At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.
Semiconductor structure and method for forming the same
Various embodiments provide semiconductor structures and methods for forming the same. In an exemplary method, a semiconductor substrate is provided. A first...
Layout of static random access memory cell
A static random access memory (SRAM) cell is defined by first and second boundaries disposed opposite to each other and third and fourth boundaries disposed...
Semiconductor integrated circuit device
In an image information chip or the like, a multi-port SRAM is embedded with a logic circuit. When the 3 port is used, the 1 port may serve as a differential...
Method for fabricating ferroelectric random-access memory on pre-patterned
bottom electrode and oxidation barrier
Structure and method of fabrication of F-RAM cells are described. The F-RAM cell include ferroelectric capacitors forming over and with a pre-patterned barrier...
3-D non-volatile memory device and method of manufacturing the same
A three-dimensional (3-D) non-volatile memory device includes a plurality of word line structures extended in parallel and including a plurality of interlayer...
III-V semiconductor CMOS FinFET device
A method for forming a semiconductor device comprises forming an insulator layer on a semiconductor substrate, removing portions of the insulator layer to form...
FinFET structure and method for manufacturing thereof
Present disclosure provides a FinFET structure, including a plurality of fins, a gate, and a first dopant layer. The gate is disposed substantially orthogonal...
Asymmetric source/drain depths
A semiconductor device includes a substrate having a first region and a second region, an n-type transistor in the first region, the n-type transistor...
Replacement metal gate
A semiconductor structure which includes: a fin on a semiconductor substrate; and a gate structure wrapped around the fin. The gate structure includes: spaced...
A semiconductor die includes a substrate and an insulation layer over the substrate. The semiconductor die also includes a plurality of P-metal gate areas...
Monolithic integration of GaN and InP components
A compound semiconductor integrated circuit comprising a first substrate; a first electronic component formed on top of said first substrate; a layer of a first...
Semiconductor device having switching element and free wheel diode and
method for controlling the same
A semiconductor device includes a switching element having: a drift layer; a base region; an element-side first impurity region in the base region; an...
Semiconductor device having an insulated gate bipolar transistor
arrangement and a method for forming such a...
A semiconductor device includes an insulated gate bipolar transistor (IGBT) arrangement. The IGBT arrangement includes a carrier confinement reduction region...
Driver circuit, method of manufacturing the driver circuit, and display
device including the driver circuit
Provided are a driver circuit which suppresses damage of a semiconductor element due to ESD in a manufacturing process, a method of manufacturing the driver...
Static electricity protection circuit, electro-optic device and electronic
In a static electricity protection circuit according to the invention, a first wiring is electrically connected to a drain of a first p-type transistor and a...
Compound semiconductor device and manufacturing method of the same
An electrode (109) insulated from a compound semiconductor layer (102) and being in contact with an electrode (101) and a compound semiconductor layer (103) is...
Electronic devices and methods having a compact multi-way transformer
Apparatus having structures implementing compact and symmetric multi-way transformer combiners are described herein. In an embodiment, each unit device cell of...
Semiconductor module and semiconductor device
A semiconductor module includes first and second semiconductor elements connected in series, an insulating substrate, first and second metal patterns formed on...
Multi-chip semiconductor power device
A semiconductor device includes a first semiconductor power chip mounted over a first carrier and a second semiconductor power chip mounted over a second...
Proximity sensor having light-blocking structure in leadframe and method
of making same
A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is...
Light emitting device package and light unit including the same
Disclosed are a light emitting device package. The light emitting device package includes a body having recess; a first lead frame including a first and second...
Semiconductor package and method of manufacturing the semiconductor
A semiconductor package includes: a package base substrate; at least one first semiconductor chip disposed on the package base substrate; a first molding member...
Solid state lighting device including narrow spectrum emitter
A multi-emitter solid state lighting device includes at least one narrow spectral output solid state light emitter, such as may be in the green range, having a...
Light emitting devices including multiple anodes and cathodes
Solid state (e.g., LED) lighting devices include multiple emitters mounted on or over a substrate comprising insulating material with conductive traces thereon,...
Semiconductor device and stacked semiconductor package having the same
A semiconductor device includes a plurality of semiconductor chips connected through a scribe lane; a plurality of through electrodes formed in each of the...
Microelectronic packaging without wirebonds to package substrate having
terminals with signal assignments that...
A microelectronic assembly can include a circuit panel having first and second panel contacts at respective first and second surfaces thereof, and first and...
Semiconductor package including a step type substrate
Disclosed herein are semiconductor packages. A semiconductor package may include a substrate configured to include a first face and a second face opposite the...
Metal to metal bonding for stacked (3D) integrated circuits
The present invention provides a stabilized fine textured metal microstructure that constitutes a durable activated surface usable for bonding a 3D stacked...
Electronic apparatus having a resin filled through electrode configured to
go through first and second...
A first semiconductor component and a second semiconductor component are attached together via an adhesion layer so that the first semiconductor component and...
Flexibly-wrapped integrated circuit die
Embodiments of a flexibly-wrapped integrated circuit die device and a method for mounting a flexibly-wrapped integrated circuit die to a substrate are...
Method for fabricating an interposer
A method for fabricating an interposer is provided, which includes the steps of: providing a substrate body having a chip mounting side and an opposite external...
High performance package and process for making
A method for manufacturing circuit component package is disclosed. The method first forms copper circuits on a single-sided printed circuit board, and prints an...
Stacked microfeature devices and associated methods
Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second...
Method and apparatus for inspecting a semiconductor chip prior to bonding
A chip handling apparatus, unit and method is presented. The chip handling apparatus comprises a chip supply station; a chip mounting station; and one or more...
Electronic device, method of manufacturing the same, metal particle, and
Provided is an electronic device which includes a conductor allowing an electric signal to transmit therethrough, the conductor containing a plurality of...
Semiconductor device including a buffer layer structure for reducing
A semiconductor device includes a semiconductor chip, wiring that is included in the semiconductor chip and has a coupling part between parts with different...
Anisotropic conductive film, connection structure and method of producing
An anisotropic conductive film is obtained by dispersing conductive particles in an insulating adhesive composition including a (meth)acrylate-based monomer...
Method for bonding a chip to a substrate
A method is provided for bonding a chip to a substrate, the method comprising the steps of providing a chip, providing a substrate, providing a recess in one of...
Package structure and fabrication method thereof
A method for fabricating a package structure is provided, including the steps of: sequentially forming a metal layer and a dielectric layer on a first carrier,...
Substrate structure with first and second conductive bumps having
A substrate structure is provided, which includes a substrate body having a plurality of conductive pads, and a plurality of first conductive bumps and a...
Electrical connection for chip scale packaging
A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger...
Semiconductor device having through silicon vias and manufacturing method
In The semiconductor device, a semiconductor substrate has first and second surfaces. A circuitry layer is formed over the first surface and a first insulating...
Methods and apparatus for solder connections
Methods and apparatus for solder connections. An apparatus includes a substrate having a conductive terminal on a surface; a passivation layer overlying the...
Three-dimensional integrated circuit integration
Wiring structures, methods for providing a wiring structure, and methods for distributing currents with a wiring structure from one or more through-substrate...
Bond pad having a trench and method for forming
A conductive structure is formed in a last metal layer of an integrated circuit. Passivation material is patterned over a portion of the conductive structure. A...
Monolithic microwave integrated circuit
A monolithic microwave integrated circuit included a substrate, a first pad, a first line, a second line, a second pad, a third pad, a first active element, a...
A high-frequency package comprises a ground lead, connected to a die, occupying a side of the high-frequency package, wherein a slot is formed within the ground...
Mitigation of far-end crosstalk induced by routing and out-of-plane
In accordance with one aspect of the present description, a transmission line such as a microstrip or stripline transmission line, has stub-shaped projections...
X-ray obscuration film and related techniques
An X-ray obscuration (XRO) film comprising one or more metallic wire mesh layers and an adjacent layer of indium foil having portions which extend into openings...
Radio frequency module including segmented conductive top layer
A radio frequency (RF) module comprises a conductive top layer configured to improve RF interference-shielding functionality with respect to one or more RF...