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Patent # Description
US-9,462,736 Composition and methods of forming solder bump and flip chip using the same
Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The...
US-9,462,735 LC module for installation in a motor vehicle control device
An LC module for installation in a housing of a motor vehicle control device, a method for producing an LC module and a corresponding motor vehicle control...
US-9,462,734 Rail systems and methods for installation and operation of photovoltaic arrays
Rail system and method for a photovoltaic array. The system includes at least one modular rail in a first direction. The modular rail includes a first vehicle...
US-9,462,733 Magnetic shielding apparatus and magnetic shielding method
A magnetic shielding apparatus includes: a passive shield; a correction target space that is defined in the interior of the passive shield; external coils as a...
US-9,462,732 Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features
Exemplary embodiments are disclosed of shielding apparatus or assemblies having a frame with drawn latching features or portions that are configured for...
US-9,462,731 Cover structure for electronic circuit module
A cover structure for an electronic circuit module includes a circuit board and a box-shaped cover integrated to each other. An electronic component is mounted...
US-9,462,730 Shield member and method for manufacturing the same
A shield member (1) includes a flexible main body part (11) surrounding electrical wire connected to a device in a shield case; and a flange part (12) provided...
US-9,462,729 Tile assemblies faciliating failover airflow into cold air containment aisle
Tile assemblies are provided having first and second tile sections and an airflow control mechanism. The first tile section allows, in a cold air cooling mode,...
US-9,462,728 Electronic board provided with a liquid cooling system
An electronic board includes a support on which first electronic components are installed, the first electronic components having a height of less than a first...
US-9,462,727 LC filter having a function to cool AC reactor
The LC filter includes a first AC reactor having a first core and a first coil whose terminal is connected to an AC power source, a second AC reactor having a...
US-9,462,726 Storage unit combining module capable of loading several storage units, storage unit moving suit and related...
A storage unit combining module capable of loading a plurality of storage units, and a storage unit moving suit having several storage unit combining modules...
US-9,462,725 Server rack and its server device
A server rack and its server device are provided. The server device includes a chassis, a motherboard module, a power-supply module, a storage array module, and...
US-9,462,724 Convergent energized IT apparatus for commercial use
Various embodiments include a combined power and IT modular system including a housing, an IT load, and a DC power generator which is electrically connected to...
US-9,462,723 Detachable rotating mechanism with positioning function and electronic device having a rotatable door with the...
A detachable rotating mechanism and a related electronic device with positioning function are provided. The detachable rotating mechanism includes a base, a...
US-9,462,722 Electronic device
An electronic device includes a chassis, two opposite mounting brackets mounted to a front of the chassis, two latching apparatuses installed to the mounting...
US-9,462,721 Server
A server includes a chassis, a main tray and a hard disk drive (HDD). The main tray is slidably connected to the chassis and is capable of pulling out of the...
US-9,462,720 Z-lift line-card blind mate insertion/mating
An aligning apparatus for mounting cards into a housing space is provided. The aligning apparatus includes a first line card having a mating portion and a card...
US-9,462,719 Plug-in mechanism, subrack including plug-in mechanism, and finished board
A plug-in mechanism, a subrack and a finished board are provided. The plug-in mechanism implements fast and reliable plug-in and plug-out by using a lever...
US-9,462,718 Circuit board mounting apparatus
A circuit board mounting apparatus includes a circuit board, a first mounting member, a second mounting member, and a third mounting member. The first and...
US-9,462,717 Mounting frame to mount a component
In some examples, a mounting frame includes a wall structure enclosing an inner space of the mounting frame, and first supports attached to the wall structure...
US-9,462,716 Shock buffering structure of electronic device, and electronic device
A shock buffering structure which has a side buffer member arranged between a wristwatch case and a watch module within the wristwatch case, wherein the side...
US-9,462,715 Waterproof control unit
A waterproof control unit is provided in which: connector housing is fixedly positioned onto circuit board that is mounted onto base; a first seal gap G1 formed...
US-9,462,714 Hinge unit capable of preventing rotation from exceeding fully-open position and electronic apparatus equipped...
A hinge unit which can be positively prevented from rotating in an opening direction from a fully open position, without being increased in size. The hinge unit...
US-9,462,713 Transmission device applied to pivot shaft mechanism
A transmission device applied to a pivot shaft mechanism provides a security system and is easy to assemble. The transmission device includes at least one...
US-9,462,712 Portable electronic device case
Various embodiments of the present disclosure provide a flexible boot for at least partially encompassing an electronic device. In one embodiment, the boot...
US-9,462,711 Display device mounted in housing with elastic body
A recessed portion is formed in a side face of a display device. An elastic body is provided in a recessed portion. The elastic body is elastically deformed to...
US-9,462,710 Pressure relief system for switchgear
A compartment of an arc resistant enclosure for an electrical component includes a plurality of wall structures defining an interior space for housing an...
US-9,462,709 Element housing package and mounting structure body
An element housing package includes a substrate, a frame body, and an input-output terminal. The input-output terminal has a wiring conductor formed in a...
US-9,462,708 Power semiconductor device
A power semiconductor device comprising: a body, a substrate and power semiconductor components arranged on and connected to the substrate. The device has...
US-9,462,707 Power distribution module form factor
A modular form factor power module system with monitoring and control functions is disclosed. The power module system is configured to power, monitor and/or...
US-9,462,706 Device for a system for traffic monitoring of vehicles in road traffic
A device for a system for traffic monitoring of vehicles in road traffic, the device having a first mounting frame and a second mounting frame, which can be...
US-9,462,705 USB device with preassembled lid
A USB memory assembly, and methods of forming same, are disclosed. The USB memory assembly includes a USB memory device within a carrier. The carrier may in...
US-9,462,704 Extended landing pad substrate package structure and method
An extended landing pad substrate package includes a dielectric layer having an upper surface and an opposite lower surface. A lower circuit pattern is embedded...
US-9,462,703 Solder void reduction between electronic packages and printed circuit boards
A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer, wherein...
US-9,462,702 Power distribution box
An integrated power distribution box includes an upper level assembly with a printed circuit board including at least one electrical component, a lower housing...
US-9,462,701 Method for mounting a component in or on a circuit board, and circuit board
In a method for mounting an element or component having at least one metal surface in or on a circuit board containing at least one conducting layer made of...
US-9,462,700 Method for producing an aircraft structure component having an outer skin provided with electric conductor elements
A method for producing an aircraft structure component is disclosed the component having an outer skin provided with electric conductor elements. The method...
US-9,462,699 Method of forming metallic pattern on polymer substrate
A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes...
US-9,462,698 Metallized substrate, metal paste composition, and method for manufacturing metallized substrate
The present invention provides: a method for manufacturing a metallized substrate by which a fine pattern can be formed more easily; a metallized substrate...
US-9,462,697 Electronic component embedded substrate and manufacturing method thereof
The present invention relates to an electronic component embedded substrate including: a first insulating layer including a cavity; an electronic component...
US-9,462,696 Circuit module and method for producing such a circuit module
The invention relates to a circuit module (10) having a circuit carrier (12), at least one circuit (14) mounted on the circuit carrier (12), encapsulated by a...
US-9,462,695 Power semiconductor device
A power semiconductor device comprising a first housing having a cutout with an opening, and a second housing. The device has a load element having external and...
US-9,462,694 Spacer layer for embedding semiconductor die
A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted...
US-9,462,693 Electronic device and method of manufacturing electronic device
An electronic device includes: a first electronic component; first members that are provided on a first surface of the first electronic component and that...
US-9,462,692 Test structure and method of testing electrical characteristics of through vias
A method and apparatus for testing the electrical characteristics, such as electrical continuity, is provided. A substrate, such as a wafer or an interposer,...
US-9,462,691 Enhanced ball grid array
A two-dimensional array of bonding pads is formed on a first major surface of a substrate. At least some of the pads are connected to conductors that extend...
US-9,462,690 Fine pitch copper pillar package and method
An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction....
US-9,462,689 Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition
An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and...
US-9,462,688 Flexible metal laminate containing fluoropolymer
The present invention relates to a flexible metal laminate with low dielectric constant, which may be applied for a substrate for a flexible printed circuit. A...
US-9,462,687 Glass composite with functional element
A glass composite has at least one first main glass panel (2), at least one second main glass panel (3) arranged at a distance from the first main glass panel,...
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