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Semiconductor devices and methods of forming the same
A semiconductor device includes first and second gate structures extending in a first direction and spaced apart from each other in a second direction...
Device and method for a high isolation switch
An embodiment integrated circuit includes a switch and a conductive line over the switch. The switch includes a gate, a first source/drain region at a top...
Method for manufacturing a semiconductor device and a semiconductor device
A semiconductor device is formed by forming: a transistor in a semiconductor substrate having a main surface; a source region and a drain region; and a channel...
Transistor array structure
A semiconductor circuit can include a plurality of arrays of transistors having differing characteristics and operating at low voltages and currents. A drain...
Three-dimensional semiconductor device and method of manufacturing the
A three-dimensional (3D) semiconductor device is provided, comprising a substrate having a staircase region comprising N steps, wherein N is an integer one or...
A semiconductor structure includes a metal gate, a second dielectric layer and a contact plug. The metal gate is located on a substrate and in a first...
Gate structure with hard mask structure formed thereon and method for
forming the same
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a first capacitor structure. The first capacitor...
N-well/P-well strap structures
Embodiments of N-well or P-well strap structures are disclosed with lower requirements achieved by forming the strap on both sides of one or more floating...
Panel device having electrostatic discharge protection
A display device includes a substrate, at least one signal circuit, a ground protection circuit, and an auxiliary protection circuit. The substrate has a first...
Electrostatic discharge protection structure
Provided is an electrostatic discharge (ESD) protection structure including a substrate, a pick-up region, a first MOS device, a second MOS device, a first...
ESD protection circuit cell
A device includes a first bidirectional PNP circuit coupled to a first output of an communication circuit, and a second bidirectional PNP circuit coupling to a...
Light-emitting diode device
A light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip is arranged in a manner at least partly recessed in the...
Control and driver circuits on a power quad flat no-lead (PQFN) leadframe
According to an exemplary implementation, a power quad flat no-lead (PQFN) leadframe includes U-phase and W-phase power switches situated on the PQFN leadframe...
An optical apparatus includes a substrate 1, a wiring pattern 8 formed on the substrate 1, a light-receiving element 3 and a light-emitting element 2 provided...
Optical module integrated package
A an optical module integrated package includes a substrate, a light-receiving chip mounted in a light-receiving region of the substrate, an electronic...
LED with IC integrated lighting module
The present disclosure involves a method of packaging light-emitting diodes (LEDs). A carrier having a first side and a second opposite the first side is...
Package-on-package assembly and method for manufacturing the same
A package-on-package (PoP) assembly includes a bottom die package and a top die package mounted on the bottom die package. The bottom die package includes an...
Accessing or interconnecting integrated circuits
Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and...
A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor...
Semiconductor device, related manufacturing method, and related electronic
A semiconductor device may include the following elements: a first substrate; a second substrate; a dielectric layer, which may be positioned between the first...
Method for manufacturing semiconductor device and semiconductor device
A first semiconductor chip has a first electrode pad, and a second semiconductor chip has a first through via and a second electrode pad joined to the via and...
Chip support substrate, chip support method, three-dimensional integrated
circuit, assembly device, and...
The present invention relates to a chip support substrate including a lyophilic region 4 that is formed on the substrate and that absorbs a chip 3A, and an...
Semiconductor package for thermal dissipation
A first package is bonded to a first substrate with first external connections and second external connections. The second external connections are formed using...
Semiconductor device and manufacturing method thereof
Disclosed are a semiconductor device and a manufacturing method thereof, which can achieve miniaturization and improvement in the integration level by forming a...
Filter and capacitor using redistribution layer and micro bump layer
An integrated circuit package includes a die. An electrically conductive layer comprises a redistribution layer (RDL) in the die, or a micro-bump layer above...
Electronic component package and method for manufacturing same
There is provided a method for manufacturing an electronic component package, wherein a first electronic component and a second electronic component are placed...
Semiconductor device and method of balancing surfaces of an embedded PCB
unit with a dummy copper pattern
A semiconductor device has a substrate. A conductive via is formed through the substrate. A plurality of first contact pads is formed over a first surface of...
Method of making RFID devices on fabrics by stitching metal wires
A method for making a Radio Frequency Identification (RFID) device on fabric is described herein. In a first example, an RFID semiconductor chip is attached to...
Connecting function chips to a package to form package-on-package
A package-on-package (PoP) comprises a substrate with a plurality of substrate traces, a first function chip on top of the substrate connected to the substrate...
Methods and structures for processing semiconductor devices using
polymeric materials and adhesives
Methods of forming a semiconductor structure include exposing a carrier substrate to a silane material to form a coating, removing a portion of the coating at...
Geometry of contact sites at brittle inorganic layers in electronic
An electronic device (10, 20, 30, 40) is provided which comprises a substrate (16) supporting an inorganic layer (11) and a joint (13), mechanically coupling a...
Conductive die attach film for large die semiconductor packages and
compositions useful for the preparation thereof
Provided herein are conductive die attach films having advantageous properties for use in a variety of applications, e.g., for the preparation of large die...
Semiconductor device and method for manufacturing the same
There is provided a semiconductor device. The semiconductor device of the present invention includes a semiconductor element and a metal buffer layer in an...
Grid array connection device and method
A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as...
Wafer level package and fabrication method thereof
A semiconductor device includes a chip having an active surface and a rear surface that is opposite to the active surface; a molding compound covering and...
Solder joint structure for ball grid array in wafer level package
A semiconductor device package and a method for forming the same using an improved solder joint structure are disclosure. The package includes solder joints...
Packaging device and method of making the same
A device includes a first and a second package component. A metal trace is disposed on a surface of the first package component. The metal trace has a...
Semiconductor device and method of forming base substrate with recesses
for capturing bumped semiconductor die
A semiconductor device has a base substrate with recesses formed in a first surface of the base substrate. A first conductive layer is formed over the first...
Pillar bumps and process for making same
Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a...
Semiconductor devices and package substrates having pillars and
semiconductor packages and package stack...
A semiconductor device, a semiconductor package, and a package stack structure include a semiconductor substrate, a first bonding pad disposed on a first...
Semiconductor device and layout design system
In a semiconductor device including a seal ring area containing multiple seal rings are coupled to each other at equal intervals via bridge patterns, improper...
A layer arrangement in accordance with various embodiments may include: a wafer; a passivation disposed over the wafer; a protection layer disposed over at...
Seal ring structure with metal-insulator-metal capacitor
A seal ring structure of an integrated circuit includes a seal ring and a metal-insulator-metal (MIM) capacitor. The MIM capacitor includes a top electrode, a...
In a back surface hole injection type diode, by more effectively securing the effect of hole injection from the back surface of a semiconductor substrate, the...
Integrated passive devices
A semiconductor device has integrated passive circuit elements. A first substrate is formed on a backside of the semiconductor device. The passive circuit...
Multilevel contact to a 3D memory array and method of making thereof
A multi-level device includes at least one device region and at least one contact region. The contact region has a stack of alternating plurality of...
Methods of forming substrate microvias with anchor structures
Methods of forming anchor structures in package substrate microvias are described. Those methods and structures may include forming a titanium layer in an...
Contact critical dimension control
In a method for manufacturing a semiconductor device, a dielectric layer is formed on a substrate, and a contact hole is formed from the dielectric layer to the...
Voidless contact metal structures
Voidless contact metal structures are provided. In one embodiment, a voidless contact metal structure is provided by first providing a first contact metal that...
An electronic device is disclosed. The electronic device comprises a transistor provided on a substrate, a transmission line provided on the substrate and...