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Method of semiconductor integrated circuit fabrication
A method of fabricating a semiconductor integrated circuit (IC) is disclosed. A conductive feature over a substrate is provided. A first dielectric layer is...
Contact hole formation methods
Methods of forming contact holes comprising: (a) providing a substrate comprising a plurality of post patterns over a layer to be patterned; (b) forming a...
Manufacturing method for forming semiconductor structure with sub-fin
The present invention provides a semiconductor structure including a substrate, at least one fin group and a plurality of sub-fin structures disposed on the...
A conveying apparatus includes a holding plate having a holding surface destined to face a surface of a wafer to be held; a restriction member on one end side...
Device and method for individual support of components
A system is provided for individually supporting at least one component having opposing front and back faces, including a supporting device having a plurality...
Semiconductor piece manufacturing method
A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width...
An electrostatic clamp configured to, in use, hold an article, such as a reticle or a wafer in a lithographic apparatus. The clamp includes a lower portion; an...
An end effector includes: a hand; a substrate holder provided on the hand; a mapping detector provided at distal end portions and of the hand; a light emitter,...
Deposition apparatus, organic light emitting display apparatus, and method
of manufacturing organic light...
A deposition apparatus includes a deposition unit including a plurality of deposition assemblies, which are separated from a substrate at a predetermined...
Ultra-low oxygen and humility loadport and stocker system
One or more pods for adjusting at least one of an oxygen content or a water content therein and methods of their use are provided, where one or more...
Buffer material for packing wafer carrier
At the time of packing a wafer carrier into a container, an upper buffer body and a lower buffer body are arranged above and below the wafer carrier. The wafer...
An accommodation cassette including: a plurality of rear accommodating grooves that are formed at least in the laterally central area of the inner surface of a...
Substrate transporting apparatus, substrate delivery position confirming
method, and substrate processing system
A loader module of a substrate processing system includes a transportation arm configured to move towards a wafer accommodated in a carrier and receive the...
Die bonding device
A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and...
Laser annealing apparatus and laser annealing method
A laser annealing apparatus includes: a laser beam generator for providing a stable single-pulse laser; a cyclic delay unit (300) for splitting the single-pulse...
Brush mandrel for PVA sponge brush
A cleaning device for cleaning substrates is provided. The cleaning device includes a generally cylindrically-shaped brush mandrel and a cylindrical brush. The...
Low cost interposer and method of fabrication
A method for making an interposer is provided. A conductive layer is formed by contacting a replicate such that a shape of a surface of the conductive layer...
Semiconductor device and methods of manufacturing semiconductor devices
This application relates to a semiconductor device comprising a semiconductor chip, a molded body covering the semiconductor chip, wherein the molded body...
Method for fabricating a semiconductor chip panel
The method comprises providing a carrier, providing a plurality of semiconductor chips, the semiconductor chips each comprising a first main face and a second...
Fabrication method of packaging substrate
A method for fabricating a packaging substrate includes: providing a carrier having a first metal layer and a second metal layer formed on the first metal...
3DIC interconnect devices and methods of forming same
A stacked semiconductor device and a method of forming the stacked semiconductor device are provided. A plurality of integrated circuits are bonded to one...
Method and apparatus for mitigating parasitic coupling in a packaged
A packaged IC has a package with a die paddle, a signal lead, and a ground lead. The packaged IC also has a die, secured to the package, with a ground pad and a...
Method of making a semiconductor device using multiple layer sets
A method of making a semiconductor device includes forming an intermediate semiconductor device. The intermediate device includes a substrate; and a dielectric...
Semiconductor structure and manufacturing method for the same
A semiconductor structure and a manufacturing method of the same are disclosed. The semiconductor structure includes a conductive layer, a conductive strip, a...
Methods for fabricating guide patterns and methods for fabricating
integrated circuits using such guide patterns
Methods for fabricating guide patterns and methods for fabricating integrated circuits using guide patterns are provided. In an embodiment, a method for...
Plasma processing method
There is provided a plasma processing method capable of carrying out a stable plasma process by way of improving plasma stabilization and also capable of...
Hydrogenation method and hydrogenation apparatus
A hydrogenation method according to the present invention includes preparing a plasma generation section (20), preparing a hermetic member (30), disposing an...
Integrated capacitor and method for producing the same
An integrated capacitor includes a substrate with a first main surface area and an opposing second main surface area. A capacitor structure with a dielectric...
Conformal thin film deposition of electropositive metal alloy films
The present disclosure relates to a method of forming a semiconductor. The method includes heating a substrate in a reaction chamber, supplying to the reaction...
Plate-like object processing method
A plate-like object processing method for processing a plate-like object including a substrate and a laminate formed on a front surface of the substrate,...
Method for manufacturing semiconductor device
An insulating film (2) is formed on a main surface of a semiconductor substrate (1) that includes an active region and a termination region. The insulating film...
Boron ion implantation using alternative fluorinated boron precursors, and
formation of large boron hydrides...
Methods of implanting boron-containing ions using fluorinated boron-containing dopant species that are more readily cleaved than boron trifluoride. A method of...
Virtual substrates for epitaxial growth and methods of making the same
A virtual substrate includes a handle support and a strain-relieved single crystalline layer on the handle support. A method of making the virtual substrate...
Crystallization processing for semiconductor applications
A method and apparatus for forming a crystalline semiconductor layer on a substrate are provided. A semiconductor layer is formed by vapor deposition. A pulsed...
Method for growing nitride-based semiconductor with high quality
Disclosed is a method for growing a nitride-based semiconductor with high quality, the method including: forming a first mask layer on a substrate and forming a...
Atomic layer epitaxy for semiconductor gate stack layer for advanced
Embodiments of the present disclosure provide methods and apparatus for forming an epitaxial layer on a substrate. The substrate is exposed to pulsed laser...
Molecular precursor compounds for ABIGZO zinc-group 13 mixed oxide
Molecular precursor compounds, processes and compositions for making Zn-Group 13 mixed oxide materials including ABIGZO, AIGZO and BAIZO, by providing inks...
Silicon-germanium fin of height above critical thickness
Embodiments of the invention include a method for fabricating a SiGe fin and the resulting structure. A SOI substrate is provided, including at least a silicon...
Methods of forming doped epitaxial SiGe material on semiconductor devices
One illustrative method disclosed herein includes, among other things, performing first and second in situ doping, epitaxial deposition processes to form first...
Methods and apparatus for wetting pretreatment for through resist metal
Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller....
Method for forming dielectric film in trenches by PEALD using H-containing
A method for forming a dielectric film in a trench on a substrate by plasma-enhanced atomic layer deposition (PEALD) performs one or more process cycles, each...
Method of manufacturing semiconductor device
An insulating film including characteristics such as low permittivity, a low etching rate and a high insulation property is formed. Supplying a gas containing...
Controlling the reflow behaviour of BPSG films and devices made thereof
A method for depositing an insulating layer includes performing a primary deposition over a sidewall of a feature by depositing a layer of silicate glass using...
Method for fabricating semiconductor device
A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having at least a gate structure thereon and...
Substrate processing method
A hydrophobizing agent vapor is supplied to a substrate and a surface of the substrate including a pattern is hydrophobized. Thereafter, the substrate is dried...
Hollow cathode device and method for using the device to control the
uniformity of a plasma process
A chamber component configured to be coupled to a processing chamber is described. The chamber component comprises one or more adjustable gas passages through...
Ion mobility spectrometry-mass spectrometry (IMS-MS) with improved ion
transmission and IMS resolution
An interface for an ion mobility spectrometry-mass spectrometry (IMS-MS) system includes a first ion guide for receiving ions from an IMS drift cell, and a...
Gas diffuser ion inlet
In some embodiments, a gas diffuser for use in a mass spectrometer is disclosed that can provide a controlled expansion of an ion-containing gas so as to reduce...
Preparation of test plates for matrix assisted laser desorption ionization
The present invention is directed, sample test plates that can be used in matrix assisted laser desorption ionization. These plates have an etched surface and a...
Segmented planar calibration for correction of errors in time of flight
An ion detector system for a mass spectrometer is disclosed comprising an ion detector comprising an array of detector elements. The ion detector system is...