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Method of forming vias in silicon carbide and resulting devices and
A method of fabricating an integrated circuit on a silicon carbide substrate is disclosed that eliminates wire bonding that can otherwise cause undesired...
Via formation using sidewall image transfer process to define lateral
A method of forming a via to an underlying layer of a semiconductor device is provided. The method may include forming a pillar over the underlying layer using...
Pop structures and methods of forming the same
A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a...
Apparatus and method for depositing a layer onto a substrate
Apparatus (1, 26) for depositing a layer (37, 38, 39) on a substrate (2) in a process gas comprises a chuck (3) comprising a first surface (4) for supporting...
Reliable interconnect integration scheme
Embodiments relate to a method for forming reliable interconnects by preparing a substrate with a dielectric layer, processing the dielectric layer to serve as...
Techniques for forming contacts for active BEOL
In one aspect, a method for forming a contact to a device is provided which includes the steps of: forming a conformal etch stop layer surrounding the device;...
Tapered sidewall conductive lines and formation thereof
A semiconductor arrangement and methods of formation are provided. The semiconductor arrangement includes conductive lines having sidewalls angled between about...
Use of dielectric slots for reducing via resistance in dual damascene
An integrated circuit may include dual damascene interconnects formed using a via-first dual damascene process or a trench-first dual damascene process. The...
Channel SiGe devices with multiple threshold voltages on hybrid oriented
substrates, and methods of...
Multiple threshold voltage devices on hybrid oriented substrates, and methods of manufacturing same are disclosed. A method for manufacturing a semiconductor...
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device, the method including providing a substrate; forming a field trench in the substrate; and forming a diffusion...
Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device includes forming isolation layers in a first direction at trenches at isolation regions defined at a...
Bond chuck, methods of bonding, and tool including bond chuck
A bonding chuck is discussed with methods of using the bonding chuck and tools including the bonding chuck. A method includes loading a first wafer on first...
Semiconductor processing and equipment are disclosed. The semiconductor equipment and processing provide semiconductor wafers with reduced defects.
Transfer device for holding an object using a gas flow
A transfer device for holding an object comprises: i) a housing; ii) at least one inlet conduit having an inlet for gas; iii) a plurality of sets of outlet...
Wafer processing method using adhesive layer UV curing step and laser
modified layer forming step to singulate...
A wafer processing method including a modified layer forming step of applying a laser beam having a transmission wavelength to the wafer along each division...
Method of aligning substrate-scale mask with substrate
Methods and systems for alignment of substrate-scale masks are described. The alignment methods presented may improve the uniformity and repeatability of...
Mechanical alignment of substrates to a mask
A plurality of masks is attached to the underside of a mask frame. This attachment is made such that each mask can independently move relative to the mask frame...
Asymmetrical chamber configuration
A production tool includes a chamber, a heater in the chamber, and a pumping outlet on a side of the heater. A pumping liner is in the chamber and encircling...
Substrate processing apparatus and substrate processing method
A substrate processing apparatus performs a predetermined process on a substrate by using a processing gas under a vacuum atmosphere. The substrate processing...
Substrate support for substrate backside contamination control
Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a first aluminum plate for supporting a substrate,...
Chemical deposition apparatus having conductance control
A chemical deposition apparatus having conductance control, which includes a showerhead module having a faceplate and a backing plate, the showerhead module...
Adhesion promoter apparatus and method
A structure comprises a substrate having a plateau region and a trench region, a reflecting layer formed over a top surface of the trench region, a first...
Stud bump structure and method for manufacturing the same
A stud bump structure and method for manufacturing the same are provided. The stud bump structure includes a substrate, and a first silver alloy stud bump...
Semiconductor device with encapsulated lead frame contact area and related
A semiconductor device may include an IC, and lead frame contact areas adjacent the IC. Each lead frame contact area may have a lead opening. The semiconductor...
Removal of surface passivation
Methods for removing a passivation film from a copper surface can include exposing the passivation film to a vapor phase organic reactant, for example at a...
Quaternary ammonium salt compound, composition for forming a resist under
layer film, and patterning process
A quaternary ammonium salt compound is represented by the following formula (A-1), ##STR00001## wherein, R.sup.1, R.sup.2, and R.sup.3 each represent an alkyl...
Method of fabricating semiconductors
A method of manufacturing a semiconductor includes applying a planarization material to a substrate and forming an opening in the planarization material. The...
Cu-low K cleaning and protection compositions
This disclosure relates post chemical mechanical planarization cleaning composition of semiconductor substrate for advanced electronics fabrication and...
Method for planarizing semiconductor device
A method for planarizing a semiconductor device includes steps herein. A substrate is provided, on which a stop layer is formed. A trench is formed in the...
Method for manufacturing semiconductor device
There are provided methods for manufacturing a semiconductor device including providing a substrate including a metal layer including an oxidized surface layer...
Method and apparatus for forming silicon film
Provided is a method of forming a silicon film in a groove formed on a surface of an object to be processed, which includes: forming a first silicon layer on...
Method of substrate temperature control during high temperature wet
Methods are provided for processing a substrate in single substrate tool. In one embodiment, the method includes providing the substrate in the single substrate...
Method for structuring a layered structure from two semiconductor layers,
and micromechanical component
A method for structuring a layered structure, for example, of a micromechanical component, from two semiconductor layers between which an insulating and/or etch...
Method of forming trench cut
A method includes forming a hard mask (HM) stack over a material layer, which has a first, second, third and fourth HM layers. The method also includes forming...
Movable chamber liner plasma confinement screen combination for plasma
A movable symmetric chamber liner in a plasma reaction chamber, for protecting the plasma reaction chamber, enhancing the plasma density and uniformity, and...
Termination structure of semiconductor device and method for manufacturing
A termination structure of a semiconductor device is provided. The semiconductor device includes an active area and a termination area adjacent to the active...
A system and method of etching a semiconductor device are provided. Etching solution is sampled and analyzed by a monitoring unit to determine a concentration...
Substrate, semiconductor device, and method of manufacturing the same
A substrate capable of achieving a lowered probability of defects produced in a step of forming an epitaxial film or a semiconductor element, a semiconductor...
Control of P-contact resistance in a semiconductor light emitting device
A device according to embodiments of the invention includes a semiconductor device structure (10) including a light emitting region (14) disposed between an...
Method of manufacturing three-dimensional semiconductor memory device in
which an oxide layer is formed at...
A method of manufacturing a three-dimensional semiconductor memory device comprises forming a thin layer structure by alternately stacking first and second...
Integrated circuits having improved gate structures and methods for
Integrated circuits with improved gate structures and methods for fabricating integrated circuits with improved gate structures are provided. In an embodiment,...
Non-melt thin-wafer laser thermal annealing methods
Methods of annealing a thin semiconductor wafer are disclosed. The methods allow for high-temperature annealing of one side of a thin semiconductor wafer...
Method for manufacturing semiconductor device
A method includes: forming a front surface structure of a semiconductor element on a front surface side of a semiconductor substrate; forming crystal defects in...
Resistive memory array using P-I-N diode select device and methods of
An electronic structure includes a resistive memory device, and a P-I-N diode in operative association with the resistive memory device. A plurality of such...
Methods for forming a molecular dopant monolayer on a substrate
Methods for forming a conformal dopant monolayer on a substrate are provided. In one embodiment, a method for forming a semi-conductor device on a substrate...
Polycrystalline silicon substrate and manufacturing method thereof
The present invention discloses a polycrystalline silicon substrate and a manufacturing method thereof. The method comprises: provide a substrate; sequentially...
Methods of forming strained epitaxial semiconductor material(S) above a
strain-relaxed buffer layer
One illustrative method disclosed herein includes, among other things, sequentially forming a first material layer, a first capping layer, a second material...
Method and apparatus of forming carbon-containing silicon film
A method of forming a carbon-containing silicon film includes: adsorbing a silicon source on a workpiece by supplying a silicon source gas containing at least...
Plasma-assisted chemical gas separation method having increased plasma
density and device for implementing the...
The invention relates to a method and a device for coating surfaces of a substrate (8) according to the technique of plasma-assisted chemical vapor deposition....
Vapor transport deposition method and system for material co-deposition
An improved feeder system and method for continuous vapor transport deposition that includes at least two vaporizers couple to a common distributor through an...