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Patent # Description
US-9,565,795 Receptacle assembly and module assembly
In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is...
US-9,565,794 Wireless power transmission system, power transmitting device, and power receiving device
This wireless power transmission system includes: a power transmitting antenna and a power receiving antenna arranged to face each other and not to be in...
US-9,565,793 Environmental sensitive electronic device package
An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, at least one...
US-9,565,792 Connection structure and inverter
Two opening through which a refrigerant runs are connected by a first connecting pipe and a second connecting pipe. One end of the first connecting pipe is...
US-9,565,791 Power conversion apparatus
Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and...
US-9,565,790 Data center thermal monitoring
A system includes a first computing component and a second computing component. A first measurement indicative of a temperature of a first computing component...
US-9,565,789 Determining regions of influence of fluid moving devices
A method for determining regions of influence of a plurality of fluid moving devices in an infrastructure is provided. In the method, a plurality of clusters...
US-9,565,788 Mobile data processing center
The present mobile processing data center comprises a support structure, which consisting in ISO standard containers of 10, 20, 40 or 53 feet, wherein the...
US-9,565,787 Heat dissipation device loading mechanisms
The present description relates to the field of microelectronic assemblies, wherein a heat dissipation device may be incorporated into the microelectronic...
US-9,565,786 Sheet-like heat pipe, and electronic device provided with same
A sheet-like heat pipe for a heat-generating element, which is intended to make an electronic device more compact, more lightweight, and thinner, while also...
US-9,565,785 Fan securing device and fan assembly having the same
A fan securing device includes first and second holders. The first holder includes a first holding frame that has two holding slots located in opposite sides of...
US-9,565,784 Electronic device with fan for dissipating heat
An electronic device includes a shell, a thermal element, a controller and a fan. The shell defines a first air outlet and a second air outlet. The controller...
US-9,565,783 Modular data center
Modular data centers with modular components suitable for use with rack or shelf mount computing systems, for example, are disclosed. The modular center...
US-9,565,782 Field replaceable power supply cartridge
A field replaceable power supply cartridge is provided for coupling with a socket. The cartridge has a latch mechanism that can be actuated by the user to...
US-9,565,781 Holding apparatus that holds electronic apparatus
A holding apparatus includes a holding member that holds an electronic apparatus, a supporting member that is connected to the holding member and supports the...
US-9,565,780 Electronic circuit unit capable of external connection
Provided is an electronic circuit unit which includes a circuit board, a case for the circuit board and a connector for external connection and can be...
US-9,565,779 Display unit, electronic device and assembling method for electronic device
A display unit, an electronic device and an assembling method are provided. The electronic device includes a case and a display unit. The case includes a...
US-9,565,778 Display device
A display device is provided, including a display panel, a back frame, a circuit board and a cover film. The display panel includes a first substrate and a...
US-9,565,777 Security mesh and method of making
A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires...
US-9,565,776 Method for treating substrate that support catalyst particles for plating processing
The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in...
US-9,565,775 Wiring board, semiconductor device, and method of manufacturing wiring board
A wiring board includes a first insulating layer coating a first wiring layer. A first through hole is opened in a surface of the first insulating layer and...
US-9,565,774 Embedded trace substrate and method of forming the same
In one embodiment, a method for forming an embedded trace substrate includes forming a conductive layer on a carrier. A dielectric film is provided on the...
US-9,565,773 Methods for assembling electronic devices with adhesive
An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device...
US-9,565,772 Method of forming conductive trace
The present subject matter provides for a multi-layer conductive trace. The trace can be formed by digital printing the individual layers and firing. The...
US-9,565,771 LED-based UV radiation source machine to process coatings
A machine can include a conveyor that receives and conveys a circuit assembly treated with a UV curable coating material; a UV zone that includes LED-based UV...
US-9,565,770 Methods of making packages using thin Cu foil supported by carrier Cu foil
In an embodiment, there is provided a method of creating a package, the method comprising: providing an initial substrate, wherein the initial substrate...
US-9,565,769 LED linear lighting kit
An LED lighting kit comprises an extrusion (300), an LED strip (100), a tapered wedge (1500), and a mounting clip (1200). The extrusion itself may have a...
US-9,565,768 Semiconductor package with integrated output inductor on a printed circuit board
A semiconductor package includes a semiconductor die comprising a control transistor and a sync transistor, an integrated output inductor comprising a winding 1...
US-9,565,767 Wiring board formed by a laminate on a stiffener
There is provided a wiring board including a stiffener bonded to a circuit board, and a laminate formed by laminating a plurality of insulating layers and a...
US-9,565,766 Formation of DRAM capacitor among metal interconnect
Techniques are disclosed for integrating capacitors among the metal interconnect for embedded DRAM applications. In some embodiments, the technique uses a wet...
US-9,565,765 Printed circuit board
A printed circuit board is disclosed. Pins of a plurality of resistors on the PCB are connected to the same input line. At least two out of the resistors are...
US-9,565,764 Inductor and MMIC
An inductor includes a first coil, an input terminal electrically connected to an outermost portion of the first coil, a first insulating film on the first...
US-9,565,763 Printed circuit boards having supporting patterns and method of fabricating the same
A printed circuit board includes an inner layer having a supporting pattern and via pad patterns that are disposed to be spaced apart from each other in a...
US-9,565,762 Power delivery network in a printed circuit board structure
Aspects of the disclosure provide a printed circuit board (PCB) structure. The PCB structure includes a plurality of dielectric layers including an outer layer,...
US-9,565,761 Wiring board
In the wiring board of the present invention, the land pattern for power supply, connected to the semiconductor element connection pad for power supply through...
US-9,565,760 Wiring board and method of manufacturing the same
In a wiring board, on an insulating layer of an outermost layer, there are provided a plurality of strip-shaped wiring conductors which are partially provided...
US-9,565,759 Axiocentric scrubbing land grid array contacts and methods for fabrication
A contact structure and assembly for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier...
US-9,565,758 Alkali silicate glass based coating and method for applying
A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the...
US-9,565,757 Electronic component and manufacturing method therefor
The electronic component of this invention includes a multilayer ceramic substrate 14 composed of a plurality of ceramic layers 12. A wiring electrode 16 and a...
US-9,565,756 Wiring board and method for manufacturing the same
A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer, a second insulation layer formed on the first...
US-9,565,755 Electronic component
A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and...
US-9,565,754 Solder-mounted board, production method therefor, and semiconductor device
The present invention provides a solder-mounted board which realizes reliable mounting of a component thereon; a method for producing the board; and a...
US-9,565,753 Forming method of stretchable substrate, stretchable substrate and electronic device having stretchable substrate
There is provided a stretchable substrate including: a substrate having first Young's modulus and stretchability; and plurality of strain control patterns...
US-9,565,752 Wire bonded electronic devices to round wire
A disclosed circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, first and second cross wires attached to...
US-9,565,751 Suspension board with circuit
A suspension board with circuit includes a metal supporting board, a first insulating layer including a disposing portion formed at one side in a thickness...
US-9,565,750 Wiring board for mounting a semiconductor element
A wiring board including an insulating board formed such that an inner insulating layer is laminated under a front insulating layer, a pair of semiconductor...
US-9,565,749 Circuit obfuscation using differing dielectric constants
An obfuscated radio frequency circuit may be manufactured to include a metallization layer, and a dielectric layer under the metallization layer. The dielectric...
US-9,565,748 Nano-copper solder for filling thermal vias
A method of and device for forming vias on an electronic board (such as a PCB board) comprises forming one or more holes on the electronic board, placing a...
US-9,565,747 Asymmetric induction devices and systems and methods using them
Certain embodiments described herein are directed to devices, systems and methods that comprise asymmetric induction devices. In some instances, the device can...
US-9,565,746 Pairing method, lighting device, and lighting system
A pairing method for causing lighting devices to store identification information of a radio remote controller serving as a master device is provided. The...
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