin profile and good exterior appearance in...
US-9,445,517 Etched multi-layer sheets
A method includes creating an opening in a first outer layer of a multilayer sheet of material, the sheet of material having three or more layers of material,...
US-9,445,516 Weatherproof corner box
An electrical box may include a housing body, enclosing a cavity, which includes an access opening extending across a first plane of the housing body, and which...
US-9,445,515 Circuit box
A circuit box includes a housing having an internal compartment. The housing includes first and second entrances for receiving first and second electrical...
US-9,445,514 Handle and display device equipped with handle
A display device (10) includes a display (12) used to display an image, and a handle (14) attached to a recess (13) formed in a rear face (12a) of the display...
US-9,445,513 Display device
A display device includes: a first display part having a first screen; a second display part having a second screen; a casing which accommodates the first and...
US-9,445,512 Holder having adjustable clamping orientation
The present invention is to provide a holder having an adjustable clamping orientation, which includes a clamping assembly having a first clamping plate...
US-9,445,511 Method for manufacturing layered circuit board, layered circuit board, and electronic device
There is provided a manufacturing method of a layered circuit board in which a first board and a second board are layered. The method includes arranging an...
US-9,445,510 Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of...
US-9,445,509 Three-dimensional backplane
An objective of the present invention is to provide a three-dimensional backplane to solve the problem that the number of layers of a printed circuit board for...
US-9,445,508 Solder alloy, solder paste, and electronic circuit board
A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder...
US-9,445,507 Packaging for eight-socket one-hop SMP topology
A mechanism is provided for packaging a multiple socket, one-hop symmetric multiprocessor topology. The mechanism connects each of a first plurality of...
US-9,445,506 Preparation method of patterned film, display substrate and display device
Embodiments of the present invention provide a preparation method of a patterned film, a display substrate and a display device, avoiding falling off of a film...
US-9,445,505 Rotary conveying equipment for exposing substrate
Disclosed is a rotary conveying equipment for exposing a substrate. The rotary conveying equipment includes a carrying device and a rotary moving device. The...
US-9,445,504 Methods of manufacturing metal wiring buried flexible substrate and flexible substrates manufactured by the same
Disclosed are a method of manufacturing a metal wiring buried flexible substrate and a flexible substrate manufactured by the same. The method includes coating...
US-9,445,503 Carrier device, electrical device having a carrier device and method for producing same
A carrier device for an electrical component includes a carrier, which includes an electrically insulating layer, and an electrical contact layer on the...
US-9,445,502 Flexible circuit connecting device
A flexible circuit connecting device is disclosed, including a base layer having a first surface and a second surface, and conductive traces having a grid-like...
US-9,445,501 Electrically conductive composition, electrically conductive film using the composition and a method of...
An electrically conductive composition, containing an electrically conductive polymer, and an onium salt compound as a dopant to the electrically conductive...
US-9,445,500 Epoxy resin composition and printed circuit board using same
The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein...
US-9,445,499 Epoxy resin composition, and printed circuit board using same
According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein...
US-9,445,498 Epoxy resin composition and printed circuit board
The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein...
US-9,445,497 Semiconductor device
A semiconductor device includes a first ceramic substrate, a second ceramic substrate, an inter-ceramic metal having an intermediate portion interposed between...
US-9,445,496 Glass clad microelectronic substrate
Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing...
US-9,445,495 Capacitance touch panel module and fabrication method thereof
A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and...
US-9,445,494 Wiring substrate and display panel comprising same
A display panel (100) of an embodiment of the present invention includes a wiring board (100a), a counter substrate (100b) which is provided on a viewer side of...
US-9,445,493 Signal line and manufacturing method therefor
A signal line that is easily inflected includes a laminated body including at least insulator layers that include flexible material and are laminated from a...
US-9,445,492 Printed circuit board
A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom...
US-9,445,491 Overpass grounding spring and integrated component protection
The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a...
US-9,445,490 Film system for LED applications
The present invention relates to a composite assembly of plastic (1, 3) and metal films (2.1, 2.2) which can be used for the interconnection and connection of...
US-9,445,489 Electronic control unit and electric power steering apparatus having the same
An electronic control unit includes a board, an electronic device, a heatsink, and a fastener. The board includes a protection layer and a ground pattern...
US-9,445,488 Plasma whirl reactor apparatus and methods of use
A plasma system includes a plasma arc torch, a cylindrical tube and an eductor. The plasma arc torch includes a cylindrical vessel having a first end and a...
US-9,445,487 X-ray irradiation device and X-ray radiation source
An X-ray radiation device comprises a plurality of X-ray radiation units, each having an X-ray tube for generating an X-ray, a drive circuit for driving the...
US-9,445,486 Energy dissipative tubes
One aspect of the invention provides an energy dissipative tube including: a length of corrugated stainless steel tubing; a conductive resin layer adjacent to...
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