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Patent # Description
US-9,468,136 Low void solder joint for multiple reflow applications
Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of...
US-9,468,135 Substrate conveying system for electronic component mounting device
A substrate conveying system includes a mounting device conveyor for conveying a printed substrate in a first horizontal direction, an upstream-side conveyor, a...
US-9,468,134 Soft magnetic powder, method of manufacturing the same, noise suppression sheet using the same, and method of...
In order to provide a noise suppression sheet whose imaginary part magnetic permeability .mu.'', representing a magnetic loss component, is large at a GHz-band...
US-9,468,133 Modular cooling system
An exemplary modular cooling system for cooling a plurality of electronic components is provided. The cooling system includes a plurality of cooling modules and...
US-9,468,132 Heat-receiving device, cooling device, and electronic device
A heat-receiving device includes: a plurality of heat receivers into which a refrigerant flows; a series path that comprises a connection path connecting...
US-9,468,131 Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels
A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar...
US-9,468,130 Micro channel cooling device, micro channel cooling system, and electronic instrument
A microchannel cooling device includes a heat sink having a liquid refrigerant flow channel having a microscopic cross section and connected to a heat source...
US-9,468,129 Storage unit and electronic device having the same
A storage unit, in which a hard disk drive is disposed and detachably installed inside a casing including side walls standing on the tray, a tray and a circuit...
US-9,468,128 Server and casing thereof
A casing includes a shell, at least one carrier tray, at least one slide rail assembly and a buffering component. The shell has an accommodating space and an...
US-9,468,127 Server chassis capable of accessing and rotating storage devices accommodated therein
A server chassis includes a casing, a motherboard, a rotatable rack and an electronic device. The rotatable rack is axially disposed inside the casing and able...
US-9,468,126 Multi-device storage enclosure with extendable device support sleds
Apparatus for retracting and extending sets of operational processing devices in a multi-device enclosure. In accordance with some embodiments, an enclosed...
US-9,468,125 Electronic device
An electronic device includes an enclosure and a first bracket coupling in the enclosure. The enclosure includes two opposite side walls. The first bracket...
US-9,468,124 Stand alone input/output module commonly usable to recorder and data logger
An input/output module is commonly usable to a recorder and a data logger. The input/output module includes an input/output unit and a power unit. The...
US-9,468,123 Electronic device with quick releasing function for an interface card
An electronic device with quick releasing function for an interface card includes a base, a connector and a quick releasing mechanism. The base is adapted to...
US-9,468,122 Portable device holding apparatus
An apparatus for holding a portable device is provided which includes a cradle for holding the portable device. A support member is operatively coupled to the...
US-9,468,121 Electrical connection box
An electrical connection box includes FL accommodating parts that are disposed on a main face wall of a casing that faces a front side of a circuit board and to...
US-9,468,120 Housing, bobbin, and electronic device
A housing covering an electronic component is provided. The housing includes a body, a first coupling portion, and a third coupling portion. The body has a...
US-9,468,119 Housing element for a control device housing used in a motor vehicle
A housing element for a control unit housing has one or more first edge sections for contact with a second edge section of a second housing element allocated to...
US-9,468,118 Reinforced structural composite
A foam layer may be reinforced by applying a primer layer prior to application of a metal or other absorbent layer. The primer layer seals the foam layer so...
US-9,468,117 Memory device having heterogeneous terminals
A memory device having heterogeneous terminals easily connects the memory device to a computer or a portable terminal without a specific gender. When a memory...
US-9,468,116 Secure enclosure
An apparatus and associated methodology contemplating an enclosure configured to securely contain a circuit board. The enclosure has a cover defining a flange...
US-9,468,115 Partition board, and method of restraining electrical storage elements
A partition board that is arranged between two electrical storage elements that are arranged adjacent to each other in a predetermined direction (X direction)...
US-9,468,114 Housing and electronic device using the same
A housing includes a substrate and a decorative layer deposited on the substrate. The decorative layer includes chromium, iron, aluminum, chromium oxide, ferric...
US-9,468,113 Floating fasteners
One or more fastenings can be used to fasten components together, such as housing components on a computing device. Each fastening can include a first opening...
US-9,468,112 Display device with narrow frame
The present disclosure relates to the technical field of display, and particularly relates to a display with an improvide4d frame structure. The present...
US-9,468,111 Housing assembly and solid state drive having the same
A housing assembly, including a top housing, a bottom housing and an accommodation, is provided. The top housing has a top plate, and a first sidewall extending...
US-9,468,110 Chassis assembly structure
According to a chassis assembly structure, in assembling a front chassis side assembly in a bottom chassis, a front chassis side assembly 120 is configured such...
US-9,468,109 Method for fabricating wiring board
A core material is prepared, wherein the core material has an insulating layer, and a conductor pattern provided on a surface of the insulating layer. One or...
US-9,468,108 Method and structure for forming contact pads on a printed circuit board using zero under cut technology
A method and an apparatus for forming a contact pad on a printed circuit board over a filled plate via or blind in which an additional metallic or a non...
US-9,468,107 Interdigitated chip capacitor assembly
A method of registering terminals on an interdigitated chip capacitor ("IDC") with a plurality of contact pads on a substrate. At least one vertically extending...
US-9,468,106 Bonding system
A bonding system 1 includes a plurality of laser resonators 7 and a plurality of optical fibers f1 to f36 each having a laser beam inlet connected to one of the...
US-9,468,105 Electronic component, electronic apparatus, and moving object
An electronic component includes a pedestal plate that has a first surface made of a metal and a second surface being an opposite surface to the first surface,...
US-9,468,104 Module board
A module board includes a first board including a first surface and a second surface, a second board where its first surface faces the second surface of the...
US-9,468,103 Interconnect transition apparatus
A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined...
US-9,468,102 Display device
A display device includes a display panel including panel bumps, a flexible circuit film connected to the display panel and including a chip, and panel bonding...
US-9,468,101 Microvia structure of flexible circuit board and manufacturing method thereof
Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of...
US-9,468,100 Multilayer wiring substrate
A multilayer wiring substrate is provided which is less apt to cause the warping and the degradation of the surface flatness, and which is able to effectively...
US-9,468,099 Contact pad connection structure for connecting conductor assembly and flexible circuit board
Disclosed is contact pad connection structure for connecting a conductor assembly and a flexible circuit board. A substrate has a top surface on which a...
US-9,468,098 Face-up substrate integration with solder ball connection in semiconductor package
Systems and methods relate to a semiconductor package comprising a first substrate or a 2D passive-on-glass (POG) structure with a passive component and a first...
US-9,468,097 Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate,...
A resin composition for printed circuit board contains a thermosetting resin and an inorganic filler containing magnesium oxide. A volume average particle size...
US-9,468,096 Epoxy resin composition, and printed circuit board using same
According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein...
US-9,468,095 Manufacturing method of multilayer wiring and multilayer wiring structure
A manufacturing method of multilayer wiring is provided, wherein a multilayer wiring structure including a wiring layer and a conductive via is formed on a...
US-9,468,094 Foldable display apparatus and method of manufacturing the same
A display apparatus includes a flexible substrate, first pixels, and second pixels. The flexible substrate includes: a first area at least partially bent about...
US-9,468,093 Flexible midplane and architecture for a multi-processor computer system
A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the...
US-9,468,092 Electrically conductive film
The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate...
US-9,468,091 Stress-reduced circuit board and method for forming the same
A stress-reduced circuit board includes an insulating substrate, and first and second electrically conductive layers which are stacked one upon the other, and...
US-9,468,090 Current redistribution in a printed circuit board
In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering,...
US-9,468,089 EBG structure, semiconductor device, and circuit board
An EBG structure of an embodiment includes an electrode plane, a first insulating layer provided on the electrode plane, a first metal patch provided on the...
US-9,468,088 Conductive film with high transmittance having a number of anti reflection coatings, touch panel using the same...
The present invention relates to a conductive film with high transmittance and having a number of anti reflection (AR) coated films, whereby transmittance of an...
US-9,468,087 Power module with improved cooling and method for making
Disclosed examples include power modules and fabrication methods therefor in which one or more power device dies include a switching device and a second device...
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