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Light source unit and backlight assembly having the same
A method of protecting an LED chip from damage by ESD and EMI when the LED chip is housed in a light-emitting diode(s) housing package (LED package) and the LED...
Package structure and method for forming same
A device comprises a bottom package comprising an interconnect structure, a molding compound layer over the interconnect structure, a semiconductor die in the...
A light-emitting device, having an overall color temperature when emitting light, includes a carrier, a first LED unit, and a second LED unit. The carrier has a...
Light emitting device package and lighting system
Disclosed is a light emitting device package and a lighting system. The light emitting device package includes a body, a first lead frame on the body, a...
Retrofit LED lamp with warm-white, more particularly flame-like white
The invention relates to an LED lamp for warm white light having an LED module consisting of at least one color-converted blue or UV LED, and at least one...
Semiconductor device for use in flip-chip bonding, which reduces lateral
A semiconductor device includes multilayer chips in which a first semiconductor chip and a second semiconductor chip are bonded together. A first electrode pad...
Wafer process for molded chip scale package (MCSP) with thick backside
A wafer process for molded chip scale package (MCSP) comprises: depositing metal bumps on bonding pads of chips on a wafer; forming a first packaging layer at a...
Method of forming bump structure having a side recess and semiconductor
structure including the same
In some embodiments, the present invention relates to a method of integrated chip bonding. The method forms a conductive trace on a surface of a first work...
Thermal matched composite die
A thermal matched composite material, suitable for use as a die is described. In one example, the material includes a metal plate and a substrate having a...
Semiconductor device package including bonding layer having Ag.sub.3Sn
Semiconductor device packages and methods of manufacturing the semiconductor device packages are provided. A semiconductor device package may include a bonding...
Bumpless build-up layer package including an integrated heat spreader
An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die...
Method of forming a solder bump on a substrate
A method of forming a solder bump on a substrate includes: forming a conductive layer(s) on the substrate having a surface on which an electrode pad is...
Semiconductor device, substrate and semiconductor device manufacturing
The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor...
Provided is a semiconductor package including a semiconductor chip having one surface on which chip pads are formed, and a redistribution structure formed on...
Wafer level package (WLP) and method for forming the same
A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a substrate and a conductive pad...
Planar passivation for pads
Devices and methods for forming a device are presented. The method includes providing a substrate having circuit component and a dielectric layer over the...
Methods of forming semiconductor device assemblies and interconnect
structures, and related semiconductor...
A method of forming a semiconductor device assembly comprises forming on a first substrate, at least one bond pad comprising a first nickel material over the...
Power module and method of packaging the same
Provided are a power module having an integrated power semiconductor and a method of packaging the same. The power module according to an aspect of the present...
Integrated circuit system having stripline structure
An integrated circuit system having: (A) a semiconductor chip with a signal strip conductor disposed on an upper surface of the chip; an active semiconductor...
Trenched Faraday shielding
A device includes a semiconductor substrate having a surface with a trench, first and second conduction terminals supported by the semiconductor substrate, a...
Chip comprising a phase change material based protecting device and a
method of manufacturing the same
An electronic chip including an integrated circuit arranged a face of a substrate, and a protection device arranged partially facing the integrated circuit is...
Semiconductor device and method for forming semiconductor package having
build-up interconnect structure over...
A semiconductor device has a semiconductor die and encapsulant deposited over the semiconductor die. A first insulating layer is formed over the die and...
Front side package-level serialization for packages comprising unique
A method of making a semiconductor device can include providing a plurality of semiconductor die, wherein each semiconductor die comprises an active surface and...
Forming CMOSFET structures with different contact liners
A method of making a semiconductor device includes forming a first trench contact over a first source/drain region of a first transistor; forming a second...
Semiconductor device having interconnect layer that includes dielectric
segments interleaved with metal components
The present disclosure provides a method of fabricating a semiconductor device. The method includes forming a patterned dielectric layer having a plurality of...
Semiconductor devices are provided. A semiconductor device includes a substrate, a first conductive structure on the substrate, and a second conductive...
Angled ion beam processing of heterogeneous structure
A method for fabricating a multilayer structure includes providing a mask on a device stack disposed on the substrate, the device stack comprising a first...
Semiconductor device, display driver integrated circuit including the
device, and display device including the...
A semiconductor device, which may be included in a display driver integrated circuit (IC) and a display device, includes a first interconnection and a second...
Via structure for optimizing signal porosity
An apparatus including a conductive stack structure includes an M.sub.x layer interconnect on an M.sub.x layer and extending in a first direction on a first...
Anti-fuse structure and method for manufacturing the same
A method for manufacturing a semiconductor device includes forming a fin extending between first and second pads on a substrate, removing a central portion of...
Circuit with reduced noise and controlled frequency
A die is packaged by flip-chip mounting the die with the active side facing a low loss substrate. A ground plane is coupled to the active side of the die by...
Voltage and temperature independent MIM capacitors
MIM capacitors that are temperature and/or voltage independent, and a methodology for formulating the MIM capacitors for use in semiconductor integrated...
Silicon designs for high voltage isolation
An isolation system, isolation capacitor, and Integrated Circuit are disclosed. The isolation capacitor is described to include a first capacitive element, a...
A metal-insulation-metal (MIM) device including a first metal layer, a first insulation layer, a second metal layer, and a second insulation layer is provided....
Wiring board and semiconductor device
A wiring board includes a first wiring layer, a first insulating layer, first via wirings, connection terminals and a protection layer. The first insulating...
Packaging substrate and package structure
A packaging substrate and a package structure are provided. The packaging substrate includes a plurality of dielectric layers, two of which have a difference in...
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin
Bumpless build-up layer (BBUL) semiconductor packages with ultra-thin dielectric layers are described. For example, an apparatus includes a semiconductor die...
A semiconductor package is provided. In one configuration, the semiconductor package includes a substrate. A conductive trace is disposed on the substrate. A...
Semiconductor devices and methods of manufacturing the same
A semiconductor device includes a pair of line patterns disposed on a substrate. A contact plug is disposed between the pair of line patterns and an air gap is...
Lead frame construct for lead-free solder connections
An electronics packaging arrangement, a lead frame construct for use in an electronics packaging arrangement, and a method for manufacturing an electronics...
Power semiconductor module and method for manufacturing the same
The present invention relates to a power semiconductor module in which heat from the semiconductor chip is radiated not only through the buffer, but also...
Semiconductor module, semiconductor device having semiconductor module,
and method of manufacturing...
A semiconductor module is configured such that heat radiation substrates are connected to lead frames and semiconductor chips are directly connected to the lead...
Semiconductor module for electric power
Included are: the third frame which is electrically connected to the first intermediate frame and is arranged above the first frame; the fourth frame which is...
Field-effect transistor structure for preventing from shorting
A field-effect transistor (FET) structure for preventing from shorting is disclosed. The field-effect transistor (FET) structure is applying to a power discrete...
Power management applications of interconnect substrates
Various applications of interconnect substrates in power management systems are described.
Semiconductor package with conductive clips
One exemplary disclosed embodiment comprises a high power semiconductor package configured as a buck converter having a control transistor and a sync transistor...
Semiconductor die connection system and method
A system and method for connecting semiconductor dies is provided. An embodiment comprises connecting a first semiconductor die with a first width to a second...
Semiconductor device and method of manufacturing the same
According to one embodiment, a semiconductor device includes a semiconductor substrate having a first surface and a second surface, and having a LSI on the...
Transistor, heat sink structure thereof and method for manufacturing same
A transistor is provided, which includes: a semiconductor growth substrate and a semiconductor thermoelectric effect device, wherein the semiconductor...
A semiconductor module includes first and second semiconductor elements connected to pins, respectively; a first pin wiring substrate having first and second...