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Patent # Description
US-9,558,978 Material handling with dedicated automated material handling system
An apparatus includes a dedicated material handling module having a dedicated automated material handling system (AMHS) defines a transport route between a...
US-9,558,977 Transport device with rotating receiving part
A transport device simultaneously transports a plurality of articles with a simple device configuration. The transport device includes a chucking device that...
US-9,558,976 Substrate processing apparatus, method of transferring substrate, method of manufacturing semiconductor device,...
A substrate processing apparatus includes a substrate retaining mechanism into which retaining members on which substrates are placed are installed to retain...
US-9,558,975 System and method for transferring articles between vacuum and non-vacuum environments
A system for transferring articles between an atmospheric pressure environment and a vacuum pressure environment. The system may include a vacuum enclosure...
US-9,558,974 Semiconductor processing station and method for processing semiconductor wafer
A semiconductor processing station is provided. The semiconductor processing station includes a first platform, a second platform and a vacuum tunnel, wherein...
US-9,558,973 Laser annealing systems and methods with ultra-short dwell times
Laser annealing systems and methods for annealing a semiconductor wafer with ultra-short dwell times are disclosed. The laser annealing systems can include one...
US-9,558,972 Liquid treatment apparatus including return path and switching mechanism
In one embodiment, a clean gas supply mechanism includes a supply path having an upstream end provided with a gas intake port, and a downstream end connected to...
US-9,558,971 Substrate holding apparatus and substrate cleaning apparatus
A substrate holding apparatus capable of reducing an amount of deflection of a substrate, such as a wafer, is disclosed. The substrate holding apparatus...
US-9,558,970 Device and method for drying separated electronic components
The invention relates to a device for at least partially drying separated electronic components comprising: a carrier for the electronic components; a...
US-9,558,969 Method and device for pumping of a process chamber
A pumping device intended to be connected to a process chamber (2) includes a dry primary vacuum pump, an auxiliary pump mounted so that the auxiliary pump...
US-9,558,968 Single or multi chip module package and related methods
A method of forming a semiconductor device package. Implementations may include providing an adhesive tape; contacting at least one electrical contact of at...
US-9,558,967 Method of manufacturing semiconductor device
An improvement is achieved in the reliability of a semiconductor device by preventing a dielectric breakdown between two semiconductor chips facing each other....
US-9,558,966 Semiconductor device packages, packaging methods, and packaged semiconductor devices
Semiconductor device packages, packaging methods, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device...
US-9,558,965 Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint
A semiconductor wafer has a plurality of first semiconductor die. A second semiconductor die is mounted to the first semiconductor die. The active surface of...
US-9,558,964 Method of fabricating low CTE interposer without TSV structure
A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are...
US-9,558,963 Plasma reactor with conductive member in reaction chamber for shielding substrate from undesirable irradiation
Placing a conductive member between a plasma chamber in a remote plasma reactor and a substrate to shield the substrate from irradiation of undesirable...
US-9,558,962 Substrate processing method
A method for passivating a surface of a semiconductor substrate with fluorine-based layer to protect the surface against oxidation and allow longer queue times....
US-9,558,961 Manufacturing method of semiconductor device
In accordance with an embodiment, a manufacturing method of a semiconductor device includes: respectively forming a first layer and a second layer at the top of...
US-9,558,960 Substrate processing method, non-transitory storage medium and heating apparatus
A substrate processing method includes a coating step that applies a coating liquid to a substrate having a front surface on which a pattern is formed, thereby...
US-9,558,959 Polishing compositions and methods for selectively polishing silicon nitride over silicon oxide films
Stable aqueous polishing compositions that can selectively polish silicon nitride (SiN) films and nearly stop (or polish at very low rates) on silicon oxide...
US-9,558,958 Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge...
A semiconductor wafer contains a plurality of semiconductor die separated by a saw street. An insulating layer is formed over the semiconductor wafer. A...
US-9,558,957 Method for manufacturing a substrate provided with different active areas and with planar and three-dimensional...
A substrate is successively provided with a support (7), an electrically insulating layer (8), and a semi-conductor material layer (2). A first protective mask...
US-9,558,956 Method for fabricating semiconductor device
A method for fabricating a semiconductor device is provided, which includes forming a first mask pattern and a second mask pattern on a first layer, forming a...
US-9,558,955 Formation method of semiconductor device that includes performing hydrogen-containing plasma treatment on metal...
A method for forming a semiconductor device structure is provided. The method includes forming a metal gate stack over a semiconductor substrate. The method...
US-9,558,954 Selective wet etching and textured surface planarization processes
The present invention relates to systems and methods associated with selective wet etching and textured surface planarization. The systems and methods described...
US-9,558,953 Etching method, and method of producing semiconductor substrate product and semiconductor device using the same
An etching method, having the step of applying an etching liquid onto a TiN-containing layer in a semiconductor substrate thereby etching the TiN-containing...
US-9,558,952 Alkaline pickling process
A process for edge isolation or texture smoothing of a substrate, in which a process medium which allows control treatment of limited regions of the substrate...
US-9,558,951 Trap rich layer with through-silicon-vias in semiconductor devices
An integrated circuit chip is formed with a circuit layer, a trap rich layer and through-semiconductor-vias. The trap rich layer is formed above the circuit...
US-9,558,950 Overhang hardmask to prevent parasitic epitaxial nodules at gate end during source drain epitaxy
A method of making a semiconductor device includes forming a gate covered by a hard mask over a substrate; disposing a mask over the gate and the hard mask;...
US-9,558,949 Vertical bit line non-volatile memory systems and methods of fabrication
Three-dimensional (3D) non-volatile memory arrays having a vertically-oriented thin film transistor (TFT) select device and methods of fabricating such a memory...
US-9,558,948 Laser thermal annealing of deep doped region using structured antireflective coating
A semiconductor body having a first surface is provided. A deep doped region of the semiconductor body is formed using masked ion implantation to implant dopant...
US-9,558,947 Pattern decomposition lithography techniques
Techniques are disclosed for realizing a two-dimensional target lithography feature/pattern by decomposing (splitting) it into multiple unidirectional target...
US-9,558,946 FinFETs and methods of forming FinFETs
An embodiment is a method including forming a fin on a substrate, forming a first doped region in a top portion of the fin, the first doped region having a...
US-9,558,945 Semiconductor memory device with electrode connecting to circuit chip through memory array chip
According to one embodiment, the array chip includes a three-dimensionally disposed plurality of memory cells and a memory-side interconnection layer connected...
US-9,558,944 System, method and reticle for improved pattern quality in extreme ultraviolet (EUV) lithography and method for...
A reticle for use in an extreme ultraviolet (euv) lithography tool includes a trench formed in the opaque border formed around the image field of the reticle....
US-9,558,943 Stress relaxed buffer layer on textured silicon surface
A method of forming a stress relaxed buffer layer (SRB) on a textured or grooved silicon (Si) surface and the resulting device are provided. Embodiments include...
US-9,558,942 High density nanowire array
A method of fabricating a nanowire array is disclosed. The method includes forming a mask layer over a substrate, wherein the mask layer includes a plurality of...
US-9,558,941 Method of forming oxide thin film and method of fabricating oxide thin film transistor using hydrogen peroxide
Provided are a method of forming an oxide thin film using hydrogen peroxide, and a method of fabricating an oxide thin film transistor using hydrogen peroxide....
US-9,558,940 Method and apparatus for forming silicon film
A method of forming a silicon film in grooves formed on a surface of an object to be processed, the method including forming a first silicon film containing...
US-9,558,939 Methods for making a semiconductor device including atomic layer structures using N.sub.2O as an oxygen source
A method for making a semiconductor device may include forming a plurality of spaced apart structures on a semiconductor substrate within a semiconductor...
US-9,558,938 Method of manufacturing nitride semiconductor template
A method of manufacturing a nitride semiconductor template that includes a base substrate of a sapphire substrate and a nitride semiconductor layer represented...
US-9,558,937 Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory...
A method of manufacturing a semiconductor device includes: (a) forming a first film containing a metal element on a substrate by performing a cycle a...
US-9,558,936 Semiconductor manufacturing apparatus and semiconductor manufacturing method
In one embodiment, a semiconductor manufacturing apparatus includes an accommodation module configured to accommodate a substrate. The apparatus further...
US-9,558,935 Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Embodiments of the present invention provide hydrogen-free dielectric films and methods of fabrication. A hydrogen-free precursor, such as ...
US-9,558,934 Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Embodiments of the present invention provide hydrogen-free dielectric films and methods of fabrication. A hydrogen-free precursor, such as ...
US-9,558,933 Method for forming a semiconductor device
A method for forming a semiconductor device includes carrying out an anodic oxidation of a surface region of a semiconductor substrate to form an oxide layer at...
US-9,558,932 Lateral wafer oxidation system with in-situ visual monitoring and method therefor
Wafer oxidation apparatus for selective oxidation of a semiconductor workpiece has an oxidation chamber. The oxidation chamber is heated by external infrared...
US-9,558,931 System and method for gas-phase sulfur passivation of a semiconductor surface
Improved methods and systems for passivating a surface of a high-mobility semiconductor and structures and devices formed using the methods are disclosed. The...
US-9,558,930 Mixed lithography approach for e-beam and optical exposure using HSQ
In one aspect, a method of forming a wiring layer on a wafer is provided which includes: depositing a HSQ layer onto the wafer; cross-linking a first portion(s)...
US-9,558,929 Polymer on graphene
A top-gated graphene field effect transistor can be fabricated by forming a layer of graphene on a substrate, and applying an electrochemical deposition process...
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