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Patent # Description
US-9,502,633 Method for current-controlling at least one piezoelectric actuator of a fuel injector of an internal combustion...
Method for controlling a piezoelectric actuator acting on valve elements to open or close a fuel injector respectively allowing or preventing fuel injection...
US-9,502,632 Resonator for the distribution and partial transformation of longitudinal vibrations and method for treating at...
The invention relates to a resonator for the distribution and partial transformation of longitudinal vibrations and to a method for treating at least one fluid...
US-9,502,631 Method of manufacturing end-group components with pure niobium material for superconducting accelerator cavity
End-group components for superconducting accelerator cavity used in acceleration of charged particles are manufactured by subjecting pure niobium sheet...
US-9,502,630 Josephson junction readout for graphene-based single photon detector
A detector for detecting single photons of infrared radiation. In one embodiment a waveguide configured to transmit infrared radiation is arranged to be...
US-9,502,629 Thermoelectric conversion element and thermoelectric conversion material
In a thermoelectric conversion element comprising a thermoelectric conversion layer formed by using a thermoelectric conversion material, the thermoelectric...
US-9,502,628 LED package and method of manufacturing the same
A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two...
US-9,502,627 Wafer level photonic devices dies structure and method of making the same
A light-emitting device includes a first epi-structure with a top surface and a bottom surface opposite to the top surface, a first metal element and a second...
US-9,502,626 LED lighting module
Disclosed is an LED lighting module (100) including a substrate (110), a (+) slug layer (121) and a (-) slug layer (123) formed on the substrate and spaced...
US-9,502,625 Electrophotographic deposition of unpackaged semiconductor device
Described herein are techniques related a precision deposition of unpackaged semiconductor devices ("dies") onto a substrate. This Abstract is submitted with...
US-9,502,624 Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding...
US-9,502,623 Light emitting device
A light emitting device includes a base structure, a wall, a light emitting element, a protection element, and a light reflective portion. The wall includes an...
US-9,502,622 LED assembly
This disclosure discloses an LED assembly. The LED assembly comprises a transparent substrate; a first phosphor layer; a transparent mount, having a plurality...
US-9,502,621 High energy invisible light light emitting diode having safety indication
The present invention includes a safety indication structure a high energy invisible light light emitting structure and two potential applying layers. The high...
US-9,502,620 Composite substrate for light emitting diodes
A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an...
US-9,502,619 Side-view light emitting device including base body having protruding component
A light emitting device has a base body equipped with a base material and a pair of connection terminals disposed from a first main face to a second main face...
US-9,502,618 LED module
An LED module includes: an LED chip; and a resin case having a reflective surface surrounding the LED chip. An area contact inhibitor to inhibit area contact...
US-9,502,617 Light emitting diode package and method of manufacturing the same
A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires...
US-9,502,616 Light-emitting diode
The present invention relates to a light-emitting diode (LED), which comprises electrodes having a single metal reflective layer. The single metal reflective...
US-9,502,615 Light-emitting diode device
A light-emitting element, includes a substrate; a first light-emitting stack formed on the substrate, including a triangular upper surface parallel to the...
US-9,502,614 Light emitting diode chip, light emitting device, and wafer-level structure of light emitting diode
A light emitting device is provided with a growing base having specific geometry to prevent delamination between the encapsulant and the growing base, and...
US-9,502,613 Method for manufacturing liquid crystal display device
The present invention provides a method for manufacturing a liquid crystal display device capable of reducing thermal damage to a polarizing plate during...
US-9,502,612 Light emitting diode package with enhanced heat conduction
A light emitting diode (LED) device and packaging with enhance heat conduction. An LED in a wafer level processing (WLP) package is disclosed using vias in the...
US-9,502,611 Optoelectronic component and method for the production thereof
The invention concerns an optoelectronic component comprising a layer structure with a light-active layer. In a first lateral region the light-active layer has...
US-9,502,610 Method for manufacturing light emitting device
A method for manufacturing a light emitting device, includes a first step of mounting a light emitting element on a support base with a bump; and a second step...
US-9,502,609 Simplified process for vertical LED manufacturing
Techniques for integrating spalling into layer transfer processes involving optical device semiconductor materials are provided. In one aspect, a layer transfer...
US-9,502,608 Method of manufacturing a light emitting device in which light emitting element and light transmissive member...
Provided is a light emitting device capable of reducing light attenuation within the element and having high light extraction efficiency, and a method of...
US-9,502,607 Method for producing an active zone for an optoelectronic semiconductor chip and optoelectronic semiconductor chip
In at least one embodiment, the method is designed to produce an active zone for an optoelectronic semiconductor chip and comprises the following steps: growing...
US-9,502,606 Nitride semiconductor ultraviolet light-emitting element
A nitride semiconductor ultraviolet light-emitting element is provided with: an underlying structure portion including a sapphire (0001) substrate and an AlN...
US-9,502,605 Method of fabricating semiconductor light emitting device
A method of fabricating a semiconductor light emitting device includes forming a first conductivity type semiconductor layer, forming an active layer by...
US-9,502,604 Backplane for flat panel display apparatus, method of manufacturing the backplane, and organic light emitting...
A backplane for a flat panel display apparatus, includes: a thin film transistor (TFT) on a substrate and including an active layer, a gate electrode, a source...
US-9,502,603 Vertically structured group III nitride semiconductor LED chip and method for manufacturing the same
A method for manufacturing a vertically structured Group III nitride semiconductor LED chip includes a first step of forming a light emitting structure...
US-9,502,602 Structure of high electron mobility light emitting transistor
A structure of high electron mobility light emitting transistor comprises a substrate, a HEMT region disposed on the substrate, and a gallium nitride LED...
US-9,502,601 Metallization of solar cells with differentiated P-type and N-type region architectures
Methods of fabricating solar cell emitter regions with differentiated P-type and N-type regions architectures, and resulting solar cells, are described. In an...
US-9,502,600 Inorganic solution and solution process for electronic and electro-optic devices
A solution for forming at least a portion of an active layer of an electronic or electro-optic device includes a solvent, an additive mixed with the solvent to...
US-9,502,599 Semiconductor device, solid-state imaging device, and electric apparatus
There is provided a method of producing a semiconductor device. The method includes the steps of: forming a first hard mask having an opening above a substrate;...
US-9,502,598 Monolithic multiple solar cells
A monolithic multiple solar cell includes at least three partial cells, with a semiconductor mirror placed between two partial cells. The aim of the invention...
US-9,502,597 Method for manufacturing a photovoltaic module with two etching steps P2 and P3 and corresponding photovoltaic...
The invention relates to a method for manufacturing a photovoltaic module comprising a plurality of solar cells in a thin-layer structure, in which the...
US-9,502,596 Patterned thin foil
An adhesive may be applied to a surface of a reusable carrier. Metal foil may be attached to the adhesive to couple the metal foil to the surface of the...
US-9,502,595 Methods and apparatus for improving micro-LED devices
A .mu.LED device comprising: a substrate and an epitaxial layer grown on the substrate and comprising a semiconductor material, wherein at least a portion of...
US-9,502,594 Thin-film semiconductor optoelectronic device with textured front and/or back surface prepared from template...
A method for providing a textured layer in an optoelectronic device is disclosed. The method includes depositing a template layer on a first layer. The template...
US-9,502,593 Organic light-emitting diode (OLED) display
An organic light-emitting diode (OLED) display is disclosed. In one aspect, the display includes a substrate including an emission area, a sensor area, and an...
US-9,502,592 Film-forming composition
A film-forming composition is characterized by containing: a triazine ring-containing hyperbranched polymer containing a repeating unit structure represented by...
US-9,502,591 Device for generating photovoltaic power and manufacturing method for same
Disclosed is a solar cell apparatus. The solar cell apparatus include: a substrate; a back electrode layer on the substrate; a light absorbing layer on the back...
US-9,502,590 Photovoltaic devices with electroplated metal grids
One embodiment of the present invention provides a solar cell. The solar cell includes a photovoltaic structure and a front-side metal grid situated above the...
US-9,502,589 Solar cell, solar cell module, and method for manufacturing solar cell
A solar cell has a collecting electrode formed therein. The collecting electrode is provided with: a main conductive layer that contains copper; and an overcoat...
US-9,502,588 Solar cell module
A solar cell module comprises a solar cell and sealing material provided on the rear surface side of the solar cell. The sealing material includes a colored...
US-9,502,587 Solar cell and method of manufacturing
In different exemplary embodiments, a solar cell is provided, including: a substrate with a first region and a second region, wherein the first region includes...
US-9,502,586 Backside coupled symmetric varactor structure
A symmetric varactor structure may include a first varactor component. The first varactor component may include a gate operating as a second plate, a gate oxide...
US-9,502,585 Schottky barrier diode and method of manufacturing the same
A method of manufacturing a Schottky barrier diode is provided, which includes: providing a semiconductor substrate including a first well region of a first...
US-9,502,584 Vertical diode and fabrication method thereof
A vertical diode is provided. The vertical diode includes a high-voltage N-type well region in a substrate, and two P-doped regions spaced apart from each other...
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