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Patent # Description
US-9,490,423 Integrated circuit structures with spin torque transfer magnetic random access memory ultilizing aluminum...
STT-MRAM integrated circuits employing aluminum metallization layers and methods for fabricating the same are disclosed. A method for fabricating an integrated...
US-9,490,422 Current constriction for spin torque MRAM
Magnetoresistive random access memory (MRAM) devices and methods for making the same include growing a tunnel barrier layer on a first magnetic layer. A thin...
US-9,490,421 Method and system for providing vertical spin transfer switched magnetic junctions and memories using such...
A method and system provide a magnetic junction usable in a magnetic device and which resides on a substrate. The magnetic junction includes a reference layer,...
US-9,490,420 Polymer foam-based piezoelectric materials and method of manufacture
Thermally stable piezoelectric polymer foams (ferroelectrets) with high piezoelectric activity for sensing and actuation. The invention further includes a...
US-9,490,419 DHCPv6 address autoconfiguration for source-routed networks
In one embodiment, first IP addresses are allocated to a plurality of nodes, respectively, in a computer network, the first IP addresses being routable IP...
US-9,490,418 Acoustic resonator comprising collar and acoustic reflector with temperature compensating layer
An acoustic resonator structure includes an acoustic reflector over a cavity formed in a substrate, the acoustic reflector including a layer of low acoustic...
US-9,490,417 Method for producing an electrical contact
A method for producing an electrical contact is disclosed. In an embodiment the method includes providing a piezoelectric component that includes an...
US-9,490,416 Piezoelectric drive circuit
A piezoelectric drive circuit includes a first circuit which applies a voltage to the piezoelectric element and includes a plurality of transistors. A second...
US-9,490,415 Integrated thermoelectric generator
An integrated thermoelectric generator includes a semiconductor. A set of thermocouples are electrically connected in series and thermally connected in...
US-9,490,414 Fully integrated thermoelectric devices and their application to aerospace de-icing systems
A thermoelectric module and methods for making and applying same provide an integrated, layered structure comprising first and second, thermally conductive,...
US-9,490,413 Compound semiconductors and their application
Disclosed is a new compound semiconductor material which may be used for thermoelectric material or the like, and its applications. The compound semiconductor...
US-9,490,412 Peltier module for laser diode
A Peltier module for laser diode that can be mounted with high melting point solder is provided. A Peltier module for laser diode includes: a heat...
US-9,490,411 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device,...
A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength...
US-9,490,410 Semiconductor light-emitting device with high reliability and method of manufacturing the same
According to one embodiment, a semiconductor light-emitting device includes a first electrode and a second electrode provided on the same side of a...
US-9,490,409 Light emmiting diode chip
A light emitting diode (LED) chip including a first type semiconductor layer, an light-emitting layer, a second type semiconductor layer, a current blocking...
US-9,490,408 Injection molded microoptics
A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on...
US-9,490,407 Process for forming ultra-micro LEDS
A flexible light sheet includes a bottom conductor layer overlying a flexible substrate. An array of vertical light emitting diodes (VLEDs) is printed as an ink...
US-9,490,405 Light emitting diode device and method for production thereof containing conversion material chemistry
In one embodiment, a light emitting device comprises: a lighting element located in a housing, wherein the housing is formed from a polymer composition...
US-9,490,404 Flip-chip light emitting diode package module and manufacturing method thereof
The instant disclosure relates to a flip-chip LED package module and a method of manufacturing thereof. The method of manufacturing flip-chip LED package module...
US-9,490,403 Color converting element and light emitting device including the same
Disclosed are a color converting element and a method for manufacturing the color converting element. The disclosed color converting element includes: first...
US-9,490,402 LED light-emitting device for white light
A white light emitting LED device comprises: base, blue light LED chips, light reflector and transparent substrate covered with a phosphor coating; two ends of...
US-9,490,401 Method of manufacturing light emitting device
There is provided a method of manufacturing a light emitting device which includes preparing a light emitting element emitting excitation light and a substrate...
US-9,490,400 Optoelectronic component including a conversion element and method of producing an optoelectronic component...
An optoelectronic component includes a layer sequence having an active layer that emits electromagnetic primary radiation during operation, at least one...
US-9,490,399 Illumination method and light-emitting device
To provide an illumination method and a light-emitting device which are capable of achieving, under an indoor illumination environment where illuminance is...
US-9,490,398 Manufacturing method of light emitting device in a flip-chip configuration with reduced package size
Provided is an LED device which is compact while having good luminous efficiency and a focused light distribution. This LED device is provided with: a...
US-9,490,397 Method for producing an optoelectronic semiconductor device, and optoelectronic semiconductor device
A method for producing an optoelectronic thin-film chip semiconductor device is specified. A conductor structure is applied on a carrier and a multiplicity of...
US-9,490,396 Optoelectronic semiconductor component
An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip,...
US-9,490,395 Nanostructure semiconductor light-emitting device
A nanostructure semiconductor light-emitting device includes a base layer formed of a first conductivity-type semiconductor, a first material layer disposed on...
US-9,490,394 Semiconductor light-emitting device
A semiconductor light-emitting device comprises an epitaxial structure comprising a first semiconductor stack, a second semiconductor stack, and an active layer...
US-9,490,393 Semiconductor light emitting device with light extraction surface
A semiconductor light emitting device which includes at least one concave on a light extraction surface opposite to a surface on which a semiconductor stack...
US-9,490,392 P-type doping layers for use with light emitting devices
A light emitting diode (LED) comprises an n-type Group III-V semiconductor layer, an active layer adjacent to the n-type Group III-V semiconductor layer, and a...
US-9,490,391 Semiconductor light emitting device
A semiconductor light emitting device may include: a first conductivity-type semiconductor layer; an active layer disposed on the first conductivity-type...
US-9,490,390 Method of manufacturing light emitting element that includes formation of an insulating layer
A light emitting element for flip-chip mounting having a flat mounting surface which allows a decrease in the width of the streets of a wafer. In the light...
US-9,490,389 Method for producing optoelectronic semiconductor chips
The method is designed for producing optoelectronic semiconductor chips and comprises the steps: A) providing a carrier substrate (1), B) applying a...
US-9,490,388 Semiconductor light emitting element fabrication method
A method of fabricating a plurality of light emitting elements includes forming a nitride semiconductor layer on a growth substrate, the nitride semiconductor...
US-9,490,387 Method of manufacturing a solar cell and equipment therefore
Methods of manufacturing a solar cell are provided. Aspects of embodiments of the methods include introducing charge carriers into a substrate on a first side...
US-9,490,386 Methods of fabricating a photovoltaic module, and related system
A method of processing a semiconductor assembly is presented. The method includes fabricating a photovoltaic module including a semiconductor assembly. The...
US-9,490,385 Devices including independently controllable absorption region and multiplication region electric fields
A device includes a first region, a multiplication region, a second region, and an absorption region. The first region is associated with a first terminal, and...
US-9,490,384 Transportable solar power system
A transportable, self-contained, solar power system comprised of a plurality of individual solar power arrays, each array being contained within a transportable...
US-9,490,383 Solar module
A solar module is provided which has improved durability. A third wiring member (32a) includes a first portion (32a1), a second portion (32a2), and a third...
US-9,490,382 Solar module and manufacturing method therefor
A solar module is provided which has improved output characteristics. The solar module (1) includes a first protecting member (21), a second protecting member...
US-9,490,381 Photovoltaic device, photovoltaic system, and vehicle including photovoltaic device
Disclosed is a photovoltaic device 1 including a plurality of cluster power generation sections G (G11, G12, G21, and G22). Each cluster power generation...
US-9,490,380 Metal matrix composite and method for producing the same
A metal matrix composite having high corrosion resistance even if the coating film deposit amount is low is obtained. A metal matrix composite includes a metal...
US-9,490,379 Thin film solar cells and method of manufacturing the same
A thin film solar cell comprises a substrate, an inorganic layer disposed on the substrate and having a plurality of unevenness, a first electrode disposed on...
US-9,490,378 Cone shaped focusing lens
An optical assembly can be used in various optical devices such as optical proximity sensors, gesture sensors, or imaging sensors. The optical assembly may...
US-9,490,377 Use of a uniform layer of insulating material in back-contact solar cells
A uniform layer of insulating material is used to separate the connectors from the non-illuminated side of a back-contact solar cell, particularly a cell of the...
US-9,490,376 Solar cell module
A solar cell module according to an embodiment of the invention includes a plurality of solar cells each including a substrate, a first electrode current...
US-9,490,375 Solar cell and method for manufacturing the same, and solar cell module
A solar cell includes a first conductive type semiconductor substrate in which a through hole is formed, a second conductive type impurity diffusion layer...
US-9,490,374 Radiation detectors
A detector for detecting radiation is generally described. The detector can comprise at least one ionic semiconductor material. For example, the ionic...
US-9,490,373 Solid-state imaging device and electronic apparatus with improved storage portion
There is provided a solid-state imaging device including a pixel array portion in which multiple unit pixels are arranged on a semiconductor substrate, the...
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