At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.
Low void solder joint for multiple reflow applications
Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of...
Substrate conveying system for electronic component mounting device
A substrate conveying system includes a mounting device conveyor for conveying a printed substrate in a first horizontal direction, an upstream-side conveyor, a...
Soft magnetic powder, method of manufacturing the same, noise suppression
sheet using the same, and method of...
In order to provide a noise suppression sheet whose imaginary part magnetic permeability .mu.'', representing a magnetic loss component, is large at a GHz-band...
Modular cooling system
An exemplary modular cooling system for cooling a plurality of electronic components is provided. The cooling system includes a plurality of cooling modules and...
Heat-receiving device, cooling device, and electronic device
A heat-receiving device includes: a plurality of heat receivers into which a refrigerant flows; a series path that comprises a connection path connecting...
Monolithic multi-module electronics chassis with multi-planar embedded
fluid cooling channels
A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar...
Micro channel cooling device, micro channel cooling system, and electronic
A microchannel cooling device includes a heat sink having a liquid refrigerant flow channel having a microscopic cross section and connected to a heat source...
Storage unit and electronic device having the same
A storage unit, in which a hard disk drive is disposed and detachably installed inside a casing including side walls standing on the tray, a tray and a circuit...
Server and casing thereof
A casing includes a shell, at least one carrier tray, at least one slide rail assembly and a buffering component. The shell has an accommodating space and an...
Server chassis capable of accessing and rotating storage devices
A server chassis includes a casing, a motherboard, a rotatable rack and an electronic device. The rotatable rack is axially disposed inside the casing and able...
Multi-device storage enclosure with extendable device support sleds
Apparatus for retracting and extending sets of operational processing devices in a multi-device enclosure. In accordance with some embodiments, an enclosed...
An electronic device includes an enclosure and a first bracket coupling in the enclosure. The enclosure includes two opposite side walls. The first bracket...
Stand alone input/output module commonly usable to recorder and data
An input/output module is commonly usable to a recorder and a data logger. The input/output module includes an input/output unit and a power unit. The...
Electronic device with quick releasing function for an interface card
An electronic device with quick releasing function for an interface card includes a base, a connector and a quick releasing mechanism. The base is adapted to...
Portable device holding apparatus
An apparatus for holding a portable device is provided which includes a cradle for holding the portable device. A support member is operatively coupled to the...
Electrical connection box
An electrical connection box includes FL accommodating parts that are disposed on a main face wall of a casing that faces a front side of a circuit board and to...
Housing, bobbin, and electronic device
A housing covering an electronic component is provided. The housing includes a body, a first coupling portion, and a third coupling portion. The body has a...
Housing element for a control device housing used in a motor vehicle
A housing element for a control unit housing has one or more first edge sections for contact with a second edge section of a second housing element allocated to...
Reinforced structural composite
A foam layer may be reinforced by applying a primer layer prior to application of a metal or other absorbent layer. The primer layer seals the foam layer so...
Memory device having heterogeneous terminals
A memory device having heterogeneous terminals easily connects the memory device to a computer or a portable terminal without a specific gender. When a memory...
An apparatus and associated methodology contemplating an enclosure configured to securely contain a circuit board. The enclosure has a cover defining a flange...
Partition board, and method of restraining electrical storage elements
A partition board that is arranged between two electrical storage elements that are arranged adjacent to each other in a predetermined direction (X direction)...
Housing and electronic device using the same
A housing includes a substrate and a decorative layer deposited on the substrate. The decorative layer includes chromium, iron, aluminum, chromium oxide, ferric...
One or more fastenings can be used to fasten components together, such as housing components on a computing device. Each fastening can include a first opening...
Display device with narrow frame
The present disclosure relates to the technical field of display, and particularly relates to a display with an improvide4d frame structure. The present...
Housing assembly and solid state drive having the same
A housing assembly, including a top housing, a bottom housing and an accommodation, is provided. The top housing has a top plate, and a first sidewall extending...
Chassis assembly structure
According to a chassis assembly structure, in assembling a front chassis side assembly in a bottom chassis, a front chassis side assembly 120 is configured such...
Method for fabricating wiring board
A core material is prepared, wherein the core material has an insulating layer, and a conductor pattern provided on a surface of the insulating layer. One or...
Method and structure for forming contact pads on a printed circuit board
using zero under cut technology
A method and an apparatus for forming a contact pad on a printed circuit board over a filled plate via or blind in which an additional metallic or a non...
Interdigitated chip capacitor assembly
A method of registering terminals on an interdigitated chip capacitor ("IDC") with a plurality of contact pads on a substrate. At least one vertically extending...
A bonding system 1 includes a plurality of laser resonators 7 and a plurality of optical fibers f1 to f36 each having a laser beam inlet connected to one of the...
Electronic component, electronic apparatus, and moving object
An electronic component includes a pedestal plate that has a first surface made of a metal and a second surface being an opposite surface to the first surface,...
A module board includes a first board including a first surface and a second surface, a second board where its first surface faces the second surface of the...
Interconnect transition apparatus
A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined...
A display device includes a display panel including panel bumps, a flexible circuit film connected to the display panel and including a chip, and panel bonding...
Microvia structure of flexible circuit board and manufacturing method
Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of...
Multilayer wiring substrate
A multilayer wiring substrate is provided which is less apt to cause the warping and the degradation of the surface flatness, and which is able to effectively...
Contact pad connection structure for connecting conductor assembly and
flexible circuit board
Disclosed is contact pad connection structure for connecting a conductor assembly and a flexible circuit board. A substrate has a top surface on which a...
Face-up substrate integration with solder ball connection in semiconductor
Systems and methods relate to a semiconductor package comprising a first substrate or a 2D passive-on-glass (POG) structure with a passive component and a first...
Resin composition for printed circuit board, prepreg for printed circuit
board, laminate, metal-clad laminate,...
A resin composition for printed circuit board contains a thermosetting resin and an inorganic filler containing magnesium oxide. A volume average particle size...
Epoxy resin composition, and printed circuit board using same
According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein...
Manufacturing method of multilayer wiring and multilayer wiring structure
A manufacturing method of multilayer wiring is provided, wherein a multilayer wiring structure including a wiring layer and a conductive via is formed on a...
Foldable display apparatus and method of manufacturing the same
A display apparatus includes a flexible substrate, first pixels, and second pixels. The flexible substrate includes: a first area at least partially bent about...
Flexible midplane and architecture for a multi-processor computer system
A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the...
Electrically conductive film
The present invention relates to an electrically conductive film characterized by being able to undergo elastic deformation, having little residual strain rate...
Stress-reduced circuit board and method for forming the same
A stress-reduced circuit board includes an insulating substrate, and first and second electrically conductive layers which are stacked one upon the other, and...
Current redistribution in a printed circuit board
In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering,...
EBG structure, semiconductor device, and circuit board
An EBG structure of an embodiment includes an electrode plane, a first insulating layer provided on the electrode plane, a first metal patch provided on the...
Conductive film with high transmittance having a number of anti reflection
coatings, touch panel using the same...
The present invention relates to a conductive film with high transmittance and having a number of anti reflection (AR) coated films, whereby transmittance of an...
Power module with improved cooling and method for making
Disclosed examples include power modules and fabrication methods therefor in which one or more power device dies include a switching device and a second device...