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Heavily doped semiconductor nanoparticles
Herein, provided are heavily doped colloidal semiconductor nanocrystals and a process for introducing an impurity to semiconductor nanoparticles, providing...
A semiconductor device includes a substrate, an elastic buffer layer disposed on a surface of the substrate, wiring patterns disposed on a first surface of the...
High-speed high-power semiconductor devices
High-speed high-power semiconductor devices are disclosed. In an exemplary design, a high-speed high-power semiconductor device includes a source, a drain to...
FinFET with improved SEU performance
Illustratively, a finFET comprises at least one fin, and typically several fins, with a trapping region in or on a substrate at the base of each fin to trap...
Semiconductor structure and manufacturing method of the same
Present disclosure provides a semiconductor structure, including a substrate having a center portion and an edge portion, an isolation layer over the substrate;...
Multi-directional trenching of a die in manufacturing superjunction
A method of manufacturing a superjunction device includes providing a semiconductor wafer having at least one die. At least one first trench having a first...
Semiconductor device with peripheral breakdown protection
A device includes a semiconductor substrate, source and drain regions disposed in the semiconductor substrate and having a first conductivity type, a body...
Semiconductor devices and fabrication methods thereof
Semiconductor devices and fabrication methods thereof are provided. The semiconductor devices include: a substrate, the substrate including a p-type well...
A semiconductor device comprising a substrate is disclosed. The substrate comprises: a well of type one; a first doped region of type two, provided in the well...
Semiconductor device and method for manufacturing the same
According to one embodiment, a semiconductor device includes a semiconductor layer including Ge; and a metal Ge compound region provided in a surface portion of...
MIM/RRAM structure with improved capacitance and reduced leakage current
Some embodiments of the present disclosure provide an integrated circuit (IC) device including a metal-insulator-metal (MIM) capacitor structure. The MIM...
Low temperature coefficient resistor in CMOS flow
A method for adding a low TCR resistor to a baseline CMOS manufacturing flow. A method of forming a low TCR resistor in a CMOS manufacturing flow. A method of...
Semiconductor structure and manufacturing method thereof
A semiconductor structure includes a three dimensional stack including a first semiconductor die and a second semiconductor die. The second semiconductor die is...
Organic light emitting diode display
An organic light emitting diode (OLED) display including a substrate main body; a driving circuit on the substrate main body; an organic light emitting element...
Transparent display device having a minimized bezel
A transparent organic light-emitting display device is described herein. The transparent substrate includes a display area and non-display area adjacent to the...
Silicon and semiconducting oxide thin-film transistor displays
An electronic device display may have an array of pixel circuits. Each pixel circuit may include an organic light-emitting diode and a drive transistor. Each...
A display device includes a plurality of pixels each including a light emitting region; and a light blocking layer provided on a side of the plurality of pixels...
OLED array substrate having black matrix, manufacturing method and display
An OLED array substrate and a manufacturing method thereof, and a display device provided with the OLED array substrate are disclosed. The OLED array substrate...
Organic light emitting display devices
An organic light emitting display device may have a pixel region and a transparent region, and may include a substrate, at least one semiconductor device...
Display panel and display apparatus having the same
The embodiments of the present invention provide a display panel and a display apparatus having the display panel. The display panel includes: an array...
The present invention provides a touch panel, including a lower substrate, an organic light-emitting component, disposed on the lower substrate, a nano silver...
Electronic devices having displays with openings
An electronic device may have a display. The display may have an active region in which display pixels are used to display images. The display may have one or...
Organic light emitting diode display device
A display device includes a first pixel and a second pixel. The second pixel is controlled to emit light in a predetermined range in a first time period and to...
Protective layer(s) in organic image sensors
The present disclosure relates to an organic image sensor and an associated method. By inserting an inorganic protective layer between an electrode and an...
Organic photoelectronic device including a PN junction and image sensor
An organic photoelectronic device includes a first electrode and a second electrode facing each other, and an active layer between the first electrode and the...
Tailorable flexible sheet of monolithically fabricated array of separable
cells each comprising a wholly...
A flexible sheet of organic polymer material, may include a monolithically fabricated array of one or more types of cells juxtaposed among them to form a...
Switching device having a non-linear element
A switching device includes a substrate; a first electrode formed over the substrate; a second electrode formed over the first electrode; a switching medium...
Electronic device and method for fabricating the same
This technology provides an electronic device and a method of fabricating the same. An electronic device in accordance with an implementation of this document...
Magnetoresistive random access memory devices and methods of manufacturing
An MRAM device comprises an insulating interlayer comprising a flat first upper surface on a first region and a second region of a substrate. A pattern...
Pixel sensor cell including light shield
CMOS image sensor pixel sensor cells, methods for fabricating the pixel sensor cells and design structures for fabricating the pixel sensor cells are designed...
Dark current reduction for back side illuminated image sensor
A method of fabricating a semiconductor image sensor device is disclosed. A plurality of radiation-sensing regions is formed in a substrate. The ...
Optoelectronic modules that have shielding to reduce light leakage or
stray light, and fabrication methods for...
Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover....
Formation of buried color filters in a back side illuminated image sensor
with an ONO-like structure
A semiconductor image sensor includes a substrate having a first side and a second side that is opposite the first side. An interconnect structure is disposed...
CMOS image sensor with embedded micro-lenses
A backside illuminated CMOS image sensor and a manufacturing method thereof are provided. Embedded micro-lenses disposed respectively on concave surfaces of a...
Image sensor, imaging apparatus, and imaging method
There is provided an image sensor including a normal pixel group composed of a plurality of normal pixels, each of the normal pixels having a photoelectric...
Solid-state imaging device and camera including discrete trench isolation
A solid-state imaging device including is provided. The solid-state imaging device includes: pixels arrayed; a photoelectric conversion element in each of the...
CMOS image sensors having a transfer gate electrode, and methods of
fabricating CMOS image sensors having a...
Complementary metal-oxide-semiconductor (CMOS) image sensors are provided. A CMOS image sensor includes a substrate including a pixel array and a peripheral...
Backlight image sensor chip having improved chip driving performance
The present invention relates to a backlight image sensor chip having improved chip driving performance, in which a region other than a pad region, on which a...
Stress released image sensor package structure and method
A sensor package that includes a substrate with opposing first and second surfaces. A plurality of photo detectors are formed on or under the first surface and...
Imaging element and imaging device
An imaging element according to the present disclosure includes: a first pixel and a second pixel each including a light receiving section and a light...
Method for manufacturing solid-state imaging element, solid-state imaging
element, method for manufacturing...
Disclosed herein is a method for manufacturing a solid-state imaging element, the method including forming lenses that are each provided corresponding to a...
An imaging apparatus includes a light emitting element layer, an optically transmissive first substrate and a light receiving element. The light emitting...
Mechanisms for forming image sensor device
Embodiments of mechanisms for forming an image sensor device are provided. The image sensor device includes a semiconductor substrate and a photodetector in the...
Solid-state imaging device
A plurality of first pixels P1 corresponding to color filters of two or more colors constitute a pixel group. A plurality of the pixel groups are arranged so...
Solid-state imaging device and electronic apparatus
A solid-state imaging device includes a layout in which one sharing unit includes an array of photodiodes of 2 pixels by 4.times.n pixels (where, n is a...
Photoelectric conversion device and method of manufacturing photoelectric
A photoelectric conversion device includes a pixel including a transfer transistor transferring signal charges generated in a photoelectric conversion portion...
Array substrate and method of fabricating the same
An array substrate includes an oxide semiconductor layer; an etch stopper including a first contact hole exposing each of both sides of the oxide semiconductor...
Array substrate, method for manufacturing the same, and display device
The present invention provides a method for manufacturing an array substrate comprising: sequentially forming an adhesion enhancement layer, a copper-bearing...
Semiconductor device and manufacturing method thereof, delamination
method, and transferring method
A substrate and a delamination film are separated by a physical means, or a mechanical means in a state where a metal film formed over a substrate, and a...
Thin film transistor array panel
A thin-film transistor array panel includes a substrate, a first gate electrode disposed on the substrate, a first self-assembled monolayer disposed on the...