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Composition and methods of forming solder bump and flip chip using the
Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The...
LC module for installation in a motor vehicle control device
An LC module for installation in a housing of a motor vehicle control device, a method for producing an LC module and a corresponding motor vehicle control...
Rail systems and methods for installation and operation of photovoltaic
Rail system and method for a photovoltaic array. The system includes at least one modular rail in a first direction. The modular rail includes a first vehicle...
Magnetic shielding apparatus and magnetic shielding method
A magnetic shielding apparatus includes: a passive shield; a correction target space that is defined in the interior of the passive shield; external coils as a...
Electromagnetic interference shielding (EMI) apparatus including a frame
with drawn latching features
Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for...
Cover structure for electronic circuit module
A cover structure for an electronic circuit module includes a circuit board and a box-shaped cover integrated to each other. An electronic component is mounted...
Shield member and method for manufacturing the same
A shield member (1) includes a flexible main body part (11) surrounding electrical wire connected to a device in a shield case; and a flange part (12) provided...
Tile assemblies faciliating failover airflow into cold air containment
Tile assemblies are provided having first and second tile sections and an airflow control mechanism. The first tile section allows, in a cold air cooling mode,...
Electronic board provided with a liquid cooling system
An electronic board includes a support on which first electronic components are installed, the first electronic components having a height of less than a first...
LC filter having a function to cool AC reactor
The LC filter includes a first AC reactor having a first core and a first coil whose terminal is connected to an AC power source, a second AC reactor having a...
Storage unit combining module capable of loading several storage units,
storage unit moving suit and related...
A storage unit combining module capable of loading a plurality of storage units, and a storage unit moving suit having several storage unit combining modules...
Server rack and its server device
A server rack and its server device are provided. The server device includes a chassis, a motherboard module, a power-supply module, a storage array module, and...
Convergent energized IT apparatus for commercial use
Various embodiments include a combined power and IT modular system including a housing, an IT load, and a DC power generator which is electrically connected to...
Detachable rotating mechanism with positioning function and electronic
device having a rotatable door with the...
A detachable rotating mechanism and a related electronic device with positioning function are provided. The detachable rotating mechanism includes a base, a...
An electronic device includes a chassis, two opposite mounting brackets mounted to a front of the chassis, two latching apparatuses installed to the mounting...
A server includes a chassis, a main tray and a hard disk drive (HDD). The main tray is slidably connected to the chassis and is capable of pulling out of the...
Z-lift line-card blind mate insertion/mating
An aligning apparatus for mounting cards into a housing space is provided. The aligning apparatus includes a first line card having a mating portion and a card...
Plug-in mechanism, subrack including plug-in mechanism, and finished board
A plug-in mechanism, a subrack and a finished board are provided. The plug-in mechanism implements fast and reliable plug-in and plug-out by using a lever...
Circuit board mounting apparatus
A circuit board mounting apparatus includes a circuit board, a first mounting member, a second mounting member, and a third mounting member. The first and...
Mounting frame to mount a component
In some examples, a mounting frame includes a wall structure enclosing an inner space of the mounting frame, and first supports attached to the wall structure...
Shock buffering structure of electronic device, and electronic device
A shock buffering structure which has a side buffer member arranged between a wristwatch case and a watch module within the wristwatch case, wherein the side...
Waterproof control unit
A waterproof control unit is provided in which: connector housing is fixedly positioned onto circuit board that is mounted onto base; a first seal gap G1 formed...
Hinge unit capable of preventing rotation from exceeding fully-open
position and electronic apparatus equipped...
A hinge unit which can be positively prevented from rotating in an opening direction from a fully open position, without being increased in size. The hinge unit...
Transmission device applied to pivot shaft mechanism
A transmission device applied to a pivot shaft mechanism provides a security system and is easy to assemble. The transmission device includes at least one...
Portable electronic device case
Various embodiments of the present disclosure provide a flexible boot for at least partially encompassing an electronic device. In one embodiment, the boot...
Display device mounted in housing with elastic body
A recessed portion is formed in a side face of a display device. An elastic body is provided in a recessed portion. The elastic body is elastically deformed to...
Pressure relief system for switchgear
A compartment of an arc resistant enclosure for an electrical component includes a plurality of wall structures defining an interior space for housing an...
Element housing package and mounting structure body
An element housing package includes a substrate, a frame body, and an input-output terminal. The input-output terminal has a wiring conductor formed in a...
Power semiconductor device
A power semiconductor device comprising: a body, a substrate and power semiconductor components arranged on and connected to the substrate. The device has...
Power distribution module form factor
A modular form factor power module system with monitoring and control functions is disclosed. The power module system is configured to power, monitor and/or...
Device for a system for traffic monitoring of vehicles in road traffic
A device for a system for traffic monitoring of vehicles in road traffic, the device having a first mounting frame and a second mounting frame, which can be...
USB device with preassembled lid
A USB memory assembly, and methods of forming same, are disclosed. The USB memory assembly includes a USB memory device within a carrier. The carrier may in...
Extended landing pad substrate package structure and method
An extended landing pad substrate package includes a dielectric layer having an upper surface and an opposite lower surface. A lower circuit pattern is embedded...
Solder void reduction between electronic packages and printed circuit
A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer, wherein...
Power distribution box
An integrated power distribution box includes an upper level assembly with a printed circuit board including at least one electrical component, a lower housing...
Method for mounting a component in or on a circuit board, and circuit
In a method for mounting an element or component having at least one metal surface in or on a circuit board containing at least one conducting layer made of...
Method for producing an aircraft structure component having an outer skin
provided with electric conductor elements
A method for producing an aircraft structure component is disclosed the component having an outer skin provided with electric conductor elements. The method...
Method of forming metallic pattern on polymer substrate
A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes...
Metallized substrate, metal paste composition, and method for
manufacturing metallized substrate
The present invention provides: a method for manufacturing a metallized substrate by which a fine pattern can be formed more easily; a metallized substrate...
Electronic component embedded substrate and manufacturing method thereof
The present invention relates to an electronic component embedded substrate including: a first insulating layer including a cavity; an electronic component...
Circuit module and method for producing such a circuit module
The invention relates to a circuit module (10) having a circuit carrier (12), at least one circuit (14) mounted on the circuit carrier (12), encapsulated by a...
Power semiconductor device
A power semiconductor device comprising a first housing having a cutout with an opening, and a second housing. The device has a load element having external and...
Spacer layer for embedding semiconductor die
A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted...
Electronic device and method of manufacturing electronic device
An electronic device includes: a first electronic component; first members that are provided on a first surface of the first electronic component and that...
Test structure and method of testing electrical characteristics of through
A method and apparatus for testing the electrical characteristics, such as electrical continuity, is provided. A substrate, such as a wafer or an interposer,...
Enhanced ball grid array
A two-dimensional array of bonding pads is formed on a first major surface of a substrate. At least some of the pads are connected to conductors that extend...
Fine pitch copper pillar package and method
An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction....
Epoxy resin composition and printed circuit board including insulating
layer using the epoxy resin composition
An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and...
Flexible metal laminate containing fluoropolymer
The present invention relates to a flexible metal laminate with low dielectric constant, which may be applied for a substrate for a flexible printed circuit. A...
Glass composite with functional element
A glass composite has at least one first main glass panel (2), at least one second main glass panel (3) arranged at a distance from the first main glass panel,...