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Patent # Description
US-9,537,078 Manufacturing process of the thermoelectric conversion element
A manufacturing process of the thermoelectric conversion element is provided, wherein the system using semiconductor process technology to the construction of...
US-9,537,077 Method for production of high figure of merit thermoelectric materials
A thermoelectric device and method based on creating a structure of nanoclusters in a composite metal and insulator material by co-depositing the metal and...
US-9,537,076 Thermoelectric conversion module
A thermoelectric conversion module has a substrate, a plurality of first electrodes, a plurality of thermoelectric conversion elements 2, a plurality of second...
US-9,537,075 Graphite structure, electronic component and method of manufacturing electronic component
The graphite structure includes a plurality of domains of graphite where a layer body of graphene sheets is curved in domelike, wherein the plurality of domains...
US-9,537,074 High heat-radiant optical device substrate
An optical device substrate includes metal plates and insulating layers formed between the metal plates. Each insulating layer includes a cured insulating layer...
US-9,537,073 Method for fabricating a light emitting diode (LED) die having strap layer
A method for fabricating a light emitting diode (LED) die includes the steps of forming an epitaxial stack on a substrate having an n-type semiconductor layer,...
US-9,537,072 Light emitting device, lead frame and resin cavity molding package
Pkg resin crack is suppressed after dicing. A light emitting device 1 where a light emitting device 2 that emits light is mounted on a lead frame 3 and that...
US-9,537,071 Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device,...
A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength...
US-9,537,070 Optoelectronic component with a wireless contacting
An optoelectronic component contains a semiconductor chip (1) and a carrier body (10), which are provided with a transparent, electrically insulating...
US-9,537,069 Inorganic light-emitting diode with encapsulating reflector
An inorganic light-emitting diode structure includes a transparent substrate and an inorganic semiconductor having a conduction layer and a light-emitting layer...
US-9,537,068 Light emitting device package
A light emitting device package includes a substrate, a light emitting device disposed on the substrate, a reflector surrounding the light emitting device, and...
US-9,537,067 Radiation emitting device
An embodiment of the present invention relates to a radiation emitting device comprising: a radiation emitter for generating radiation; a waveguide; a lens...
US-9,537,066 Method of manufacturing semiconductor light emitting device, and semiconductor light emitting device
When an uneven pattern is formed on a light extraction surface composed of a semiconductor crystal by wet-etching using an alkaline solution, a plurality of...
US-9,537,065 Light-emitting device with reflective resin
Improves light extraction efficiency. A light emitting device 1 using a white resin molding package 5 integrally molded with lead frames 3, 4 constituting an...
US-9,537,064 Method for the production of a wavelength conversion element, wavelength conversion element, and component...
Disclosed is a method for producing a wavelength conversion element (10) wherein a wavelength conversion layer (100) is provided, the surface thereof is treated...
US-9,537,063 Method for producing an optoelectronic component
A method for producing a plurality of optoelectronic components (100) comprises the steps: providing a semiconductor body (101) that is arranged on a carrier...
US-9,537,062 Solid state light emitter package, a light emission device, a flexible LED strip and a luminaire
A solid state light emitter package (200), a light emitting device, a flexible LED strip and a luminaire are provided. The solid state light emitter package...
US-9,537,061 Phosphor compositions and lighting apparatus thereof
A phosphor composition is disclosed. A phosphor composition, comprises at least 10 atomic % bromine; silicon, germanium or combination thereof; oxygen; a metal...
US-9,537,060 Semiconductor light emitting device package
A semiconductor light emitting device package includes: a light emitting device; a wavelength conversion unit formed in a path of light emitted from the light...
US-9,537,059 Light source with quantum dots
The invention provides a luminescent nano particles based luminescent material comprising a matrix of interconnected coated luminescent nano particles, wherein...
US-9,537,058 Embedded white light LED package structure based on solid-state fluorescence material and manufacturing method...
The present invention discloses an embedded white light LED package structure based on a solid-state fluorescence material. In the present invention, the high...
US-9,537,057 Surface-mounted light-emitting device and fabrication method thereof
A surface-mounted light-emitting device includes: a LED epitaxial structure having two opposite surfaces, wherein the first surface is a light-emitting surface;...
US-9,537,056 Light emitting device
Provided is a light emitting device. In one embodiment, a light emitting device including: a support member; a light emitting structure on the support member,...
US-9,537,055 Semiconductor light emitting diode package and lighting device using the same
A semiconductor LED package includes a package body having first and second electrode structures and an LED chip connected to at least one of the first and...
US-9,537,054 Semiconductor heterostructure with stress management
A heterostructure for use in fabricating an optoelectronic device is provided. The heterostructure includes a layer, such as an n-type contact or cladding...
US-9,537,053 III nitride semiconductor device and method of manufacturing the same
Provided is a high quality III nitride semiconductor device in which, not only X-shaped cracks extending from the vicinity of the corners of semiconductor...
US-9,537,052 Coated phosphors and light emitting devices including the same
Provided according to embodiments of the invention are method of coating a phosphor that include contacting the phosphor with a sol comprising at least one of...
US-9,537,051 Nanostructure semiconductor light emitting device
A nanostructure semiconductor light emitting device may include a base layer having first and second regions and formed of a first conductivity-type...
US-9,537,050 Optoelectronic device and method for manufacturing same
The invention relates to an optoelectronic device and to the method for manufacturing same. The optoelectronic device (45), according to the invention includes,...
US-9,537,049 Nanostructure semiconductor light emitting device
There is provided a nanostructure semiconductor light emitting device may including: a base layer formed of a first conductivity-type semiconductor, an...
US-9,537,048 Vertical type AC-LED device and manufacturing method thereof
The present invention discloses a vertical AC LED element and fabrication method thereof, wherein the vertical AC LED element comprises a conductive substrate...
US-9,537,047 Phosphor in inorganic binder for LED applications
A method for fabricating an LED/phosphor structure is described where an array of blue light emitting diode (LED) dies are mounted on a submount wafer. A...
US-9,537,046 Optical device wafer processing method
In an optical device wafer processing method, a light emitting layer on the front side of a wafer is removed by applying a pulsed laser beam to the wafer along...
US-9,537,045 Semiconductor device and method of fabricating the same
A method of fabricating a semiconductor device includes forming an insulation pattern including a mask region and an open region on a gallium nitride substrate,...
US-9,537,044 Optoelectric device and method for manufacturing the same
A method for manufacturing an optoelectric device comprising a semiconductor substrate, pads on a surface of the substrate; semiconductor elements, each element...
US-9,537,043 Photoelectric conversion device and manufacturing method thereof
It is an object to reduce the region of a photoelectric conversion element which light does not reach, to suppress deterioration of power generation efficiency,...
US-9,537,042 Non-ablative laser patterning
A method for processing a transparent substrate includes generating at least one laser pulse having laser parameters selected for non-ablatively changing a...
US-9,537,041 Emitters of a backside contact solar cell
A system and method of patterning dopants of opposite polarity to form a solar cell is described. Two dopant films are deposited on a substrate. A laser is used...
US-9,537,040 Complementary metal-oxide-semiconductor image sensor and manufacturing method thereof
A method for manufacturing semiconductor devices includes following steps. A substrate having a pixel region and a periphery region defined thereon is provided,...
US-9,537,039 Photovoltaic devices including MG-doped semiconductor films
A photovoltaic cell can include a dopant in contact with a semiconductor layer. The photovoltaic cell can include a transparent conductive layer and a first...
US-9,537,038 Solar cell made using a barrier layer between P-type and intrinsic layers
A method for forming a photovoltaic device includes depositing a p-type layer on a substrate. A barrier layer is formed on the p-type layer by exposing the...
US-9,537,037 Wet etching method for an N-type bifacial cell
A wet etching method for an N-type bifacial cell including: (1) providing an N-type silicon wafer, proceeding with surface structuralization on the N-type...
US-9,537,036 Interconnect for an optoelectronic device
Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner...
US-9,537,035 Back-face protection sheet for solar cell module, and solar cell module using same
A back-face protection sheet for a solar cell module exhibits excellent adhesion strength and tensile strength even under a high-temperature and high-humidity...
US-9,537,034 Process for the production of a solar module
The invention is to facilitate the attachment of an installation system in the production of a solar module. This is achieved via a process which comprises the...
US-9,537,033 Interface system and method for photovoltaic cladding to standard cladding
The present invention is premised upon a system and method for an improved photovoltaic cladding device array with an interface member (500) for use on a...
US-9,537,032 Low-cost high-efficiency solar module using epitaxial Si thin-film absorber and double-sided heterojunction...
One embodiment of the present invention provides a double-sided heterojunction solar cell module. The solar cell includes a frontside glass cover, a backside...
US-9,537,031 Nozzle assembly and method for fabricating a solar cell
A method for fabricating a solar cell using a nozzle assembly that includes a base portion, a scriber coupled to the base portion, and a nozzle coupled to the...
US-9,537,030 Method of fabricating a solar cell with a tunnel dielectric layer
Methods of fabricating solar cells with tunnel dielectric layers are described. Solar cells with tunnel dielectric layers are also described.
US-9,537,029 Semiconductor device with an epitaxial layer and method of fabricating the same
A semiconductor device includes a first semiconductor layer including a recess region and protrusions defined by the recessed region, first insulating patterns...
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