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Patent # Description
US-9,508,581 Wafer transport robot
An object is to transmit an operation of a first parallel link to a second parallel link through a plurality of rotatably supported arms, to prevent the second...
US-9,508,580 Transport device
A transport device includes a large-article drive portion that moves each of a pair of large-article supporting portions between a large-article supporting...
US-9,508,579 Purge apparatus and load port
A purge apparatus for replacing a gas atmosphere in a purge object vessel by a purge gas through a port provided on a bottom face of the purge object vessel is...
US-9,508,578 Method and apparatus for detecting foreign material on a chuck
An apparatus and method for leak detection of coolant gas from a chuck. The apparatus includes a chuck having a top surface and configured to clamp a substrate...
US-9,508,577 Semiconductor manufacturing apparatuses comprising bonding heads
A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus;...
US-9,508,576 Process equipment architecture
Embodiments of the present invention relate to improvements to single-substrate, multi-chamber processing platform architecture for minimizing fabrication...
US-9,508,575 Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing
A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder...
US-9,508,574 Process liquid supply apparatus operating method, process liquid supply apparatus and non-transitory storage medium
According to an embodiment of the present disclosure, a process liquid supply apparatus operating method is provided. The method includes filling a filter unit...
US-9,508,573 Substrate processing apparatus and substrate processing method
A processing liquid is supplied onto a substrate rotated by a spin chuck in a coating processing unit so that a film of the processing liquid is formed, and a...
US-9,508,572 Bonding device
A boding device includes a light guiding part that guides laser beam oscillated from a laser oscillator, a bonding head that heats a chip with the laser beam,...
US-9,508,571 Method for cleaning base, heat process method for semiconductor wafer, and method for manufacturing solid-state...
A method for cleaning a base for supporting an object to process in an apparatus configured to perform a heat process, the method comprising a first step of...
US-9,508,570 Singulation apparatus and method
A singulation apparatus and method including: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to...
US-9,508,569 Substrate liquid processing apparatus
Disclosed is a substrate liquid processing apparatus including a substrate holding unit configured to hold a substrate; a processing liquid nozzle configured to...
US-9,508,568 Substrate processing apparatus and substrate processing method for performing cleaning treatment on substrate
A special mode has a second rinsing process which supplies a rinsing liquid to a substrate while holding and rotating the substrate with a spin chuck under...
US-9,508,567 Cleaning jig and cleaning method for cleaning substrate processing apparatus, and substrate processing system
Disclosed is a method of cleaning components of a substrate processing apparatus The components of the substrate processing apparatus are cleaned by using a...
US-9,508,566 Wafer level overmold for three dimensional surfaces
Embodiments of the invention include a method for shaping a flexible integrated circuit to a curvature and the resulting structure. A flexible circuit is...
US-9,508,565 Semiconductor package and method of manufacturing the same
The semiconductor package according to an exemplary embodiment includes: a substrate having a plurality of circuit layers and connection pads which are provided...
US-9,508,564 Method for manufacturing semiconductor device
A plurality of semiconductor element is formed on a substrate. A plurality of sealing windows and a support portion supporting the plurality of sealing windows...
US-9,508,563 Methods for flip chip stacking
A method for flip chip stacking includes forming a cavity wafer comprising a plurality of cavities and a pair of corner guides, placing a through-silicon-via...
US-9,508,562 Sidewall image templates for directed self-assembly materials
In one example, a method includes forming a template having a plurality of elements above a process layer and forming spacers on sidewalls of the plurality of...
US-9,508,561 Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications
Embodiments of the present invention provide methods for forming an interconnection structure in semiconductor devices without breaking vacuum with minimum...
US-9,508,560 SiARC removal with plasma etch and fluorinated wet chemical solution combination
A method that allows effective removal of a silicon-containing antireflective coating (SiARC) layer in a block mask after defining an unblock area in a sidewall...
US-9,508,559 Semiconductor wafer and method for manufacturing semiconductor device
A semiconductor wafer including patterns transferred to a plurality of shot regions of the semiconductor wafer respectively, a plurality of chip regions being...
US-9,508,558 Wafer treatment solution for edge-bead removal, edge film hump reduction and resist surface smooth, its...
The present disclosure provides a wafer treatment solution for edge-bead removal, edge film hump reduction and resist surface smooth. The wafer treatment...
US-9,508,557 Method of improving line roughness in substrate processing
Provided is a method for processing a semiconductor substrate to reduce line roughness, the method comprising: positioning a substrate in a film-forming system,...
US-9,508,556 Method for fabricating fin field effect transistor and semiconductor device
A method for fabricating a fin field effect transistor (FinFET) is provided. The method includes steps as follows. A gate stack is formed over a substrate...
US-9,508,555 Method of manufacturing semiconductor device
To improve quality or manufacturing throughput of a semiconductor device, a method includes supplying a source gas to a substrate in a process chamber;...
US-9,508,554 Method of manufacturing semiconductor device
To provide a semiconductor device having improved performance while improving the throughput in the manufacturing steps of the semiconductor device. An...
US-9,508,553 Photoresists and methods for use thereof
New photoresists are provided that comprise a multi-keto component and that are particularly useful for ion implant lithography applications. Preferred...
US-9,508,552 Method for forming metallic sub-collector for HBT and BJT transistors
A heterojunction bipolar transistor having an emitter, a base, and a collector, the heterojunction bipolar transistor including a metallic sub-collector...
US-9,508,551 Method of fabricating a semiconductor device and a semiconductor device fabricated by the method
A method of fabricating a semiconductor device includes stacking an etch target layer, a first mask layer, and a second mask layer on a first surface of a...
US-9,508,550 Preparation of low defect density of III-V on Si for device fabrication
A method of forming a semiconducting material includes depositing a graded buffer on a substrate to form a graded layer of an indium (In) containing III-V...
US-9,508,549 Methods of forming electronic devices including filling porous features with a polymer
Methods of forming an electronic device comprise: (a) providing a semiconductor substrate comprising a porous feature on a surface thereof; (b) applying a...
US-9,508,548 Method for forming barrier layer for dielectric layers in semiconductor devices
A semiconductor device having a high-k gate dielectric, and a method of manufacture, is provided. A gate dielectric layer is formed over a substrate. An...
US-9,508,547 Composition-matched curtain gas mixtures for edge uniformity modulation in large-volume ALD reactors
Disclosed are methods of performing film deposition. The methods may include volumetrically isolating a first process station from a second process station by...
US-9,508,546 Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device is disclosed. The method includes (a) loading a substrate into a process chamber; (b) processing the substrate...
US-9,508,545 Selectively lateral growth of silicon oxide thin film
Implementations disclosed herein generally relate to methods of forming silicon oxide films. The methods can include performing silylation on the surface of the...
US-9,508,544 Semiconductor device and method for manufacturing same
This semiconductor device (100) includes a substrate (10) and a TFT which is provided on the substrate. The TFT includes a gate electrode (12), an oxide...
US-9,508,543 Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory...
A thin film having a low dielectric constant and a high resistance to HF at a low temperature range is formed with high productivity. A film containing a...
US-9,508,542 Arrangement for the production of structured substrates
An arrangement for producing structured substrates is provided, which includes a device for applying layer systems including a device for applying liquid...
US-9,508,541 Apparatus and method for treating substrate
Provided is a substrate treatment apparatus. The substrate treatment apparatus includes a load port on which a carrier accommodating a plurality of substrates...
US-9,508,540 Method and apparatus useful for imaging
The present invention provides a method of generating ions from a sample, the method comprising the steps of (1) designating a plurality of sample target sites,...
US-9,508,539 Glow discharge mass spectrometry method and device
A glow discharge mass spectrometry device and method, the device including a glow discharge lamp (1), gas flow-injection elements, the glow discharge lamp being...
US-9,508,538 Ion transfer method and device
An ion transport device can include a plurality of pole rod pairs arranged in parallel, and a controller. The controller configured to can be configured to...
US-9,508,537 Photo-dissociation of proteins and peptides in a mass spectrometer
A method of mass spectrometry is disclosed comprising directing first photons from a laser onto ions located within a 2D or linear ion guide or ion trap. The...
US-9,508,536 Chemical sampling and detection methods and apparatus
This invention describes a sample collection and desorption device and method that collects residues of explosives and other chemicals from a surface and then...
US-9,508,535 Ion-mobility spectrometer including a decelerating ion gate
An ion mobility spectrometer having an ion source for generating ions; an ion detector for recording ions, and a number of substantially flat diaphragm...
US-9,508,534 Systems and methods for calibrating gain in an electron multiplier
Method for operating a mass spectrometer includes supplying a quantity of ions to an ion detector. The ion detector can include a conversion dynode operating in...
US-9,508,533 Thermionic converter and manufacturing method of electrode of thermionic converter
In a method of manufacturing an electrode of a thermionic converter, a carbide layer is formed on a base material by a vapor synthesis, an N-type diamond layer...
US-9,508,532 Magnetron plasma apparatus
A magnetron plasma apparatus boosted by hollow cathode plasma includes at least one electrically connected pair of a first hollow cathode plate and a second...
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